Korean Journal of Metals and Materials (대한금속재료학회지)

The Korean Institute of Metals and Materials (대한금속재료학회)
권호 표지

Effect of Under Bump Metallization (UBM) on Interfacial Reaction and Shear Strength of Electroplated Pure Tin Solder Bump

전해 도금된 주석 솔더 범프의 계면 반응과 전단 강도에 미치는 UBM의 효과

  • Kim, Yu-Na (School of Advanced Materials Science & Engineering, Sungkyunkwan University) ;
  • Koo, Ja-Myeong (School of Advanced Materials Science & Engineering, Sungkyunkwan University) ;
  • Park, Sun-Kyu (School of Civil and Environmental Engineering, Sungkyunkwan University) ;
  • Jung, Seung-Boo (School of Advanced Materials Science & Engineering, Sungkyunkwan University)
  • 김유나 (성균관대학교 신소재공학부) ;
  • 구자명 (성균관대학교 신소재공학부) ;
  • 박선규 (성균관대학교 사회환경시스템공학과) ;
  • 정승부 (성균관대학교 신소재공학부)
  • Received : 2007.10.09
  • Published : 2008.01.22
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Abstract

The interfacial reactions and shear strength of pure Sn solder bump were investigated with different under bump metallizations (UBMs) and reflow numbers. Two different UBMs were employed in this study: Cu and Ni. Cu6Sn5 and Cu3Sn intermetallic compounds (IMCs) were formed at the bump/Cu UBM interface, whereas only a Ni3Sn4 IMC was formed at the bump/Ni UBM interface. These IMCs grew with increasing reflow number. The growth of the Cu-Sn IMCs was faster than that of the Ni-Sn IMC. These interfacial reactions greatly affected the shear properties of the bumps.

Keywords

Acknowledgement

Supported by : 산업자원부

References

  1. 1. W. Jang, B. W. Lee, D. W. Kim, J. H. Jeong, J. W. Nah, K. W. Paik and D. Kwon, J. Kor. Inst. Met. & Mater. 40, 995 (2002).
  2. S. M. Hong, C. S. Kang and J. P. Jung, J. Kor. Inst. Met. & Mater. 40, 1097 (2002).
  3. C. Y. Lee, Y. H. Kim and C. S. Kim, J. Kor. Inst. Met. & Mater. 35, 1395 (1997).
  4. J. W. Kim, D. G. Kim, S. S. Ha, W. C. Moon, C. S. Yoo, J. H. Moon and S.B. Jung, J. Kor. Inst. Met. & Mater. 44, 581 (2006).
  5. J. H. Lau, Low Cost Flip Chip Technology, McGraw-Hill, New York (2000).
  6. Korea Industrial Technology Foundation, Components & Materials Roadmap RFP Report (2007).
  7. J. W. Kim, D. G. Kim and S. B. Jung, J. Kor. Inst. Met. & Mater. 44, 587 (2006).
  8. J. M. Koo and S. B. Jung, Microelectron. Eng. 82, 569 (2005). https://doi.org/10.1016/j.mee.2005.07.057
  9. C. R. Barrett, W. D. Nix and A. S. Tetelman, The Principles of Engineering Materials, Prentice-Hall, Englewood Cliffs (1973).