Reliability of Insert Mounted Components under Thermal Shock

열충격하에서의 삽입실장 부품의 신뢰성에 관한 연구

  • 이종범 (성균관대학교 신소재공학부) ;
  • 노보인 (성균관대학교 신소재공학부) ;
  • 정승부 (성균관대학교 신소재공학부)
  • Published : 2006.10.19

Abstract

The reliability of insert mounted components has been considered as their life time was getting increased. The spread of crack and the growth of IMC(intermetallic compound) were observed by SEM(scanning electron microscope) and EDS(energy dispersive spectroscope). The cracks in Sn-37wt%Pb under thermal shock test were found earlier than other solders(Sn-3.0wt%Ag-0.5wt%Cu and Sn-0.7wt%Cu-0.01wt%P). The IMC thickness was increased with increasing number of thermal shock cycles in the following order : Sn-0.7Cu-0.01P; Sn-3.0Ag-0.5Cu; Sn-37Pb

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