• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년 추계학술발표대회 개요집
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• pp.202-204
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• 2006

The reliability of insert mounted components has been considered as their life time was getting increased. The spread of crack and the growth of IMC(intermetallic compound) were observed by SEM(scanning electron microscope) and EDS(energy dispersive spectroscope). The cracks in Sn-37wt%Pb under thermal shock test were found earlier than other solders(Sn-3.0wt%Ag-0.5wt%Cu and Sn-0.7wt%Cu-0.01wt%P). The IMC thickness was increased with increasing number of thermal shock cycles in the following order : Sn-0.7Cu-0.01P; Sn-3.0Ag-0.5Cu; Sn-37Pb

• Journal of Advanced Marine Engineering and Technology
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• 제32권6호
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• pp.862-868
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• 2008

Many studies have been conducted to increase heat transfer in fluid. One of the various heat transfer enhancement techniques is suspending fine metallic or nonmetallic solid powder in traditional fluid. Nanofluid is defined as a new kind of heat transfer fluid containing a very small quantity of nanometer particles that are uniformly and stably suspended in a liquid. This study investigates the effect of nanofluid containing diamond, CuNi and CuAg nanometer particles, and proposes the heat transport mechanism of nanofluid. The test result shows that the thermal conductivity of nanofluid is much higher than that of traditional fluid, and the increasing rate of the conductivity is dependent on the conductivity of the solid metal.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년도 춘계 학술대회 개요집
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• pp.36-38
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• 2006

We investigated that the metallurgical, mechanical and electrical properties of the Sn-3.SAg/Cu ball grid array (BGA) solder joints at a reflow temperature of $255^{\circ}C$ for different reflow times of 10, 60, 300 and 1800 s. Two different intermetallic compound (IMC) layers, consisting of scallop-shaped $Cu_6Sn_5$ and very thin $Cu_3Sn$, formed at the solder/substrate interface, and their thicknesses increased with increasing reflow time. The shear force peaked after reflow for 60 s, and then significantly decreased with increasing reflow time. The fracture occurred along the solder ball in the initial reflow, but the fraction of the brittle fracture increased with increasing reflow time. The IMC growth and the volume of Cu dissolved in the solder balls affected the electrical property.

• 한국마린엔지니어링학회:학술대회논문집
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• 한국마린엔지니어링학회 2005년도 전기학술대회논문집
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• pp.177-182
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• 2005

Many studies have been conducted to increase heat transfer in fluid. One of the various heat transfer enhancement techniques is to suspend fine metallic or nonmetallic solid powder in traditional fluid. Nanofluid is defined at a new kind of heat transfer fluid containing a very small quantity of nanometer particles that are uniformly and stably suspended in a liquid. In this study CuNi or CuAg nano particles are used to investigate heat transfer enhancement. The result shows the thermal conductivity of nanofluid is much higher than that of traditional fluid.

• 대한화학회지
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• 제36권1호
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• pp.24-27
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• 1992

구리나 아연 막대에 의하여 은 졸의 응결이 일어난다. 은 졸의 표면에 있는 은 이온이 구리 혹은 아연 금속과의 산화-환원 반응에 의하여 은 금속으로 환원되면서 응결이 일어난다고 여겨진다. 구리 막대로 응결시킨 은 졸의 라만 스펙트럼을 연구하였다. 은 콜로이드 표면에 붕산과 질산 이온이 흡착되어 있다는 증거를 발견하였다. 은 콜로이드 표면에 흡착된 이들 이온들은 첨가된 흡착제에 의하여 쉽게 치환된다는 사실 또한 발견하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1990년도 추계학술대회 논문집
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• pp.26-30
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• 1990

Bi$\_$0.7/Pb$\_$0.3/Sr$_1$Ca$_1$Cu$\_$1.8/Ox thick films were screen printed on magnesia(MgO), silver and yttrium stabilized zirconia (YSZ) substrates and were sintered in a boat with cover to prevent the evaporation. The high-Tc phase increase and the low-Tc phase and Ca$_2$PbO$_4$ decrease with an increase in sintering temperature from 835$^{\circ}C$ to 860$^{\circ}C$. YSZ substrate interact strongly with the oxide resulting in poor superconductor, while the Ag and MgO substrates were satisfactory to make screen printed superconductors. The Bi$\_$0.7/Pb$\_$0.3/Sr$_1$Ca$_1$Cu$\_$1.8/Ox thick films screen printed both on Ag and MgO substrates show high Tc phase of ~85% and Tc of 96K.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 춘계학술대회 논문집 방전 플라즈마 유기절연재료 초전도 자성체연구회
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• pp.177-179
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• 2004

Suspension effect has been studied by using superconductor of BiPbSrCaCuO ceramics containing $Ag_2O$. It has been cleared that $Ag_2O$ acts as pinning center which plays an important role to the suspension effect. Magnetic repulsive force which affects a superconductor located in magnetic flux from toroidal magnet has been investigated. It has been concluded that the suspension effect arises from the interaction between the pinning effect and the diamagnetic effect.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.90-92
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• 2004

Suspension effect has been studied by using superconductor of BiPbSrCaCuO ceramics containing $Ag_2O$. It has been cleared that $Ag_2O$ acts as pinning center which plays an important role to the suspension effect. Magnetic repulsive force which affects a superconductor located in magnetic flux from toroidal magnet has been investigated. It has been concluded that the suspension effect arises from the interaction between the pinning effect and the diamagnetic effect.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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• pp.75-87
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• 2001

Three different kinds of substrate used in this study : bare Cu substrate, Ni-P/Cu substrate with a Ni-P layer thickness of $5\mu\textrm{m},$ and Au/Ni-P/Cu substrate with the Ni-P and Au layers of $0.15\mu\textrm{m}$ and $5\mu\textrm{m}$ thickness respectively. The wettability of various Sn-base solders was affected by the substrate metal finish used, i.e., nickel, gold and copper. On the Au/Ni-F/Cu substrate, Sn-base solders wet better than any of the other substrate metal finishes tested. The interfacial reaction between various substrate and Sn-base solder was investigated at $70^{\circ}C,$ $100^{\circ}C,$ $120^{\circ}C,$ $150^{\circ}C,$ $170^{\circ}C$ and $200^{\circ}C$ for reaction times ranging from 0 day to 60 day. Intermetallic phases was formed along a Sn-base solder/ various substrate interface during solid-state aging. The apparent activation energy for growth of Sn-Ag/Cu, Sn-Ag-Bi/Cu, and Sn-Bi/Cu couples were 65.4, 88.6, and 127.9 Kj/mol, respectively. After isothermal aging, the fracture surface shoved various characteristics depending on aging temperature and time, and the types of BGA pad.

• 한국재료학회지
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• 제19권6호
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• pp.344-348
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• 2009

The electrolyte effects of the electroplating solution in Cu films grown by ElectroPlating Deposition(EPD) were investigated. The electroplated Cu films were deposited on the Cu(20 nm)/Ti (20 nm)/p-type Si(100) substrate. Potentiostatic electrodeposition was carried out using three terminal methods: 1) an Ag/AgCl reference electrode, 2) a platinum plate as a counter electrode, and 3) a seed layer as a working electrode. In this study, we changed the concentration of a plating electrolyte that was composed of $CuSO_4$, $H_2SO_4$ and HCl. The resistivity was measured with a four-point probe and the material properties were investigated by using XRD(X-ray Diffraction), an AFM(Atomic Force Microscope), a FE-SEM(Field Emission Scanning Electron Microscope) and an XPS(X-ray Photoelectron Spectroscopy). From the results, we concluded that the increase of the concentration of electrolytes led to the increase of the film density and the decrease of the electrical resistivity of the electroplated Cu film.