• Journal of Powder Materials
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• v.17 no.1
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• pp.36-43
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• 2010

In present work, amorphous TiCuNi powders were fabricated by mechanical alloying process. Amorphization and crystallization behaviors of the TiCuNi powders during high-energy ball milling and subsequent microstructure changes were studied by X-ray diffraction and transmission electron microscope. TEM samples were prepared by the focused ion beam technique. The morphology of powders prepared with different milling times was observed by field-emission scanning electron microscope and optical microscope. The powders developed a fine, layered, homogeneous structure with milling times. The crystallization behavior showed that glass transition, $T_g$, onset crystallization, $T_x$, and super cooled liquid range ${\Delta}T=T_x-T_g$ were 628, 755 and 127K, respectively. The as-prepared amorphous TiCuNi powders were consolidated by spark plasma sintering process. Full densified TiCuNi samples were successfully produced by the spark plasma sintering process. Crystallization of the MA powders happened during sintering at 733K.

• Korean Journal of Metals and Materials
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• v.48 no.8
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• pp.749-756
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• 2010

Low carbon steels were oxidized isothermally at 1050 and $1180^{\circ}C$ for 4 hr in air in order to determine the effect of alloying elements Si, S, Cu, Sn, and Ni on oxidation. For oxidation resistance of low carbon steels, the beneficial elements were Si, Cu, and Ni, whereas the harmful elements were S and Sn. The most active alloying element, Si, was scattered inside the oxide scale, at the scale-alloy interface, and as an internal oxide precipitate. The relatively noble elements such as Cu and Ni tended to weakly segregate at the scale-alloy interface. Sulfur and Sn were weakly, uniformly distributed inside the oxide scale. Excessively thick, non-adherent scales containing interconnected pores formed at $1180^{\circ}C$.

• Journal of the Korean Magnetics Society
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• v.5 no.6
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• pp.947-951
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• 1995

The electromagnetic interference is prevented by the high magnetic loss of the ferrite. The absorbing property of electromagnetic wave could be improved by the ferrite that has a finer and more uniform microstructure. The thermal decomposition of organic acid salt provided the uniform composition and fine powder. The absorbing properties of electromagnetic wave were evaluated by the relative complex permeability, permittivity, and the attenuation which is calculated from the results of network analyzer. The permeability and permittivity were increased with increase of the density and with decrease of the grain size. The matching thickness could be reduced with increasing sintered temperature. The attenuation of the Cu-Ni-Zn ferrite showed over 20dB when the matching thickness and the matching frequency range were 6.75mm and from 160MHz to 640MHz, respectively.

• Bulletin of the Korean Chemical Society
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• v.20 no.3
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• pp.291-296
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• 1999

The immobilization of APTMS(3-(2-aminoethylamino)propyltrimethoxysilane) and AAPTMS(3-(2-(2-aminoethyl)aminoethylanino)propyltrimethoxysilane) on the surface of high quality mesoporous molecular sieves MCM-41 and MCM-48 have been confirmed by F.T.-IR spectroscopy, Raman spectroscopy, 29Si solid state NMR, and a surface polarity measurement using Reichardt's dye. The formation of metal (Co(Ⅱ), Ni(Ⅱ), and Cu(Ⅱ)) complexes by immobilized aminosilanes have been investigated by photoacoustic spectroscopy(PAS). The assignment of UV-Vis. PAS bands makes it possible to identify the structure of metal complexes within mesoporous molecular sieves. Co(Ⅱ) ion may be coordinated mainly in a tetrahedral symmetry by two APTMS onto MCM-41, and in an octahedral one by two AAPTMS. Both Ni(Ⅱ) and Cu(Ⅱ) coordinated by aminosilanes within MCM-41 form possibly the octahedral complexes such as [Ni(APTMS)2(H20)2]2+, [Ni(AAPTMS)2]2+, [Cu(APTMS)2(H2O)2]2+, and [Cu(AAPTMS)(H2O)3]2+, respectively. The PAS band shapes of complexes onto MCM-48 are similar to those of corresponding MCM-41 with the variation of PAS intensity. Most of metal ion(Ⅱ) within MCM-41 and MCM-48 are coordinated by aminosilanes without the impregnation on the surface.

• Journal of Welding and Joining
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• v.5 no.4
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• pp.47-53
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• 1987

The purpose of this study is to reexamine our test method in the light ofstatistical methods for data interpretation. Our trial to apply Plackett-Burman statistical model in multifactorial welding experiments shows that is saves much time and cost and extracts very accurate results. In this study, the parametric effects of bead shape on pulse MIG process in Cu-Ni alloy are investigated for verifying our trial.

• Journal of Magnetics
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• v.1 no.1
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• pp.37-41
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• 1996

The frequency dependence of complex permeability for various NiCuZn ferrites was investigated. The variation of complex permeability for NiCuZn ferrites can be presented as a form of a semi-circle, so called the Cole-Cole plot, and the relaxation phenomena were explained with various shapes of the plots. The relaxation time $\Upsilon$ was calculated from $f_rx$, which is a relaxation frequency at ${\mu"}_{max}$. Relations between anisotropy field $H_A$ and relaxation time $\Upsilon$, initial permeability $\mu_i$ and $H_A$ were plotted to identify the frequency dependence of complex permeability.lity.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.07a
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• pp.95-99
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• 2001

Cu is considered as a promising alternative interconnection material to Al-based interconnection materials in Si-based integrated circuits due to its low resistivity and superior resistance to the electromigration. New humping and UBM material systems for solder flip chip interconnection of Cu pads were investigated using electroless-plated copper (E-Cu) and electroless-plated nickel (E-Ni) plating methods as low cost alternatives. Optimally designed E-Ni/E-Cu UBM bilayer material system can be used not only as UBMs for solder bumps but also as bump itself. Electroless-plated E-Ni/E-Cu bumps assembled using anisotropic conductive adhesives on an organic substrate is successfully demonstrated and characterized in this study

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.216-216
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• 2009

$(Ni_{1-x-y}Zn_xCu_y)Fe_2O_4(x=0.45,\;0{\leq}y{\leq}0.3)$ was synthesized by conventional ceramic processing, and the sintering behavior and the magnetic properties of which were studied as functions of CuO content and sintering temperature. Both the densification and the grain growth rates were significantly enhanced with the increase of CuO content, while abnormal grain growth occurred when the samples of $y{\geq}0.2$ were sintered above $950^{\circ}C$. Saturation magnetization and coercive field were mainly influenced by the densification and grain growth of the specimens, respectively.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.94-98
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• 2003

The microstructure of Sn1.8Bi0.8Cu0.6In alloys was evaluated at various aging time. The bumps of Sn1.8Bi0.8Cu0.6In alloys after reflowed at $250^{\circ}C$ were well-formed and had 260um height. The craters on the bumps, however, were observed. Intermetallic compounds formed on the interface between so]der and Cu/Ni UBM were consist of $(Cu,Ni)_6Sn_5$. As aging goes on up to 1000hours, the composition of Ni changed from $6.63\%$ at initial stage(as-reflowed) to $13.47\%$ at final stage(1000hours aging ). In addition, after 500hours aging, the floating of IMC to the solder was observed.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.99-102
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• 2003

Reactions between 48Sn-52In solder and under bump metallurgies(UBM) such as 100nm $Ti/8{\mu}m$ Cu and 300nm Al/400nm Ni(V)/400nm Cu have been investigated, and the shear strength of 48Sn-52In solder bumps on each UBM has been evaluated. While intermetallic compounds with two different morphologies were continuously thickened on Ti/Cu with repeating the reflow process, the intermetallics on Al/Ni(V)/Cu spalled into the solder with increasing the number of reflow times. The solder bumps on Ti/Cu exhibited higher shear strength than those on Al/Ni(V)/Cu.