• Journal of the Korean Magnetics Society
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• v.18 no.1
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• pp.43-47
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• 2008

[ $ZnO-Bi_2O_3-Al_2O_3-B_2O_3-SiO_2$ ] nano-glass has been prepared by sol-gel method. The mean particle size was 60.3 nm with narrow size distribution. The nano-galss has been used as a sintering aid for the densification of the NiZnCu ferrites. The ferrite was sintered with nano-glass sintering aids at $840{\sim}900^{\circ}C$, 2 h and the initial permeability, quality factor, density, and saturation magnetization were also measured. The initial permeability of 0.5 wt% nano-glass added toroidal sample for NiZnCu ferrites sintered at $900^{\circ}C$ was 193.3 at 1 MHz. The initial permeability and saturation magnetization were increased with increasing annealing temperature. As a result, $ZnO-Bi_2O_3-Al_2O_3-B_2O_3-SiO_2$ nano-glass systems were found to be useful as sintering aids for multilayer chip inductors.

• Journal of Electrochemical Science and Technology
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• v.14 no.3
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• pp.252-261
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• 2023

Glucose detection is particularly important for clinical diagnosis and personal prevention and control. Herein, the smartphone-based amperometric glucose sensors were constructed using the NiS/CuS nanorods (NRs) as sensing electrodes. The NiS/CuS NRs were prepared through a facile hydrothermal process accompanied by the subsequent vulcanization treatment. The morphological and structural properties of NiS/CuS NRs were characterized with SEM, EDS, XRD, and XPS. Electrochemical measurements including cyclic voltammetry, chronoamperometry, and electrochemical impedance spectroscopy display that NiS/CuS NRs can act as highly efficient electrocatalyst for glucose detection. The NiS/CuS NRs electrodes present a wide detection range of 1-8000 µM for glucose sensing with the sensitivity of 956.38 µA·mM^-1·cm^-2. The detection limit was 0.35 µM (S/N=3). When employed in smartphone-based glucose sensing device, they also display a high sensitivity of 738.09 µA·mM^-1·cm^-2 and low detection limit of 1.67 µM. Moreover, the smartphone-based glucose sensing device also presents favorable feasibility in determination of glucose in serum samples with the recoveries ranging between 99.5 and 105.8%. The results may provide a promising viewpoint to design other new portable glucose sensors.

• Journal of the Korean institute of surface engineering
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• v.22 no.2
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• pp.47-54
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• 1989

The effects of intermetallic compound growt on the sheet resistance and soldreability as functions of the aging time, the temperature, and the conditions of substrates have been investi-gated in the electroplallic compound (mainy Cu6Sn5and Ni3Sn4) and the number of phase interface increased, the sheet resistance increased. Spread tests showed that the solderability was dereased with the intermetallic compounds growth and increased with the thickness of electroplated Sn. The surface morphology or agin size of the compound layer singificantly affect the solderability. The solderability of Sn/Ni system was superiot to Sn/Ni system was sperior to that of Sn/Cu system and the intermetallic compounds growth was solwer in the former system.

• 한국신재생에너지학회:학술대회논문집
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• 2008.05a
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• pp.9-12
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• 2008

The internal reforming of n-Butane on Ni-YSZ and Cu-Ceria-YSZ was investigated with anode granule at steam to carbon ratio from 0 to 3 and at temperature of $750^{\circ}C$. Although hydrogen production was lager at Ni-YSZ, resistivity for carbon deposition was better at Cu-Ceria-YSZ. These phenomena occur because unwanted side reaction go on with reforming reaction for hydrogen production at Ni-YSZ.

• Journal of the Korean Institute of Telematics and Electronics
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• v.27 no.5
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• pp.724-728
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• 1990

The X-ray diffraction pattern, electrical resistance, density and critical temperature of a series of YBa2(Cu3-xNix)O7-\ulcornersamples (0\ulcorner\ulcorner.5) were investigated with the increase of the Ni content. The samples show a principal 1.2.3-like phase with well resolved orthorhombic peaks. The final pattern of the x=0.1 sample appears to be well reacted orthorhombic YBa2(Cu,Ni)3O7-\ulcornerwith minor impurities and an appreciable amorphous fraction. From the above results, we conclude that Ni does not play an important role for the superconductivity in the Y-Ba-Cu-O system.

• Journal of Korea Foundry Society
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• v.22 no.6
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• pp.288-292
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• 2002

Ni-base amorphous alloys were manufactured using melt-spinning and Cu-mold die casting methods. Amorphous formability, the supercooled liquid region before crystallization and mechanical properties were examined. The reduced glass transition temperature and the supercooled liquid region of $Ni_{51} Nb_{20} Zr_9 Ti_9 Co_8 Cu_3$alloy were 0.621 and 46 K respectively. $Ni_{51} Nb_{20} Zr_9 Ti_9 Co_8 Cu_3$ alloy was produced in the rod shape 3mm diameter using the Cu-mold die casting. Hardness, compression strength, elongation and elastic modulus of the alloy were 850 DPN, 2.75 GPa, 1.8% and 150 GPa respectively. Moreover, compression strength of 2.75 GPa was the highest value in the amorphous bulk alloy produced up to now.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1988.10a
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• pp.64-66
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• 1988

The present investigation has been performed on the manufacturing process of Ni-P doped W-Cu electric contacts by infiltration techniques. The addition of small amount of Ni-P alloy aimed at forming a rigid and homogeneous skeleton structure of W-powders which favours subsequent infiltration process of Cu-melts. The experimental results revealed that the small addition of Ni-P alloy appreciably enhances the sintering process of W at low temperatures (even at 1000$^{\circ}C$), simultaneously causing a considerable change of skeleton Morphology and its related best infiltration behaviour of Cu-melts.

• Journal of Power System Engineering
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• v.10 no.3
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• pp.58-66
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• 2006

The effect of bath composition, plating condition and plating rate on the magnetic properties of electroless Ni-Cu-P deposits were investigated. With increasing $CuSO_4$ concentration in the bath, plating rate increased, while the Br value of deposits decreased Sharply. Plating rate increased up to 34% with the addition of 200ppm of NaF and 0.8ppm of Thiourea to the bath. Plating reaction had been ceased by the increase of pH above 11.3, bath temperature higher than $90^{\circ}C$ and under $70^{\circ}C$. The Br value of deposit was uniform with various concentration of complexing agent (Sodium citrate, Ethylenediamine) in the bath. The Br value of deposit was almost equal to that found by the addition of stabilizer(Thiourea) and accelerator(NaF). The Br value of deposit was uniform in plating time(120 min) and heat treatment temperature(below $200^{\circ}C$), and were confirmed to have adequate bath stability for practical use.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.10
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• pp.873-877
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• 2007

In order to apply a complex multilayer chip LC filter, this study has estimated the interfacial reaction and coupling properties of dielectric materials $Pb(Fe_{1/2}Nb_{1/2})O_3$ and Ni-Zn-Cu ferrite materials through low-temperature co-sintering (LTCS). PFN powders were fabricated using double calcinated at $700^{\circ}C$ and then $850^{\circ}C$. While the perovskite phase rate was found to be 91 %, after heat treatment at $900^{\circ}C$ for 6h, the perovskite phase rate and density exhibited a value of 100 % and 7.46$g/cm^3$, respectively. The PFN/Ni-Zn-Cu ferrite, PFN/CUO (or $Pb_2Fe_2O_5$) and ferrite/CuO (or $Pb_2Fe_2O_5$) were mechanically coupled through interfacial reactions after the specimen was co-sintered at $900^{\circ}C$ for 6 h. No intermediate layer exists for the mutual coupling reaction. This result indicates the possibility of low-temperature co-sintering without any interfacial reaction layer for a multilayer chip LC filter.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.205-206
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• 2011

Cu thin films for electromagnetic wave shielding were prepared on PET film and Ni-coated PET film by using Dry and Wet coating method, such as evaporation method, DC sputtering method and copper sulfate($CuSO_4$). After that, Zn thin film and Ni thin film were prepared onto the Cu thin films by using evaporation dry process and Ni electro plating wet process as a finishing treatment, respectively. The result of conductivity test and corrosion resistance test revealed Cu thin films which were formed with bigger grain size and high Cu composition rate have superior properties. Zn thin film by dry evaporation process and Ni thin film by wet electro plating process on Cu thin films were largely contributed to corrosion resistance. However, Ni thin film by wet process made conductivity of all specimen worse, the other hand, Zn thin film by dry process made it better to improve condictivity of specimens just prepared by dry process.