• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.11a
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• pp.57-57
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• 2000

Brazing characteristics of the LTCC(Low Temperature Co-fired Ceramics)/ Kovar(Fe-Ni-Co alloy) was investigated. Kovar is one of the typical material for the lid of MCM and packages. In case of alumina package, Brazing process is done by higher temperature profile than 800 $^{\circ}C$ and Ag-Cu alloy. But, LTCC has sintering temperature near 850 $^{\circ}C$. So, it is difficult to use the same process as alumina brazing. The adhesion strength of the brazed part is affected by brazing alloy and metallization properties between conductor pattern and LTCC material. We investigated brazing characteristics of the LTCC/Kovar using various brazing alloys(Ag-Cu, Au-Sn) and process conditions. And, we examined the influence of the glass contents in conductor on the brazing characteristics of the LTCC/Kovar.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.51-56
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• 2014

The reliability of solder joint is significantly affected by the property of surface finish. This paper reports on a study of high speed shear energy and failure mode for Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder joints with the time of Pd activation. The nodule size of electroless Ni-P deposit increased with increasing the time of Pd activation. The roughness (Ra) of electroless Ni-P deposit decreased with increasing the time of Pd activation. Then, with $HNO_3$ vapor, the quasi-brittle and brittle mode of SAC405 solder joint decreased with increasing the time of Pd activation. This results indicate that the increase in the Pd activation time for Electroless Ni/ Electroless Pd/ Immersion Au (ENEPIG) surface finish play a critical role for improving the robustness of SAC405 solder joint.

• Korean Journal of Materials Research
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• v.17 no.3
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• pp.152-159
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• 2007

When the electronics are tested with thermal shock for Pb-free solder joint reliability, there are temperature conditions with use environment but number of cycles for test don't clearly exist. To obtain the long term reliability data, electronic companies have spent the cost and times. Therefore this studies show the test method and number of thermal shock cycles for evaluating the solder joint reliability of electronic components and also research bonding strength variation with formation and growth of intermetallic compounds (IMC). SMD (surface mount device) 3216 chip resistor and 44 pin QFP (quad flat package) was utilized for experiments and each components were soldered with Sn-40Pb and Sn-3.0 Ag-0.5 Cu solder on the FR-4 PCB(printed circuit board) using by reflow soldering process. To reliability evaluation, thermal shock test was conducted between $-40^{\circ}C\;and\;+125^{\circ}C$ for 2,000 cycles, 10 minute dwell time, respectively. Also we analyzed the IMCs of solder joint using by SEM and EDX. To compare with bonding strength, resistor and QFP were tested shear strength and $45^{\circ}$ lead pull strength, respectively. From these results, optimized number of cycles was proposed with variation of bonding strength under thermal shock.

• Economic and Environmental Geology
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• v.50 no.1
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• pp.73-83
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• 2017

The surveyed mines are located in a polymetallic vein, replacement, and skarn mineral district in the central Andes of Peru. Iscaycruz, which includes underground and open pit mines that produce zinc and lead concentrates, was the largest mineral deposit of an important group of base metal deposits in the Andes of central Peru. The deposits are sub-vertical seams of polymetallic ores(Zn, Cu, and Pb). These seams are hosted by Jurassic and Cretaceous sedimentary rock formation. The intrusion of igneous rocks in these formations originated metallic deposits of metasomatic and skarn types. The Raura mine is composed of polymetallic deposit of veins and replacement orebodies. The main sedimentary unit in the area is Cretaceous Machay Limestone. The Raura depression contains several orebodies each with different mineralization: predominantly Pb-Zn bearing Catuvo orebody; Ag-rich galena-bearing Lake Ninacocha orebody; Cu-Ag bearing Esperanza and Restauradora orebody. Huaron is a hydrothermal polymetallic deposit of silver, lead, zinc, and copper mineralization hosted within structures likely related to the intrusion of monzonite dikes, principally located within the Huaron anticline. Mineralization is encountered in veins parallel to the main fault systems, in replacement bodies known as "mantos" associated with the calcareous sections of the conglomerates and other favourable stratigraphic horizons, and as dissemination in the monzonitic intrusions at vein intersections.

• Electronic Materials Letters
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• v.14 no.6
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• pp.718-724
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• 2018

With the development of photovoltaic industry, the cost of photovoltaic power generation has become the significant issue. And the metallization process has decided the cost of original materials and photovoltaic efficiency of the solar cells. Nowadays, double printing process has been introduced instead of one-step printing process for front contact of polycrystalline silicon solar cells, which can effectively improve the photovoltaic conversion efficiency of silicon solar cells. Here, the relative cheap Cu paste has replaced the expensive Ag paste to form Ag/Cu composite front contact of silicon solar cells. The photovoltaic performance and the cost of photovoltaic power generation have been investigated. With the optimization on structure and height of Cu finger layer for Ag/Cu composite double-printed front contact, the silicon solar cells have exhibited a photovoltaic conversion efficiency of 18.41%, which has reduced 3.42 cent per Watt for the cost of photovoltaic power generation.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.25-30
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• 2018

Sn-Pb solder has been used in automotive electronics for decades. However, recently, due to the environmental and health concerns, some international environmental organizations such as the end-of-life vehicle (ELV) enacted legislation banning of the Pb usage in automotive electronics. For this reason, many studies to develop and promote Pb-free soldering have been significantly reported. Meanwhile, because of flexibility and lightweight, flexible printed circuit boards (FPCBs) have been increasingly used in automotive electronics for lightweight to improve fuel efficiency and space utilization. Although the properties of lead-free solders for automotive electronics have been widely studied, there is a lack of research on the reliability performance of the lead-free solder joint on FPCB under user conditions. This study reported the properties of solder joints between Pb-free solders such as Sn3.0Ag0.5Cu, Sn0.7Cu and Sn0.5Cu0.01Al (Si), and various FPCBs finished with organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG). To evaluate on joint properties and reliabilities with different solder compositions and surface-finishing materials, pull strength test, thermal shock test, and bending cycle test were performed and analyzed. After the bending cycle test of solder joint on OSP-finishing, the fractures were occurred in solder and the lifetime of Sn3.0Ag0.5Cu solder joint was the longest.

• Korean Journal of Materials Research
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• v.9 no.10
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• pp.1018-1024
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• 1999

The effects of operating temperature and stress on degradation of components in high temperature steam generator were investigated. Several 2.25CrlMo tubes which had operated over 20 years and an unused 9CrlMoVNb tube were tested. For the former samples, the amount of $\textrm{M}_{6}\textrm{C}$ carbide and its size are increased with the aging or operating time. The precipitation behavior of carbides ($\textrm{M}_{2}\textrm{O}$, $\textrm{M}_{6}\textrm{C}$) is changed with the operating temperature of the tubes. However, unused 9CrlMoVNb samples show a different carbide precipitation process due to high chromium, vanadium, and niobium contents. The amount of Cr-rich $\textrm{M}_{23}\textrm{C}_{6}$ carbide is significantly increased with aging time, but that of $\textrm{M}_{6}\textrm{C}$ type carbide is rarely changed with aging time at elevated temperatures.

• Journal of the Mineralogical Society of Korea
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• v.16 no.3
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• pp.201-213
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• 2003

The adsorption property and ability of domestic zeolites for some heavy metal ions (Ag, Pb, Cr, Cu, Zn, Mn), which may cause a serious environmental problem in industrial wastewater, were evaluated on ore unit through a series of adsorption experiments together with careful examinations of mineral composition and properties of the zeolites. Though the adsorption behavior basically took place in the form of a cation exchange reaction, the higher CEC value does not necessarily to imply the higher adsorption capacity for a specific heavy metal. A general trend of the adsorption selectivity for heavy metals in the zeolites is determined to be as follow: $Ag\geq$Pb>Cr,Cu$\geq$Zn>Mn, but the adsorption properties of heavy metal ions somewhat depend on the species and composition of zeolite. Clinoptilolite tends to adsorb selectively Cu in case of Cr and Cu, whereas heulandite prefers Cr to Cu. A dominant adsorption selectivity of the zeolite ores for Ag and Pb is generally conspicuous regardless of their zeolite species and composition. The zeolite ores exhibit a preferential adsorption especially for $Ag^{+}$ so as not to regenerate when treated with $Na^{+}$ . In the adsorption capacity for heavy meta ions, the zeolites differ in great depending on their species: ferrierite>clinoptilolite>heulandite. Considering the CEC value of mordenite, the mordenite-rich ore appears to be similar to the clinoptilolite ore in the adsorption capacity. The adsorption capacity for heavy metals is not positively proportional to the CEC values of the zeolites measured by the exchange reaction with ammonium ion. In addition, the adsorption capacity roughly tends to depend on the zeolite contents, i.e., the grade of zeolite ore, but the trend is not consistent at all in some ores. These may be caused by the adsorption selectivity for some specific heavy metals, the presence of possible stacking micro-faults and natural cations such as K hardly to exchange in the zeolite. Considering the economic availability and functional effectiveness as natural zeolite resources, clinoptilolite ores could be applicable to utilize the domestic zeolites for the removal of heavy metals.

• Economic and Environmental Geology
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• v.39 no.6 s.181
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• pp.643-651
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• 2006

The Pb-Ag-Bi-S system minerals such as galena-matildite solid solutions, cosalite and heyrovskyite occur in the Nakdong As-Bi deposits. Galena-matildite solid solutions commonly coexisting with native bismuth fill in microfractures of pyrite grains and form irregular shapes. Cosalite forms composite grains including native bismuth, heyrovskyite and Bi-Te-S system minerals in the matrix of quartz vein. Matildite from the Nakdong deposits has an end member composition, $Ag_{1.07-1.11}Bi_{1.12-1.20}S_2$, and an excess concentration of $0.3{\sim}2.4$ mole % $Bi_2S_3$ compared to the stoichiomeoic value. PbS concentrations in $PbS-AgBiS_2$ solid solutions do not exceed 54 mole %. The average chemical composition of cosalite in the study area is $Pb_{1.79}Bi_{2.29}Ag_{0.12}S_5$. Pb is slightly depleted compared to the ideal composition, but the concentrations of Ag and Cu reach as much as 1.47 wt.% and 0.27 wt.%, respectively. Heyrovskyite has the chemical formula of $Pb_{5.01}Ag_{0.26}Bi_{2.70}S_9$ suggesting that there occurs the coupled substitution of $2Bi^{3+}$ for $3Pb^{2+}$ as well as that of $Ag^++Bi^{3+}$ for $2Pb^{2+}$. The genetic condition of Pb-Ag-Bi-S system minerals can be confined to the temperature of $220{\sim}270^{\circ}C$ and the pressure below 200 bars.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.