• 한국세라믹학회지
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• 제39권12호
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• pp.1119-1123
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• 2002

Nanostructured spinel NiZn ferrites were prepared by the sol-gel method from metal nitrate raw materials. Analyses by X-ray diffraction and scanning electron microscopy showed the average particle size of NiZn ferrite was under 50 nm. The single phase of NiZn ferrites was obtained by firing at 250${\circ}C$, resulting in nanoparticles exhibiting normal ferrimagnetic behavior. The nanostructured $Ni_{1-X}Zn_XFe_2O_4$ (x=0.0∼1.0) were found to have the cubic spinel structure of which the lattice constants ${\alpha}_2$ increases linearly from 8.339 to 8.427 ${\AA}$ with increasing Zn content x, following Vegard's law, approximately. The saturation magnetization $M_s$ was 48 emu/g for x=0.4 and decreased to 8.0 emu/g for higher Zn contents suggesting the typical ferrimagnetism in mixed spinel ferrites. Pure NiZn ferrite phase substituted by Cu was observed before using the additive but hematite phase was partially appeared at $Ni_{0.2}Zn_{0.2}Cu_{0.6}Fe_2O_4$. On the other hand, the hematite phase in this NiZn Cu ferrite was disappeared after using the additive of acethyl aceton with small amount. The saturation magnetization Ms of $Ni_{0.2}Zn_{0.8-y}Cu_yFe_2O_4$(y=0.2∼0.6) as measured was about 51 emu/g at 77K and 19 emu/g at room temperature, respectively.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2003년도 추계학술발표강연 및 논문개요집
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• pp.201-201
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• 2003

It has been well known that Ni-MILC TFTs are acceptable for operation of LCD devices but still decrease of annealing temperature is desirable for the future devices like LCD on the plastic substrate. In this work, Cu was added to Ni-MILC in an attempt to lower the annealing temperature and enhance the MILC rate. It has been found that even small amount of Cu addition enhances the MlLC rate considerably. Also well One MILC can be distinguished from island type, which cannot be observed in pure Ni-MILC. Poly TFTs were fabricated with Cu/Ni-MILC and the effects of copper addition on the electrical properties were carefully investigated.

• Tribology and Lubricants
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• 제11권5호
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• pp.55-58
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• 1995

The effects of Ni contents in Cu base sintered friction material were studied. The contents of Ni were increased up to 9 wt% in the Cu-Sn matrix. The microstincture and tribological behavior of the friction material were examined. Pin on disk type of constant speed friction test rig were used to measure the friction and the wear rates. The results show that Ni addition increased the friction coefficients and decreased the wear rates of the materials. Relations between microhardness of the matrix and friction properties have been discussed. In addition optimum Ni content is recommended through the analysis of wear debris.

• E2M - 전기 전자와 첨단 소재
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• 제3권4호
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• pp.325-331
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• 1990

본 연구는 텅스텐 소결에 저온 활성제로 작용하는 Ni-P 공정합금을 미량첨가하여 제조공정의 간단화를 통한 새로운 W-Cu계 전기접점제조를 목표로 하였다. 이를 위해 1회 용침공정을 통해 제조한 W(Ni-P)-Cu 합금에 대한 전기접점특성을 조사하여 접점의 미세구조 관점에서 논의하였다. Ni-P 합금첨가한 접점은 기존의 순수 W-Cu 합금에 비해 낮은 접촉저항 및 낮은 아크소모를 나타내는 우수한 접점성능을 보여주었다. 이것은 Ni-P합금이 Cu용침이 개시되기전 짧은 승온단계에서 분말간의 강한 결합과 Cu용침에 유리한 기공통로를 갖는 W 분말 골격체의 형성을 유도하기 때문인 것으로 판단된다.

• 한국자기학회지
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• 제5권3호
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• pp.203-209
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• 1995

보자력이 다른 NiFe와 Co를 자성층으로 하고 Cu를 사잇층으로 하는 $glass\[Cu_{x\AA}\NiFe_{50\AA}\Cu_{x\AA}\Co_{50\AA}](X;\=\;8,\;10,\;14,\;18,\;22,\;26,\;28,\;38,\;48,\;58\;\AA)$ 다층박막을 D.C magnetron sputtering 방법으로 제작하여 사잇층인 Cu 두께, 적층횟수 및 열처리가 자기저항비에 미치는 영향과 자기 곡선의 변화에 대해 연구하였다. 자기저항 측정시 인가 자장은 전류의 방향과 수평, 수직하게 인가하여 측정하였다. Cu 두께가 대략 $10\;\AA$에서 최대 자기저항비를 보이고 있으며, 두께가 증가함에 따라 진동하는 경향은 나타냈다. 적층횟수에 따라서는 적층횟수가 증가함에 따라 증가하였으며, 단지 4층의 경우에는 오히려 3층 보다 감소하였다. 열처리의 경우 온도의 증가에 따라 증가하다가 $250^{\circ}C$ 이상에서는 다시 감소하는 것을 나타났다.

• 한국초전도학회:학술대회논문집
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• 한국초전도학회 1999년도 High Temperature Superconductivity Vol.IX
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• pp.247-250
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• 1999

We have performed $^{63,65}$Cu nuclear quadrupole resonance (NQR) measurements on Zn and Ni doped YBa$_2Cu_3O_7$ (YBa$_2Cu_{3-x}M_xO_7$, M=Zn or Ni, x = 0.00 ${\sim}$ 0.09). Doping effects are markedly different in relaxation rates as well as in superconducting transition temperatures. Both the spin-lattice and the spin-spin relaxation rates decrease for Zn doped YBCO. However, those increase for Ni doped YBCO. This contrast in local electronic dynamics provides a clear microscopic evidence that Zn forms no local moment, while Ni develops a local moment. Consequently, the antiferromagnetic spin fluctuation is suppressed by Zn doping whereas it is preserved by Ni doping.

• Journal of Magnetics
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• 제9권3호
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• pp.79-82
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• 2004

The structure and magnetic properties of Fe-Ni-N/Cu multilayered films, prepared by the DC magnetron sputter, as a function of different thicknesses of Fe-Ni-N ($t_{FeNiN}$) and Cu ($t_Cu$) layers have been studied by the methods of x-ray diffraction and measurement of magnetic moment. It has been found that the enhancement of (200) orientation in Fe-Ni-N layers is observed at the ratio of layer thickness with about $t_{FeNiN}/t_{Cu}$ $\underline{\simeq}$ 3.75. The reduction of magnetization due to the formation of interdiffusion near the interface is explained by means of the dead layer model. The temperature dependence of magnetization exhibits the feature of Blochs $T^{\frac{2}{3}}$ law. The layer thickness dependence of Curie temperature has been discussed by critical temperature theory of Heisenberg model.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 국제표면실장 및 인쇄회로기판 생산기자재전:전자패키지기술세미나
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• pp.37-59
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• 2004

In the case of Ni/Au finished pad on the package side, the solder joint of SnAgCu system can bring brittle fracture under impact load such as drop test. Therefore, it's difficult to prevent the brittle fracture of lead-free solder, by controlling Cu content. The failure locus existing on the interface between $(Ni,Cu)_3Sn_4\;and\;(Cu,Ni)_6Sn_5$ IMC layers must be changed to other site in order to avoid brittle fracture due to impact load. It was not found any clear evidence that there were two IMC layers exist. But it was strongly assumed these were two layers which have different Cu-Ni composition. From the above analysis it was assumed that Cu atom in the solder alloy or substrate seemed to affect IMC composition and cause to IMC brittle fracture.

• 소성∙가공
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• 제16권5호통권95호
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• pp.375-380
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• 2007

The bimetals of home appliances are mainly manufactured by cladding process and these are almost consisted with Cu alloy and Ni alloy. But it is very difficult to clad these alloys, because the brittle $Cu_3O_4$ oxide film formed easily on Cu alloy surface during cladding process. Clad rolling and heat treatment processes were applied for the development of bimetals by using the Ni alloy and the 3 types of Cu alloys. Optical microstructure, micro-hardness, specific resistance, and deflection and line profile of newly processed bimetals specimens were observed and measured in this paper. Inter-diffusion was observed between Cu and Ni element in the interface of heat treated Cu alloy and Ni alloy clad material. The C1220 and Invar36 clad material showed the best property of deflection among the 3 kind of clad materials.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 추계학술발표대회 개요집
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• pp.219-221
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• 2005

Sn-9Zn solder balls were bonded to Cu, ENIG (Electroless Nickel/Immersion Gold) and electrolytic Au/Ni pads, and the effect of aging on their joint reliability was investigated. The interfacial products were different from the general reaction layer formed in a Sn-base solder. The intermetallic compounds formed in the solder/Cu joint were $Cu_{5}Zn_{8}$ and $Cu_{6}Sn_{5}$. After aging treatment, voids formed irregularly at the bottom side of the solder because of Sn diffusion into the $Cu_{5}Zn_{8}$ IMC. In the case of the solder/ENIG joint, $AuZn_{3}$ IMCs were formed at the interface. In the case of the Au/Ni/Cu substrate, an $AuZn_{3}$ IMC layer formed at the interface due to the fast reaction between Au and Zn. In addition, the $AuZn_{3}$ IMC layer became detached from the interface after reflow. When the aging time was extended to 100 h, $Ni_{5}Zn_{21}$ IMC was observed on the Ni substrate.