• Journal of Energy Engineering
• /
• v.8 no.2
• /
• pp.256-264
• /
• 1999

The performance of the Pt-B/cordierite catalysts (2 wt%) Pt, 70 wt% Alumina, 28 wt%) Ceria and Zirconia, B: base metal) loaded with 6∼12 wt% Mn, Cu, V, Co, Cr and Ba, respectively was studied for partial oxidation of methane reaction and compared with that of Ni loaded catalyst. As a results, it was found that Ba, Co, Cr as well as Ni loaded catalysts showed higher activity for methane partial oxidation of methane than the Mn, Cu and V loaded catalyst. But it was known that catalysts having good activity for methane showed the good activity for coke formation, too. A XRD analysis of the catalyst before and after the reaction using 5 wt% Ni/Al$_2$O$_3$) showed that there were three Ni phases. In these results, it was found that methane oxidation reaction occulted at the front of the catalyst bed consisted of NiAl$_2$O$_4$and NiO and reforming reaction occurred at the rear part of the catalyst bed consisted of reduced Ni.

• Journal of Korean Society of Water and Wastewater
• /
• v.28 no.2
• /
• pp.207-215
• /
• 2014

Wastewater containing heavy metals such as copper (Cu) and nickel (Ni) is harmful to humans and the environment due to its high toxicity. Crystallization in a fluidized bed reactor (FBR) has recently received significant attention for heavy metal removal and recovery. It is necessary to find optimum reaction conditions to enhance crystallization efficacy. In this study, the effects of crystallization reagent and pH were investigated to maximize crystallization efficacy of Cu-S and Ni-S in a FBR. CaS and $Na_2S{\cdot}9H_2O$ were used as crystallization reagent, and pH were varied in the range of 1 to 7. Additionally, each optimum crystallization condition for Cu and Ni were sequentially employed in two FBRs for their selective removal from the mixture of Cu and Ni. As major results, the crystallization of Cu was most effective in the range of pH 1-2 for both CaS and $Na_2S{\cdot}9H_2O$ reagents. At pH 1, Cu was completely removed within five minutes. Ni showed a superior reactivity with S in $Na_2S{\cdot}9H_2O$ compared to that in CaS at pH 7. When applying each optimum crystallization condition sequentially, only Cu was firstly crystallized at pH 1 with CaS, and then, in the second FBR, the residual Ni was completely removed at pH 7 with $Na_2S{\cdot}9H_2O$. Each crystal recovered from two different FBRs was mainly composed of CuxSy and NiS, respectively. Our results revealed that Cu and Ni can be selectively recovered as reusable resources from the mixture by controlling pH and choosing crystallization reagent accordingly.

• Korean Journal of Environmental Biology
• /
• v.22 no.1
• /
• pp.120-126
• /
• 2004

Kenaf plants were hydroponically grown in reactor containing toxic metals as Cd, Cu, Cr, Ni and Zn to examine the ability to take up heavy metal. The plants were fertilized using a nutrient solution, which was appropriately adjusted to optimum pH, DO and conductivity. For n hydraulic retention time of 8 days, Cr, Cd, Cu, Ni and Zn were removed up to 90.5, 80.5, 66.1%, 71.1% and 79.4%, and reduced from 2.34 to 0.54 mg $L^{-1}$, 3.37 to 1.07 mg $L^{-1}$, 4.92 to 3.19 mg $L^{-1}$, 6.31 to 4.41 mg $L^{-1}$ and 6.27 to 2.09 mg $L^{-1}$. Especially, accumulation rate of Cr, Cd, Cu, Ni and Zn in the plant were measured up to 347.32, 275.39, 157.52, 50.48 and 211.01 mg DW kg $L^{-1}d^{-1}$, respectively. We considered that Kenaf plants removed Cr, Cd and Zn more effectively than other toxic metals applied.

• Korean Journal of Materials Research
• /
• v.8 no.3
• /
• pp.206-213
• /
• 1998

Cu, Ni, and Mo were ion-diffused into the pure steel powder in the aqueous solution of $(CuNO_3)_2$, $Ni(NO_3)_2)_2$, and $(NH_4)_6Mo_7O_{24}$, to form partial diffusion bond prealloyed steel powder. The mechanical properties, and compacting and sintering characteristics were investigated as a function of Cu. Ni and Mo contents. The results of the this research, it was found that the smallest change of size was observed, and the good degree of hardness and tensile strength was observed when 1.50wt%Cu, 1.75wt%Ni and 0.50wt%Mo was added each other. The powder metallurgy characteristics of partial diffusion bond prealloyed steel powder containing 1.50wt% of Cu, 1.75wt% of Ni and 0.5wt% of Mo were compared to those of distalloy $AB\textregistered$ which was manufactured in Hogani Corporation of Sweden. Partial diffusion bond prealloyed steel powder of this study had good degree of hardness and density, and its dimensional stability was same to that of pure steel powder. Under the same sintering density and temperature, the tensile strength of the ion powder from this research was $15~20Kg/\textrm{mm}^2$ larger than that of distalloy AB'. also the hardness was larger in the magnitude of Hv20-30. When the powder metallurgy heat-treated, hardness and tensile strength were substantially increased.

• Journal of the Korean Magnetics Society
• /
• v.24 no.2
• /
• pp.46-50
• /
• 2014

The crystallographic properties and cationic distribution of $M_{0.2}Fe_{2.8}O_4$ (M =Mn, Ni, Cu) and $Fe_3O_4$ thin films prepared by sol-gel method have been investigated by X-ray diffraction (XRD) and conversion electron M$\ddot{o}$ssbauer spectroscopy (CEMS). The ionic valence, preferred site, and hyperfine field of Fe ions of the ferrites could be obtained by analyzing the CEMS spectra. The $M_{0.2}Fe_{2.8}O_4$ films were found to maintain cubic spinel structure as in $Fe_3O_4$ with the lattice constant slightly decreased for Ni substitution and increased for Mn and Cu substitution from that of $Fe_3O_4$. Analyses on the CEMS data indicate that $Mn^{2+}$ and $Ni^{2+}$ ions substitute octahedral $Fe^{2+}$ sites mostly, while $Cu^{2+}$ ions substitute both the octahedral and tetrahedral sites. The observed intensity ratio $A_B/A_A$ of the CEMS subspectra of the samples exhibited difference from the theoretical value. It is interpreted as due to the effect of the M substitution for A and B on the Debye temperature of the site. The relative line-broadening of the B-site CEMS subspectra can be explained by the dispersion of magnetic hyperfine fields due to random distribution of M cations in the B sites.

• Journal of Soil and Groundwater Environment
• /
• v.14 no.3
• /
• pp.32-39
• /
• 2009

This study was conducted in order to get the scientific background for soil pollution criteria. The 92 soil samples derived from various geological units were taken and analyzed to survey natural heavy metal background levels using aqua regia digestion method and 0.1N HCl extraction method. From these results, the average natural contents of metals were 0.287 mg/kg for Cd, 15.26 mg/kg for Cu, 18.43 mg/kg for Pb, 25.36 mg/kg for Cr, 54.27 mg/kg for Zn, 17.68 mg/kg for Ni, 6.83 mg/kg for As by the aqua regia method, and 0.040 mg/kg for Cd, 0.48 mg/kg for Cu, 3.06 mg/kg for Pb, 0.09 mg/kg for Cr, 1.54 mg/kg for Zn, 0.27 mg/kg for Ni, 0.089 mg/kg for As by the 0.1N HCl extraction method. Ratios of soluble contents and total contents were Cd 0.14, Cu 0.03, Pb 0.17, Cr 0.004, Zn 0.03, Ni 0.02, As 0.013 and the correlation coefficients of soluble contents and total contents were 0.24(As), 0.88(Cd), 0.43(Cr), 0.65(Cu), 0.70(Pb), 0.61(Ni), 0.24(Zn). The correlation factor decreased in the order of Cd > Pb > Cu > Ni > Cr > Zn $\approx$ As.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2018.06a
• /
• pp.81-81
• /
• 2018

Bi-Te계 열전소자는 상온에서의 열전 효율이 우수하기 때문에 항공, 컴퓨터 등의 열전발전 또는 열전냉각 모듈에 널리 사용된다. 이 열전소자를 활용한 열전모듈은 다수의 n형 및 p형 열전소자가 세라믹 위에 형성된 Cu 전극에 전기적으로 직렬이 되도록 서로 솔더링 접합이 되어 있는 구조를 가지고 있다. 이처럼 직렬 연결된 방식에서는 높은 접합강도를 필요로 한다. 열전모듈 제작 시 Bi-Te 계 소자를 바로 Cu 기판에 접합시키면 솔더에 들어있는 Sn과 기판의 Cu가 접합하는 과정에서 소재 내로 확산하여 접합강도를 저하시킨다. 이러한 열전모듈의 접합강도 저하를 막기 위해 무전해 Ni-W-P 도금층을 확산 방지층으로 적용하였다. 본 연구에서는 Ni-W-P 도금이 Bi-Te 계 열전 모듈의 접합강도에 미치는 영향을 조사하였다. 본 연구에서는 Bi-Te계 열전소자에 양호한 밀착성을 가지는 Ni-W-P 도금층을 형성시키기 위해서 알루미나 분말을 이용한 sand-blasting 방법을 사용하여 Bi-Te 소재 표면에 분사하는 방법으로 표면을 거칠게 하였다. 그 후 무전해 Ni-W-P 도금을 $85^{\circ}C$에서 20분간 실시하여 약 4um의 Ni-W-P 도금층을 형성시켰다. 열전 모듈은 Sn-Ag-Cu 솔더를 사용하여 제작하였으며 접합강도는 Bonding tester를 사용하여 측정하였다. 제작한 열전 모듈의 단면 및 파단면 관찰을 통하여 접합강도가 변하는 요인을 조사하였다. 제작한 열전 모듈의 단면을 FE-EPMA로 관찰한 결과 Ni-W-P 도금층이 Bi-Te 소자와 Sn과 Cu사이의 확산을 방지하는 확산방지층 역할을 하는 것을 관찰할 수 있었다. 또한 열처리 전 열전모듈과 200도, 150시간 열처리 후 접합강도를 각각 측정해 본 결과, 열처리 후의 접합강도가 상승하는 것을 확인 할 수 있었다. 따라서 Bi-Te계 열전모듈 제작에 무전해 Ni-W-P 도금층을 형성시키므로 인해 확산방지층의 생성과 접합강도의 상승에 도움을 주었다.

• Journal of the Korean Ceramic Society
• /
• v.52 no.4
• /
• pp.264-268
• /
• 2015

Cu films were plated in an eco-friendly electroless bath (No-Formaldehyde) on Ni/screen printed Ag pattern/PET substrate. For electroless Cu plating, we used sodium-phosphinate ($NaH_2PO_2{\cdot}H_2O$) as reducing agent instead of Formaldehyde. All processes were carried out in electroless solution of pH 7 to minimize damage to the PET substrate. According to the increase of sodium-phosphinate, the deposition rate, the granule size, and rms roughness of the electroless Cu film increased and the Ni content also increased. The electroless Cu films plated using 0.280 M and 0.575 M solutions of sodium-phosphinate were made with Cu of 94 at.% and 82 at.%, respectively, with Ni and a small amount P. All electroless Cu plated films had typical FCC crystal structures, although the amount of co-deposited Ni changed according to the variation of the sodium-phosphinate contents. From these results, we concluded that a formation of higher purity Cu film without surface damage to the PET is possible by use of sodium-phosphinate at pH 7.

• Journal of the Korean Magnetics Society
• /
• v.13 no.1
• /
• pp.15-20
• /
• 2003

Diffusion speed of Cu metal fine particle is fast better than CuO, so it will promote grain growth in sintering. In this paper, the influence on substituting Cu fine particle for CuO of NiCuZn ferrite with basic composition (N $i_{0.204}$C $u_{0.204}$Z $n_{0.612}$ $O_{1.02}$)F $e_{1.98}$ $O_{2.98}$ has been investigated with varying Cu/CuO ratio. The perfect spinel structure of sintered specimen at 90$0^{\circ}C$ was confirmed by the analysis of XRD patterns. The best condition was obtained when the ratio of Cu/CuO was 60%, and the permeability was 1100 and Ms was 87 emu/g in this condition. Cu has influenced on grain growth in sintering, substituting Cu fine particle for CuO could lower sintering temperature over the 3$0^{\circ}C$. After sintering, substituting Cu performed as good as CuO.s CuO.s CuO.

• Journal of the Microelectronics and Packaging Society
• /
• v.11 no.3 s.32
• /
• pp.1-7
• /
• 2004

Tin plating on component finishes may grow whiskers under certain conditions, which may cause failures in electronics equipment. To protect the environment, 'lead-free' among component finishes is being promoted worldwide. This paper presents the evaluation results of whiskers on two kinds of lead-free plating materials at the plating temperature and under the reliability test. The rising plating temperature caused increasing the size of plating grain and shorting the growth of whisker. The whisker was grown under the temperature cycling the bent type in matt Sn plating and striated type in malt Sn-Bi. The whisker growth in Sn-Bi plating was shorter than that in Sn plating. In FeNi42 leadframe, the $7.0{\~}10.0{\mu}m$ diameter and the $25.0{\~}45.0{\mu}m$ long whisker was grown under 300 cycles. In the 300 cycles of Cu leadframe, only the nodule(nuclear state) grew on the surface, and in the 600 cycles, a $3.0{\~}4.0{\mu}m$ short whisker grew. After 600 cycles, the ${\~}0.34{\mu}m$ thin $Ni_3Sn_4$ formed on the Sn-plated FeNi42. However, we observed the amount of $0.76{\~}1.14{\mu}m$ thick $Cu_6Sn_5$ and ${\~}0.27{\mu}m$ thin $Cu_3Sn$ intermetallics were observed between the Sn and Cu interfaces. Therefore, the main growth factor of a whisker is the intermetallic compound in the Cu leadframe, and the coefficient of thermal expansion mismatch in FeNi42.