• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.59-64
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• 2013

In-situ annealing tests of Cu/Ni/Au/Sn-Ag/Cu micro-bump for 3D IC package were performed in an scanning electron microscope chamber at $135-170^{\circ}C$ in order to investigate the growth kinetics of intermetallic compound (IMC). The IMC growth behaviors of both $Cu_3Sn$ and $(Cu,Ni,Au)_6Sn_5$ follow linear relationship with the square root of the annealing time, which could be understood by the dominant diffusion mechanism. Two IMC phases with slightly different compositions, that is, $(Cu,Au^a)_6Sn_5$ and $(Cu,Au^b)_6Sn_5$ formed at Cu/solder interface after bonding and grew with increased annealing time. By the way, $Cu_3Sn$ and $(Cu,Au^b)_6Sn_5$ phases formed at the interfaces between $(Cu,Ni,Au)_6Sn_5$ and Ni/Sn, respectively, and both grew with increased annealing time. The activation energies for $Cu_3Sn$ and $(Cu,Ni,Au)_6Sn_5$ IMC growths during annealing were 0.69 and 0.84 eV, respectively, where Ni layer seems to serve as diffusion barrier for extensive Cu-Sn IMC formation which is expected to contribute to the improvement of electrical reliability of micro-bump.

• Transactions of Materials Processing
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• v.7 no.5
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• pp.481-488
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• 1998

The active metal brazing was applied to bond Alumina and Ni-Cr steel by Ag-Cu-Zr-Sn alloy and the interfacial microstructure and reaction mechanism were investigated. Polycrystalline monoclinic $ZrO_2$ with a very fine grain of 100-150 nm formed at the alumina grain boundary contacted with Zr segregation layer at the interface. The $ZrO_2$ layer containing the inclusions and cracks were developed at the boundary of inclusion/$ZrO_2$ due to the difference in specific volume. The development of $ZrO_2$ at the interface was successfully explained by the preferential penetration of $ZrO_2$ at the interface was successfully explained by the preferential penetration of Zr atoms a higher concentration of oxygen and a high diffusion rate of Al ions into molten brazing alloy.

• Proceedings of the KWS Conference
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• 2006.10a
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• pp.184-186
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• 2006

Sn-3Ag-0.5Cu is one of candidate as an alternative approach to conventional lead-tin solder. In order to evaluate that creep characteristic of QFP, we used Sn-3Ag-0.5Cu where the operating temperature is $100^{\circ}C$. The specimens were loaded to failure at average pull strength in the range of 20% to 25%, X-ray machine is used to eliminate effect of void. In this paper, relation of time-displacement and steady state creep rate was studied, and used to analyze the experimental result.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.5
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• pp.545-551
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• 2004

Magnetic suspension effect has been studied by using superconductor of BiPbSrCaCuO ceramics containing Ag$_2$O. Magnetic flux measurements of a toroidal magnet revealed a concave shaped field distribution with a null field along the axis of the torus at the point where the field reversed. The suspension effect was observed only for the Ag$_2$O doped and field cooled sample which is attributed to the enhanced flux pinning due to the field cooled condition. It has been cleared that Ag$_2$O acts as pinning center which plays an important role to the magnetic suspension effect. Magnetic repulsive force which affects a superconductor located in magnetic flux from toroidal magnet has been investigated. It has been concluded that the magnetic suspension effect arises from the interaction between the pinning effect and the diamagnetic effect.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.05a
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• pp.413-416
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• 2009

The paper deals with the mechanical and electrical responses of submicrocrystalline Cu-3%Ag alloy as a function of strain imposed by equal-channel angular pressing. When inducing the effective strain of 12, the initial grain site of ${\sim}50{\mu}m$ is evidently reduced within the range of $0.2-0.3{\mu}m$ in size, having a reasonably equiaxed shape. The results of tension tests at room temperature exhibit that the tensile strength of the present alloy increases with increasing the amount of strain whereas losing electrical conductivity slightly. This phenomenon can be explained based on fine grained structure together with the non-equilibrium state of grain boundaries.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1054-1055
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• 2006

Bend tests were performed at temperatures between 77 and 473K for W-19vol%Cu, W-22vol%Ag and W-19vol%(BAg-8) composites. Yield and maximum strengths and ductility of the composite were discussed in terms of microstructure and fractography. Results are summarized as follows. (1) Almost no difference was recognized in yield strength between the composites. In contrast, a large difference was recognized in maximum strength and ductility between the composites. (2) Inferior mechanical properties of W-Ag composite to W-Cu composite are attributed to heterogeneous distribution of Ag-phases, whilst inferior mechanical properties of W-(BAg-8) composite to W-Cu composite are attributed to large pores at grain boundaries.

• Proceedings of the Materials Research Society of Korea Conference
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• 2006.05a
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• pp.25.2-25.2
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• 2006

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.141-145
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• 2001

Sn-3.5Ag 무연 솔더에 Cu를 첨가한 3원계 합금을 만든 후 압연과 열처리한 후 크리프 특성을 연구하였다. 모든 솔더 합금에서 1차 크리프는 거의 관찰되지 않았으며, 2차와 3차 크리프가 대부분을 차지하였고, 최소 크리프 변형율은 Cu 함량이 0.75 wt %에서 최소이었고, 응력 지수는 약 4이었으며, 파단 시간 또한 0.75 wt% Cu에서 가장 길었다. 크리프 기구는 격자 확산에 의한 전위의 상승과 전위 활주에 의한 고온 크리프임을 앞 수 있었으며, Cu의 첨가는 1 wt% 가지 연성에 큰 영향을 주지 않았으나, 1.5 wt% 첨가했을 경우 연성은 크게 감소하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.04a
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• pp.225-228
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• 1997

YBa$_2$Cu$_3$O$_{x}$ samples with different amounts of $Y_2$BaCuO$_{5}$ were prepared by MPMG (Melt Powder Melt Growth) method. The effects on the size of initial particles and Ag addition for $Y_2$BaCuO$_{5}$ distribution in YBa$_2$Cu$_3$O$_{x}$ were invesgated. The samples prepared by the melting process usually have large grains up to several ㎣ and precipitates of $Y_2$BaCuO$_{5}$. The distribution of the $Y_2$BaCuO$_{5}$ particles in the samples depends on the size of initial particles and the amounts of Ag addition.Ag addition.

• Journal of the Speleological Society of Korea
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• no.76
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• pp.15-17
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• 2006

[ $YBa_2Cu_3O_{7-{\delta}}$ ] superconductor films have been prepared on silver substrates by electrophoretic deposition. As silver does not react with $YBa_2Cu_3O_{7-{\delta}}$ compound and has little influence on its superconductivity, it is usually doped in $YBa_2Cu_3O_7$ to improve the strength of the material and eliminate micro cracks. It has been proved that Ag additive can lower the melting temperature of $YBa_2Cu_3O_{7-{\delta}}$ and act as linking bridge among $YBa_2Cu_3O_{7-{\delta}}$ particles, thus in this paper Ag doped $YBa_2Cu_3O_{7-{\delta}}$ thick films are prepared by electrophoretic co deposition. As there are only some referenced experience formula and models for co electrophoretic deposition and does not exist unified explanation, the behavior of Ag particles during co electrophoretic deposition is also studied.