• Proceedings of the KWS Conference
• /
• 2007.11a
• /
• pp.245-247
• /
• 2007

Sn-base solder bump is mainly used in micro-joining for flip chip package. The quantity of intermetallic compounds that was formed between Cu pad and solder interface importantly affects reliability. In this research, micro-bump was fabricated by two binary electroplating and the intermetallic compounds(IMCs) was estimated quantitatively. When the micro Sn-Ag solder bump was made by electroplating, SiC powder was added in the plating solution for protecting of intermetallic growth. Then, the intermetallic compounds growth was decrease with increase of amount of SiC power. However, if the mount of SiC particle exceeds 4 g/L, the effect of the growth restraint decrease rapidly.

• Journal of Life Science
• /
• v.9 no.1
• /
• pp.64-68
• /
• 1999

The properties of purified intracellular adenosine deaminase (adenosine aminohydrolase, EC 3.5.4.4) of Nocardioides sp. J-326TK isolated from soil have been studied. The enzyme deaminated adenosine and 2`-deoxyadenosine and the respective {TEX}$K_{M}${/TEX} values were 4.0×{TEX}$10^{-4}${/TEX} M and 5.0× {TEX}$10^{-4}${/TEX} M, but the enzyme was not active on 8-bromoadenosine, 6-methylaminopurine riboside, ATP, ADP, 2`-AMP, 3`-AMP, 5`-AMP, dAMP, cAMP, NAD, FAD, NADP and adenine. The enzyme activity was strongly inhibited by the addition of {TEX}$Hg^{2+}${/TEX} and {TEX}$Ag^{+}${/TEX}, {TEX}$Cu^{2+}${/TEX}, {TEX}$Co^{2+}${/TEX} and {TEX}$Mn^{2+}${/TEX} also inhibited the activity but much less extent. The effect of alkyl reagents, metal chelating reagents and certain other compounds on the enzyme activity were also examined. No reagent activated the enzyme. On the contrary, the enzyme reaction was slightly inhibited by o-phenanthroline and 6-benzyladenosine.

• Proceedings of the KAIS Fall Conference
• /
• 2005.05a
• /
• pp.55-57
• /
• 2005

기존의 장신구 은제품은 무르고 주조공정 특유의 미세한 표면결함을 가져서 착웅 중 쉽게 변색되는 문제가 있었다. 본 연구에서는 내식성을 향상시키기 위해 $92.5\%Ag-6.5\%Cu-1\%Zn$의 삼원계 은합금을 기초 소재로 해서 반지장신구를 상정하여 기존의 주조공정으로 대략의 형태를 만들고 금형과 유압프레스로 성형 가압시켜서 적극적으로 주조 시에 발생한 미세기공을 제거하고 결정립을 미세화하여 표면경도와 밀도를 향상시켰다. 선반가공과 미세연마를 실시하여 내식성이 향상된 표면과 기존 주조공정에 비해 3배 이상 향상된 경도를 가져서 스프링백 효과에 의해 귀보석을 세팅할 수 있는 개선된 텐션형 은장신구 공정을 개발하였고 이때의 최적 성형 정도를 확인하였다.

• Journal of the Korean institute of surface engineering
• /
• v.48 no.4
• /
• pp.149-157
• /
• 2015

We investigated the effects of the fabric structure or the kinds of plated metals on the electromagnetic interference shielding effectiveness (EMI SE) by means of electroless plating on polyester fabric. We found that the weight of deposited metal, EMI SE, and flexibility of the conductive fabric for EMI shield is affected by morphology of fabric and structure of fiber. The EMI SE of conductive fabric plated Ni/Cu/Ni by electroless plating method on draw textured yarn (DTY) polyester was in the practically useful range of above 70 dB over a wide frequency range of 10 MHz to 1.0 GHz at the surface resistivity of $0.05{\Omega}/{\square}$. Au or Ag plated conductive fabric by immersion plating method is not able to provide for a good EMI SE.

• Economic and Environmental Geology
• /
• v.20 no.4
• /
• pp.223-234
• /
• 1987

This paper describes the mode of occurrence and mineralogical properties of electrum from the Namseong Gold-Silver deposits, for the purpose of obtaining data on the characteristics of the ore deposits and the behavior of gold and silver during the mineralization. The gangue minerals are quartz, calcite, fluorite. Ore minerals are mainly composed of pyrite, sphalerite, chalcopyrite and galena with minor amount of argentite, electrum, pyrargyrite, native silver and unidenfied mineral(Cu-Fe-Ag-S series). Three stage of mineralization recognized are, from early to later, (I) pyrite-electrum stage (II) sphalerite-chalcopyrite-galena-argentite-electrum stage (III) sulfosalts stage. The filling temperature of fluid inclusions in quartz ranges from $225^{\circ}$ to $335^{\circ}C$. The value of sulfur fugacity estimated by means of electrum-tarnish method ranges from $10^{-11.5}$ to $10^{-14}$ atm. The compositional heterogeneity within a single grain with respect to gold concentration is common in the Namseong electrums Chemical composition of electrum ranges generally between 25~45 atom% Au. Its gold content decreases in late stages of mineralization.

• Journal of the Semiconductor & Display Technology
• /
• v.19 no.3
• /
• pp.19-22
• /
• 2020

The thermal evaporation source is used to prepare thin films by physical vapor deposition. Materials of metals, organic materials, were tested and explained for thermal evaporation experiments. The developed effusion cell performance depends on the type of deposition material, the size of the crucible, the performance of the reflector, etc. and the proper conditions were found by producing, comparing and analyzing several sets of effusion cell to quantitatively evaluate the performance of the cell. The effusion cell for thermal evaporation source is used to prepare thin films of Ag, Cu, Mg.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2012.05a
• /
• pp.86.1-86.1
• /
• 2012

나노재료와 나노기술의 연구개발 지원을 위하여 국가나노인프라인 나노종합팹센터에서 개발되고 있는 나노재료/나노현상의 실시간 관찰을 위한 SiN membrane chip 기술 및 나노그래핀 기반구축에 대한 최근 결과와 향후계획을 소개하고자 한다. 나노재료의 합성, 배열, 구조 등의 실시간 관찰을 가능하게 하기 위하여 제작된SiN membrane chip은 투과전자현미경(transmission electron microscope, TEM)에서 투명한 기판으로, 그 위에 나노재료를 합성, 배열하고 원하는 모양의 전극을 형성하여 나노재료 및 나노소자의 온도변화 및 전기적 특성 측정 등이 가능하다. 이러한 기술은 Ag, Sn, Cu 등 nano-cluster의 percolation 소자, SiN 및 Graphene 나노기공 소자, SiGe, BiTe, Si, ZnO 나노선 및 CNT의 내부구조변화, 상변화 등 다양한 나노재료/나노소자의 나노현상 관찰 및 해석에 적용되었다.

• Environmental Engineering Research
• /
• v.9 no.5
• /
• pp.193-200
• /
• 2004

A study of the treatment of piggery wastes using a multilayered metal-activated carbon system followed by carbon bed filtration was carried out at bench scale. From the physicochemical properties obtained from samples treated with aqueous solutions containing metallic ions such as Ag$^+$, Cu$^{2+}$, Na$^{-}$, K$^+$ and Mn$^{2+}$, main inspections are subjected to isothem shape, pore distribution with micropore, SEM and EDX. Multilayered metal-activated carbons were contacted to waste water to inwestigate the simultaneous catalytic effect for the COD, BOD, T-N and T-P removal. From these removal performance was achieved. The high efficiency of the multilayered metal-activated carbon bed, satisfactory removal performance was achieved. The high efficiency of the multilayered metal-activated carbon bed was derermined by the properties of this material for trapping, catalytic effect and adsorption of organic solid particles.

• Journal of the Korean Society of Food Science and Nutrition
• /
• v.6 no.1
• /
• pp.27-33
• /
• 1977

The alkaline protease was isolated from the culture of Penicillium species (P-46) grown in the wheat bran media. The crude purification of this enzyme was carried out by extraction with distilled water and precipitated with 0.7-saturated ammonium sulfate, then dialysis for 3days. The activity of this enzyme was determined by Folin's colorimetric method. The results were as follows; 1. The optimum pH and temperature of this enzyme were pH 8.4 and $45^{\circ}C$. 2. This enzyme was stable at pH $7.0{\sim}9.0$. 3. This enzyme was not inactivated by treatment in lower temperature than $30^{\circ}C$. 4. The activity of this enzyme was strongly inhibited by $Hg^{++}$ and $Cu^{++}$, but slightly by $Ag^+$ 5. This enzyme was not inhibited by cystein, thiourea, ${\varepsilon}-aminocaproic$ acid, 2, 4-DNP, EDTA but strongly inhibited by PCMB.

• ETRI Journal
• /
• v.35 no.2
• /
• pp.340-343
• /
• 2013

A novel bumping process using solder bump maker is developed for the maskless low-volume solder on pad (SoP) technology of fine-pitch flip chip bonding. The process includes two main steps: one is the aggregation of powdered solder on the metal pads on a substrate via an increase in temperature, and the other is the reflow of the deposited powder to form a low-volume SoP. Since the surface tension that exists when the solder is below its melting point is the major driving force of the solder deposit, only a small quantity of powdered solder adjacent to the pads can join the aggregation process to obtain a uniform, low-volume SoP array on the substrate, regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of $130{\mu}m$ is successfully formed.