• Journal of Sensor Science and Technology
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• v.13 no.5
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• pp.399-404
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• 2004

We report on the technology of formation of sandwich structures based on fullerite films and on experimental results in research of optical and conductivity properties of these sandwich samples. Single crystals of sapphire (100) or silicon were used as substrates. The sandwich specimens were based on the structure M/$C_{60}$/M (M=Cr, Pd, Ag, Al, Cu). The thickness of the fullerite films was about $0.2{\sim}1.0{\mu}m$. The area of the $C_{60}$ film under the top contact was about $1cm^{2}$. The specimens have been investigated by infrared spectroscopy, spectra-photometry, ellipsometry and X-ray diffraction analysis. Measurements of the current/voltage characteristics and research on the temperature dependence of conductivity were performed as well. It was shown that metals such as Cr, Pd, Ag, Al, and Cu penetrate easily into the fullerite films. It appears that these specimens have a large conductivity. For silver/$C_{60}$ and other sandwich structures the conductivities show a semiconductor-like behaviour.

• Resources Recycling
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• v.10 no.1
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• pp.49-55
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• 2001

The strategy of recovering metals from scrap is in general much different from primary sources. One of the main differences between the treatment of scrap and that of primary sources lies with the fact that metals are frequently associated with other met-als to form alloys in scrap, while metals occur in primary sources as oxides or sulfides. In this paper, factors affecting the dis-solution behavior of metals from various alloy systems have been reviewed and discussed. Specific examples have been drawn from Au/Ag, Au/cu and Ag/cu systems. Results of the dissolution behavior of various metals from these alloys have been reviewed and compared to the dissolution behavior of single metal systems in various lixiviants such as acids, cyanide and ammonia. It has been observed that the presence of other metals in alloys would significantly affect the dissolution rate of the metal in question. The leaching behavior of metals from homogeneous alloys relies on the chemical interaction between atoms in the lattice of the alloys, while that from heterogeneous alloys is affected by galvanic interaction established in the solution The manner in which the dissolution of a certain metal is influenced by surrounding metals has been discussed in terms of pas-sive and noble nature of the metal in relation to the neighboring metals. The role of the standard electrochemical Potential of these metals on the selective dissolution for a given lixiviant has also been discussed.

• Tribology and Lubricants
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• v.24 no.1
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• pp.27-33
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• 2008

A micro-impression creep machine was designed and developed, adopting a small punch in diameter of 150 um, displacement gage with an accuracy of sub-${\mu}m$ scale, and load-cell with an accuracy of mN scale in order to investigate creep behavior of small solder ball in diameter of less than 1 mm. Creep behavior of lead-free solder ball(Sn-3.0Ag-0.5Cu) in diameter of $760\;{\mu}m$ was investigated in the stress range of $8{\sim}60\;MPa$ and at $303\;K{\sim}393\;K$. The applied load became decreased slightly and continuously in the creep rate of $10^{-4}/s$ range during the current experiments. Also, the machine frame was so sensitive to the environmental temperature that nm scaled displacement recording was unstable according to the change in environmental temperature.

• Corrosion Science and Technology
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• v.6 no.6
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• pp.304-307
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• 2007

As to the reflection electrode of LCD (liquid crystal displays), silver-copper-gold alloy (hereafter, it is called as ACA (Ag98%, Cu1%, Au1%)) is an effective material of which weathering resistance can be improved more compared with pure silver. However, there is a problem that gold remains on the substrate as residues when ACA is etched in cerium ammonium nitrate solution or phosphoric acid. Gold can not be etched in these etchants as readily as the other two alloying elements. Gold residue has actually been removed physically by brushing etc. This procedure causes damage to the display elements. Another etchant of iodine/potassium iodide generally known as one of the gold etchants can not give precise etch pattern because of remarkable difference in etching rates among silver, copper and gold. The purpose of this research is to obtain a practical etchant for ACA alloy. The results are as follows. The cyanogen complex salt of gold generates when cyanide is used as the etchant, in which gold dissolves considerably. Oxygen reduction is important as the cathodic reaction in the dissolution of gold. A new etchant of sodium cyanide / potassium ferricyanide whose cathodic reduction is stronger than oxygen, can give precise etch patterns in ACA alloy swiftly at room temperature.

• Applied Chemistry for Engineering
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• v.3 no.1
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• pp.156-171
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• 1992

Chitin was isolated from crab shell. Chitosan, which was prepared by the deacetylation of chitin, was acylated to obtain N-acetyl(regenerated chitin), N-propionyl, N-butyryl, N-hexanoyl, N-decanoyl and N-maleated chitosans and their metal ion adsorption characteristics of N-acylchitosans were investigated. In order to enhance the adsorptivity, their porous beads were prepared and their adsorptivity with respect to the porosity and the adsorptivities for metal ions($Cu^{2+}$, $Ni^{2+}$, $CO^{2+}$, $Mn^{2+}$, $Ag^{+}$)were investigated. Their metal ion adsorptivities were remarkably imporved compared to those of chitin. As the larger acyl groups were introduced, adsorptivity increased, but that of N-decanoyl chitosan showed some decrease because of steric hindrance of the bulky N-decanoyl group. N-Maleated chitosan containing carboxyl group showed highly improved adsorptivity, and N-acylchitosans showed the good selective adsorption in the mixed metal ions($Cu^{2+}$, $Ni^{2+}$, $CO^{2+}$, $Mn^{2+}$ and $Ag^{+}$). They also showed excellent adsorption characteristics as chelating polymers.

• 한국초전도학회:학술대회논문집
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• v.10
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• pp.262-267
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• 2000

To tap the possibility of exploiting the precipitates as flux-pinning center in the Bi-2223 superconducting system, as-received Bi-2223/Ag tapes with the starting composition of Bi$_{1.8}$Pb$_{0.4}$Sr$_2$Ca$_{2.2}$Cu$_3$O$_8$ were post-annealed at various temperature, oxygen partial pressure, and annealing time. The 2$^{nd}$ phases in the annealed specimen were analysed with XRD, SEM, TEM, and EDS. The size and the distribution of the precipitates such as (Ca,Sr)$_2$(Pb,Bi)O$_4$ and Bi$_{0.5}$Pb$_3$Sr$_2$Ca$_2$CuO$_{12+{\delta}}$ (3221) in the Bi-2223 matrix was controllable by varying heat-treatment condition without breaking the connectivity of the 2223 grains. The nano-size precipitates within the 2223 grains are conjectured as working as flux-pinning sites, resulting in increased J$_c$ value.

• Proceedings of the Korean Society of Soil and Groundwater Environment Conference
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• 2003.09a
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• pp.409-412
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• 2003

Total extraction of stream sediments in the Kwangyang mine area shows their significant pollution with most trace metals such as Cr, Co, Fe, Pb, Cu, Ni, Zn and Cd, due to sulfide oxidation in waste dumps. Calculations of enrichment factor shows that Chonam-ri creek sediments are more severely contaminated than Sagok-ri sediments. Using the weak acid (0.1N HCl) extraction and sequential extraction techniques, the transport and sediment-water partitioning of heavy metals in mine drainage were examined for contaminated sediments in the Chonam-ri and Sagok-ri creeks of the Kwangyang Au-Ag mine area. Calculated distribution coefficient (Kd) generally decreases in the order of Pb $\geq$Al > Cu > Mn > Zn > Co > Ni $\geq$ Cd. Sequential extraction of Chonam-ri creek sediments shows that among non-residual fractions the Fe-Mn oxide fraction is most abundant for most of the metals. This indicates that precipitation of Fe hydroxides plays an important role in regulating heavy metal concentrations in water, as shown by field observations.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.33-41
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• 2010

Crack propagation mechanisms of Sn-3.0Ag-0.5Cu solder were studied in strain controlled push-pull creepfatigue conditions using the fast-fast (pp) and the slow-fast (cp) strain waveforms at 313 K. Transgranular cracking was found in the pp strain waveform which led to the cycle-dominant crack propagation and intergranular cracking in the cp strain waveform that led to the time-dominant crack propagation. The time-dominant crack propagation rate was faster than the cycle-dominant crack propagation rate when compared with J-integral range which resulted from the creep damage at the crack tip in the cp strain waveform. Clear recrystallization around the crack was found in the pp and the cp strain waveforms, but the recrystallized grain size in the cp strain waveform was smaller than that in the pp strain waveform. The cycle-dominant crack propagated in the normal direction to the specimen axis macroscopically, but the time-dominant crack propagated in the shear direction which was discussed in relation with shear micro cracks formed at the crack tip.

• Journal of the Korean Society of Safety
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• v.30 no.6
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• pp.7-11
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• 2015

The present study investigates the impact shear strength of thermal aged Sn-3Ag-0.5Cu lead-free solder joints at impact speeds ranging from 0.5 m/s to 2.5 m/s. The specimens were thermal aged for 24, 100, 250 and 1000 hours at $100^{\circ}C$. The experimental results demonstrate that the shear strength of the solder joint decreases with an increase in the load speed and aging time. The shear strength of the solder joint aged averagely decreased by 43% with an increase in the strain rate. For the as-reflowed specimens, the mode II stress intensity factor ($K_{II}$) of interfacial IMC between Sn-3.0Ag-0.5Cu and a copper substrate also was found to decrease from $1.63MPa.m^{0.5}$ to $0.97MPa.m^{0.5}$ in the speed range tested here. The degradations in the shear strength and fracture toughness of the aged solder joints are mainly caused by the growth of IMC layers at the solder/substrate interface.

• Transactions of the Korean Society of Automotive Engineers
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• v.22 no.3
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• pp.90-96
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• 2014

The conventional SnPb solders were widely used for several decades in the electronic packing system due to the superior mechanical properties such as low melting point, better wettavility and good mechanical fatigue. However, in recent years, owing to adverse effect on the human health and environment, conventional SnPb solders have been replaced by Lead-free solders. In this research, the shear punch(SP) test of Sn-4Ag-(Cu)/Ni pad was performed. Pb-free solder alloys which are the environmentally friendly of the electronic components were performed at $150^{\circ}C$ for 100hr~1000hr to artificial aging processing. In order to evaluate the mechanical properties of solder joints, the SP test was conducted at $30^{\circ}C$ and $50^{\circ}C$. As a result, the maximum shear strength of almost the whole specimens was decreased with the increase in aging time and temperature of SP test. The mechanical properties of Sn-4Ag-0.5Cu solder were most excellent in all Pb-free solder which were produced by the SP test at $30^{\circ}C$.