• Electrical & Electronic Materials
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• v.5 no.3
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• pp.278-283
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• 1992

123 초전도체에 마그네틱 모멘트가 큰 Ni불순물을 도핑하여 제작한 $Y_{1}$ Ba(C $u_{2.9}$ $N_{0.1}$) $O_{7-{\delta}}$ 초전도체의 X-ray diffraction pattern, susceptibility, 온도변화등에 따른 전류-전압관계, 임계온도 등에 대하여 연구하였다. 제작된 시료는 매우 뚜렷한 orthorhombic 피크를 가진 123상을 나타내고 있었다. N=0.1의 시료에서는 적은 양의 Ni 불순물과 단면적인 무정형상태의 잘 반응된 YBa(Cu, Ni)$_{3}$ $O_{7-{\delta}}$의 orthorhombic구조를 나타내고 있다. 전반적인 실험 결과로 부터 Ni는 Y-Ba-Cu-O 초전도 시스템에서 초전도에 중요한 역할을 담당하지 않는다는 결론을 얻었다.얻었다.다.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.1485-1487
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• 2000

A variety of target configurations in sputtering process have been proposed to deposit various structures of thin film alloys and compound films. In this study, we presented the comparative experimental results regarding to the characterization of properties of Cu-Ni thin films deposited by using a magnetron co-sputtering method, as a function of target configurations; one is using a single target with varying the area of Ni chips attached on the Cu target and another is using a dual-type target with two targets of Ni and Cu separated each other. Structural(d-spacing, crystal orientation, crystallite size, cross-sectional morphology) and electrical(resistivity) properties of deposited films are characterized and compared as a function of target configurations as well as deposition conditions.

• Journal of the Korean Chemical Society
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• v.23 no.1
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• pp.1-6
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• 1979

The dipole moments for square planar and tetrahedral $[M(II)N_2S_2]$ type complexes are calculated, using the expansion method for spherical harmonics [M(II) = Co(II), Ni(II), Cu(II) or Zn(II)]. The calculated values of the dipole moments for these complexes are in the range of the experimental values. The possible structures for these complexes in benzene solution are discussed on the basis of the calculated dipole moments and the the magnetic properties.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.137-138
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• 2011

구리 이온은 -0.40V (vs. SCE)에서 전기화학적 환원이 일어나는 반면, 니켈 이온은 -1.19V (vs. SCE)에서 전착이 발생한다. 따라서, 단일 도금욕조 내에서 Ni-Cu 합금도금층을 제조하기 위해서는 두 금속 이온종 간의 전위차를 줄여주어야 하는데, 이를 위해 본 연구에서는 $Na_3C_6H_5O_7{\cdot}2H_2O$를 착화제로 사용하였다. 다양한 Ni-Cu 합금 도금층의 조성을 얻기 위하여 기본 도금욕 내 황산니켈과 황산구리의 비율을 10:1로 설정하였다. 도금 공정 조건에 따른 합금 도금층 조성 변화를 관찰하기 위하여 도금액 pH와 교반 속도에 따른 도금층 조성 변화를 분석하였으며, 도금액의 UV-VIS과 도금층의 XRD 와 SEM 측정을 통하여 도금욕과 도금층 간의 상관 관계를 유추하였다. 본 도금액에 사용된 $Na_3C_6H_5O_7{\cdot}2H_2O$ 착화제의 효과는 pH3에서 가장 현저하였으며, pH 변화 및 교반 속도 변화를 이용하여 다양한 합금 조성을 얻을 수 있었다.

• Bulletin of the Korean Chemical Society
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• v.17 no.7
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• pp.612-616
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• 1996

The new 1,2-dithiolene, 1,4-butanediyldithioethylene-1,2-dithiolate (BDDT2-), has been isolated. In addition, new monoanionic bis-complexes with nickel and copper have been prepared and characterized. In order to investigate the detailed electronic structure of the metal complexes of the new ligand, BDDT2-, in terms of the oxidation state of the central metal ions, we have carried out molecular orbital (MO) calculations of Ni(BDDT)2-and Cu(BDDT)2- utilizing an Extended Huckel method. Cyclic voltammetry data for both complexes were obtained with a potentiostat. We have also compared these results to the previously synthesized Ni(PDDT)2-, Ni(DDDT)2-,Cu(PDDT)2-, and Cu(DDDT)2-.

• Korean Journal of Metals and Materials
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• v.47 no.3
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• pp.202-208
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• 2009

The effects of aging time on the microstructure and shear strength of the Low Temperature Co-fired Ceramic (LTCC)/Ag pad/Electroless Nickel Immersion Gold (ENIG)/BGA solder joints were investigated through isothermal aging at $150^{\circ}C$ for 1000 h with conventional Sn-37Pb and Sn-3Ag-0.5Cu. $Ni_3Sn_4$ intermetallic compound (IMC) layers was formed at the interface between Sn-37Pb solder and LTCC substrate as-reflowed state, while $(Ni,Cu)_3Sn_4$ IMC layer was formed between Sn-3Ag-0.5Cu solder and LTCC substrate. Additional $(Cu,Ni)_6Sn_5$ layer was found at the interface between the $(Ni,Cu)_3Sn_4$ layer and Sn-3Ag-0.5Cu solder after aging at $150^{\circ}C$ for 500 h. Thickness of the IMC layers increased and coarsened with increasing aging time. Shear strength of both solder joints increased with increasing aging time. Failure mode of BGA solder joints with LTCC substrate after shear testing revealed that shear strength of the joints depended on the adhesion between Ag metallization and LTCC. Fracture mechanism of Sn-37Pb solder joint was a mixture of ductile and pad lift, while that of Sn-3Ag-0.5Cu solder joint was a mixture of ductile and brittle $(Ni,Cu)_3Sn_4$ IMC fracture morphology. Failure mechanisms of LTCC/Ag pad/ENIG/BGA solder joints were also interpreted by finite element analyses.

• Journal of the Korean Ceramic Society
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• v.33 no.12
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• pp.1421-1425
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• 1996

Sintered Si3N4 and Inconel composed of Ni(58-63%) Cr(21-25%) Al(1-17%) Mn(<1%) fe(balance) were pressurelessly joined by using Ag-Cu-Ti brazing filler metal at 950℃ and 1200℃ under N2 gas atmosphere of 1atm and their interfacial structures were investigated. In case that the reaction temperature was low as 950℃ its interfacial structure was "Inconel metal/Ti-rich phase layer/brazing filler metal layer/Si3N4 " Ti used as reactive metal existed in between inconel steel and brazing metal and moved to the interface of between brazing filler metal nd Si3N4 according as reaction temperature increased up to 1200℃. The interfacial structure of inconel steel-Si3N4 reacted at 1200℃ was ' inconel metal/Ni-rich phase layer containing of Fe. Cr and Si/Cu-rich phase layer containing of Mn and Si/Si3N4 " Cr Mn, Ni and Fe diffused to the interface of between brazing filler metal and Si3N4 and reacted with Si3N4 The most reactive components of ingredients of inconel metal were Cr and Mn. On the other hand Ti added as reactive components to Ag-Cu eutectic segregated into Ni-rich phase layer,.

• Advances in materials Research
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• v.2 no.4
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• pp.221-235
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• 2013

To obtain bronze with good mechanical properties and high wear resistance, a new bronze (CADZ) is proposed on the basis of various fundamental information. The CADZ consists of the elements Al10.5, Fe4.2, Sn3.7 and Ni3.1, and its design is based on Cu-Al10.5 alloy. The Cu-10.5%Al is very hard and brittle. To obtain the high material ductility of the Cu-10.5%Al alloy, an attempt was made to add a few percent of Sn. Moreover, to make high strength of the Cu alloy, microstructure with small grains was created by the proper amount of Fe and Ni (Fe/Ni = 0.89). The mechanical properties of the CADZ sample have been examined experimentally, and those were compared with commercial bronzes. The tensile strength and wear resistance of CADZ are higher than those for commercial bronzes. Although the ductility of CADZ is the lower level, the strain to failure of CADZ is about 2.0~5.0% higher than that for the Cu-Al10.5 alloy. Details of the microstructural effects on the mechanical properties in the CADZ sample were further discussed using various experimental results.

• Proceedings of the Korean Magnestics Society Conference
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• 1997.05a
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• pp.98-99
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• 1997

• Proceedings of the Korean Magnestics Society Conference
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• 1997.05a
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• pp.76-77
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• 1997