• Journal of Electrochemical Science and Technology
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• v.12 no.2
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• pp.188-203
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• 2021

The specific benefits of the modified films formed on preliminary anodized aluminum, including the versatility of their potential applications impose the need for evaluation of the exploitation reliability of these films. In this aspect, the durability of Cu and Ni modified anodized aluminum oxide (AAO) films on the low-doped AA1050 alloy was assessed through extended exposure to a 3.5% NaCl model corrosive medium. The electrochemical measurements by means of electrochemical impedance spectroscopy (EIS) and potentiodynamic scanning (PDS) after 24 and 720 hours of exposure have revealed that the obtained films do not change their obvious barrier properties. In addition, supplemental analyses of the coatings were performed, in order to elucidate the impact of the AC-deposition of Cu and Ni inside the pores. The scanning electron microscopy (SEM) images have shown that the surface topology is not affected and resembles the typical surface of an etched metal. The subsequent energy dispersive X-ray spectroscopy (EDX) tests have revealed a predominance of Cu in the combined AAO-Cu/Ni layers, whereas additional X-ray photoelectron (XPS) analyses showed that both metals form oxides with different oxidation states due to alterations in the deposition conditions, promoted by the application of AC-polarization of the samples.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1544-1546
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• 1996

Thin films of Cu-Ni alloys of various compositions were prepared by RF sputtering onto glass and stainless steel substrates. The effect of composition, substrate temperature, Ar partial pressure, aging time on the electrical properties of Cu-Ni film strain gages in the thickness range $500{\sim}2000{\AA}$ was studied. The maximum resistivity is obtained from 53wt%Cu-47wt%Ni films, while their TCR becomes minimum. This tendency is very desirable for thin film strain gages.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.05b
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• pp.54-56
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• 2005

Fabrication of c-axis oriented $(Hg_{0.75}Rc_{0.25})Ba_2Ca_2Cu_3O_y$ thick fabricated has been attempted using Ni substrates with the buffer layer of Cr or NiO. Coexistence of $(Hg_{0.75}Rc_{0.25})Ba_2Ca_3Cu_4O_y$ pellets wad found to stabilize $(Hg_{0.75}Rc_{0.25})Ba_2Ca_2Cu_3O_y$ phase of the tape. The c-axis oriented tapes were reproducibly obtained on the NiO/Ni substerate and they recorded high $B_{irr}$ at 77K.$(Hg_{0.75}Rc_{0.25})Ba_2Ca_2Cu_3O_y$ 1223.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.2
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• pp.97-101
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• 2003

New Pt/Ti and hi/Ti double-metal structures have been investigated for the application of a diffusion barrier between Cu and Si in deep submicron integrated circuits. Pt/Ti and Ni/Ti were deposited using E-beam evaporator at room temperature. The performance of Pt/Ti and Ni/Ti structures as diffusion barrier against Cu diffusion was examined by charge pumping method, gate leakage current, junction leakage current, and SIMS(secondary ion mass spectroscopy). These evaluation indicated that Pt/Ti(200${\AA}$/100${\AA}$) film is a good barrier against Cu diffusion up to 450$^{\circ}C$.

• Korean Journal of Metals and Materials
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• v.46 no.1
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• pp.33-38
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• 2008

The interfacial reactions and shear strength of pure Sn solder bump were investigated with different under bump metallizations (UBMs) and reflow numbers. Two different UBMs were employed in this study: Cu and Ni. Cu6Sn5 and Cu3Sn intermetallic compounds (IMCs) were formed at the bump/Cu UBM interface, whereas only a Ni3Sn4 IMC was formed at the bump/Ni UBM interface. These IMCs grew with increasing reflow number. The growth of the Cu-Sn IMCs was faster than that of the Ni-Sn IMC. These interfacial reactions greatly affected the shear properties of the bumps.

• Economic and Environmental Geology
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• v.38 no.3 s.172
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• pp.221-236
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• 2005

In order to investigate the contamination levels and dispersion patterns of heavy metals such as Cd, Co, Cr, Cu, Fe, Mn, Ni, Pb and Zn by urbanization, soils beneath roadside-trees and leaves of Ginkgo biloba were collected from Seoul area during October to November in 2001. All tree leaves were grouped into washed and unwashed ones. The pH of most soil ranges from 6 to 9 indicating a weak acidic and alkaline. The element couples of Cd-Co, Cr-Ni and Zn-Cu-Pb have good correlation in soils, and contamination sources of Cd-Co, Cr-Ni and Zn-Cu-Pb could be similar. High correlation coefficients among Pb, Cu and Zn in G. biloba indicates that these elements show the similar behavior during the metabolism processes. From the results of pollution index calculation for soils, industrialized and heavy traffic area were severly polluted by heavy metals such as Cd, Cu, Pb and Zn. By the discriminant analysis, industrialized and heavy traffic areas are enriched in the order of Ni> Cr> Pb. Cadmium is useful to discriminate between industrialized and heavy traffic areas, Co and Pb are highly enhanced in heavy traffic area.

• Journal of the Korean Magnetics Society
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• v.15 no.5
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• pp.265-269
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• 2005

Exchange bias effect of a various layered thin films were studied by FMR measurment. In plane angular dependence of a resonance field distribution which measured by FMR was analysed as a combined effect of an unidirectional anisotropy and an uniaxial anisotropy. Exchange biased NiFe/IrMn, IrMn/NiFe/IrMn, and NiFe/IrMn/CoFe thin films showed larger unidirectional anisotropy field and uniaxial anisotropy field with compared to that of an unbiased NiFe single thin film. In case of NiFe/Cu/IrMn, the film with thick Cu layer exhibited a similar trend to the unbiased NiFe thin film. NiFe/IrMn/CoFe thin film showed two resonance field distribution due to different ferromagnetic layers. In additon to the resonance field, the line width was also analysed with related to exchange bias effect.

• Korean Journal of Materials Research
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• v.4 no.8
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• pp.877-887
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• 1994

Cu-Ni-Si-P alloys have been studied in order to develop connector material which has a favorable combination of strength, electrical conductivity, elastic limit, thermal softening resistence and bend formability. Three kinds of trial alloys with various nickel and silicon content were melted and cast, hot rolled at about $900^{\circ}C$ and cold rolled. Mechanical properties and electrical conductivities of these alloys annealed at $450^{\circ}C$, $500^{\circ}C$ and $550^{\circ}C$ were investigated. An alloy with the composition of Cu-2.7%Ni-0.53%Si-O.O29%P, which shows a favorable combination of high strength and high electrical conductivity, has been developed. Various characteristics of the alloy 1 connector material were evaluated and compared with phospher bronze(C521OR-H) and brass(C26OOR-EH) connector material.

• Proceedings of the Korean Magnestics Society Conference
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• 1993.11a
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• pp.110-111
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• 1993

• Proceedings of the KWS Conference
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• 1999.10a
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• pp.220-224
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• 1999