• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2001.11a
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• pp.10-10
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• 2001

In this paper, initial depositing process of electroless Ni-Cu-P alloy was investigated by means of SEM, TEM and AES. The results show that the initial deposition is inhomogeneous and there exist different transition layers between different coatings and substrates, which are decided by the structures and compositions of the bath. For Ni-P binary alloy, its deposition takes place superiorly at grain boundary and on some grains with beneficial texture, the thickness of transition layer composed of Ni-Fe-P reaches 2000 angstrom. But during initiation of Ni-Cu-P trinary alloy, only at grain boundary is prIor to be deposited electrolessly, transited layer contains Ni-Fe-Cu-P and is decreased to about 500 angstrom. The structures of the films of Ni-P and Ni-Cu-P are crystalline at the initial depositing stage. The mechanisms of the process are put forward in this paper.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.27-36
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• 2007

In this study, we investigated the interfacial reactions between various Sn-Ag-Cu(SAC) solder alloys and ENIG(Electroless Ni Immersion Gold) and Cu-OSP(Organic Solderability Preservative) pad finish. In the case of the interfacial reaction between Sb added SAC solder and ENlf thinner P-rich Ni layer was formed at the interface. In the case of the interfacial reaction between Ni added SAC solder and Cu-OSP, the uniform $Cu_6Sn_5$, intermetallic compounds(IMCs) were formed and $Cu_6Sn_5$ grain did not grow after multiple reflows. Thinner $Cu_3Sn$ IMCs were farmed at the interface between $Cu_6Sn_5$ and Cu-OSP after $150^{\circ}C$ thermal aging.

• Journal of Powder Materials
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• v.22 no.5
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• pp.362-366
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• 2015

The effect of sublimable vehicle composition in the camphor-naphthalene system on the pore structure of porous Cu-Ni alloy is investigated. The CuO-NiO mixed slurries with hypoeutectic, eutectic and hypereutectic compositions are frozen into a mold at $-25^{\circ}C$. Pores are generated by sublimation of the vehicles at room temperature. After hydrogen reduction at $300^{\circ}C$ and sintering at $850^{\circ}C$ for 1 h, the green body of CuO-NiO is completely converted to porous Cu-Ni alloy with various pore structures. The sintered samples show large pores which are aligned parallel to the sublimable vehicle growth direction. The pore size and porosity decrease with increase in powder content due to the degree of powder rearrangement in slurry. In the hypoeutectic composition slurry, small pores with dendritic morphology are observed in the sintered Cu-Ni, whereas the specimen of hypereutectic composition shows pore structure of plate shape. The change of pore structure is explained by growth behavior of primary camphor and naphthalene crystals during solidification of camphor-naphthalene alloys.

• Journal of the Korean Magnetics Society
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• v.14 no.1
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• pp.25-28
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• 2004

The dependence of sensitivity, MR ratio, coercivity (Hc) and switching fields as a function of thickness of each magnetic layers(Co, NiFe and Cu) were investigated in pseudo spin valves with a structure of Ta/NiFe/Cu/Co. As measured results dependence of the thickness of each magnetic layer, we obtained MR ratio of 7.26% for Ta(4 nm)/NiFe(7.5 nm)/Cu(3 nm)/Co(5 nm) pseudo spin valves. Also, we could control properties of magnetoresistance for independent magnetization courses of each magnetic layer. Especially, we found that we could control coercivity as constant MR ratio dependence of Co thickness.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.81-88
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• 2014

As the industrial technology has been developed, a dissimilar welding has been received huge attention in various engineering fields. To understand the mechanical properties and possibility of applications of dissimilar metals joining, the laser welding of Cu and Ni dissimilar metals was studied in this paper. Cu and Ni have differences in materials properties, and Cu and Ni make no intermetallic compounds according to typical binary phase of Cu and Ni system. In this study, lap welds of Cu and Ni dissimilar metals using single-mode fiber laser with high welding speed were tried, and mechanical properties of the welds zone were evaluated using a Vickers hardness test and a tensile shear test. To recognize the relation between hardness and tensile shear load, weld fusion zone of interface weld area were observed. And it was confirmed that the ultra-high welding speed could make good weld beads and higher hardness parts had higher tensile shear load under the all conditions.

• Korean Journal of Materials Research
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• v.16 no.2
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• pp.137-143
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• 2006

The effects of Cu and Fe additions on the thermal stability, microstructure and mechanical properties of $Al_{85}-Ni_{8.5}-Mm_{6.5},\;Al_{84}-Ni_{8.5}-Mm_{6.5}Cu_1,\;Al_{84}-Ni_{8.5}-M_{m6.5}Fe_1$ alloys, manufactured by gas atomization, degassing and hot-extrusion were investigated. Gas atomization, with a wide super-cooled liquid region, allowed the alloy powders to exhibit varying microstructure depending primarily on the powder size and composition. Al hotextruded alloys consisted of homogeneously-distributed fine-grained fcc-Al matrix and intermetallic compounds. A substitution of 1 at.% Al by Cu increased the thermal stability of the amorphous phase and produced alloy microstructure with smaller fcc-Al grains. On the other hand, the same substitution of 1 at.% Al by Fe decreased the stability of the amorphous phase and produced larger fcc-Al grains. The formation of intermetallic compounds such as $Al_3Ni,\;Al_{11}Ce_3\;and\;Al_{11}La_3$ was suppressed by the addition of Cu or Fe. Among the three alloys examined, the highest Vickers hardness and compressive strength were obtained for $Al_{84}-Ni_{8.5}-M_{m6.5}Cu_1$ alloy, and related to the finest fcc-Al grain size attained from increased thermal stability with Cu addition.

• Korean Journal of Materials Research
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• v.15 no.5
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• pp.318-322
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• 2005

Ti-capped NiSi contacts were formed on $p^+/n$ junctions to improve the leakage problem and then Cu was deposited without removing the Ti-capping layer in an attempt to utilize as a diffusion barrier. The electrical characteristics of these $p^+/n$ diodes with Cu/Ti/NiSi electrodes were measured as a function of drive-in RTA(rapid-thermal annealing) and silicidation temperature and time. When drive-in annealed at $900^{\circ}C$, 10 sec. and silicided at $500^{\circ}C$, 100 sec., the diodes showed the most excellent I-V characteristics. Especially, the leakage current was $10^{-10}A$, much lower than reported data for diodes with NiSi contacts. However, when the $p^+/n$ diodes with Cu/Ti/NiSi contacts were furnace-annealed at $400^{\circ}C$ for 40 min., the leakage current increased by 4 orders. The FESEM and AES analysis revealed that the Ti-capping layer effectively prohibited the Cu diffusion, but was ineffective against the NiSi dissociation and consequent Ni diffusion.

• Journal of Korea Foundry Society
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• v.22 no.6
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• pp.304-308
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• 2002

The new Cu-Zr-Ti-Ni-Pd amorphous alloy system has been introduced and manufactured using melt-spinning and Cu-mold die casting methods. Amorphous formability, the supercooled liquid region before crystallization and mechanical properties of the alloys were examined. The reduced glass transition temperature(Trg = Tg/Tm) and the supercooled liquid region(${\Delta}$Tx = Tx-Tg) of $Cu_{49}Zr_{30}Ti_{10}Ni_5Pb_6$ alloy were 0.620 and 57 K respectively. $Cu_{49}Zr_{30}Ti_{10}Ni_5Pb_6$ amorphous alloy was produced in the rod shape with 2mm diameter using the Cu-mold die casting. The hardness value of the amorphous bulk alloy was 432 DPN.

• Journal of the Korean institute of surface engineering
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• v.16 no.2
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• pp.41-47
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• 1983

An investigation has been performed on the effects of temperature and Ni addition on the wetting behaviour of Cu on W substrate in hydrogen atmosphere. An sessile drop method was used to measure a wetting angle. The concentration profiles of W, Cu and Ni elements in W/Cu - 5 Ni specimen were made by EPMA. With increasing temperature, the wetting angle of Cu droplet on W plate decreases and the time to reach an equilibrium wetting angle is shortened in hydrogen atmosphere. The addition of Ni improves appreciably the wettability of Cu on W. With increasing Ni content in Cu liquid droplet(0, 1, 3, 5%), the wetting angle is decreased from 21$^{\circ}$to 0$^{\circ}$.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.1
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• pp.55-62
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• 2023

In this study, Sn-3.0Ag-0.5Cu (wt.%, SAC305) solder dipping process was performed between Ni-foam skeleton with different pore per inch (PPI) to fabricate Ni-foam/SAC305 composite solder, and then applied to the transient liquid phase (TLP) bonding process to evaluate the microstructure and mechanical properties of the bonded joint. The Ni-foam/SAC305 composite solder preform consisted of Ni-foam and SAC305, and an intermetallic compound (IMC) having a (Ni,Cu)₃Sn₄ composition was formed at the Ni-foam interface. During TLP bonding process, the IMC at the Ni-foam interface was converted to (Ni,Cu)₃Sn₄+Au, and as the bonding time increased, the Ni-foam and SAC305 continuously reacted, and the bonded joint was converted into an IMC. And it was confirmed that the 130 PPI Ni-foam/SAC305 composite solder joint was converted into an IMC at the fastest rate. As a result of performing a shear test to confirm the effect of Ni-foam on mechanical properties, solder joints under all conditions exhibited excellent mechanical properties of 50 MPa or more in the early stages of the TLP bonding process, and the shear strength tends to increase as the bonding time increases.