• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.439-449
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• 2002

This paper reviews our recent research works on the interconnection technologies in electronic packaging and assembly. At the aspect of advanced joining methods, laser-ultrasonic fluxless soldering technology was proposed. The characteristic of this technology is that the oxide film was removed through the vibration excitated by high frequency laser change in the molten solder droplet. Application researches of laser soldering technology on solder bumping of BGA packages were carried out. Furthermore, interfacial reaction between SnPb eutectic solder and Au/Ni/Cu pad during laser reflow was analyzed. At the aspect of soldered joints' reliability, the system for predicting and analyzing SMT solder joint shape and reliability(PSAR) has been designed. Optimization design method of soldered joints' structure was brought forward after the investigation of fatigue failure of RC chip devices and BGA packages under temperature cyclic conditions with FEM analysis and experimental study. At the aspect of solder alloy design, alloy design method based on quantum was proposed. The macroproperties such as melting point, wettability and strength were described by the electron parameters. In this way, a great deal of the experimental investigations was replaced, so as to realize the design and research of any kinds of solder alloys with low cost and high efficiency.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.183-188
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• 2002

With the contact pad consisted of $0.5{\mu}{\textrm}{m}$ $Au/5{\mu}{\textrm}{m}$ Ni/Cu layers on a conventional ball grid array(BGA) substrate, metallurgical reaction properties between the pad and In-15(wt.%)Pb-5Ag solder alloy were studied after reflow and solid aging. In as-reflow condition, thin AuIn$_2$or Ni$_{28}$In$_{72}$ intermetallic layer was formed at the solder/pad interface according to reflow time. Dissolution of the Au layer into the molten solder was remarkably limited in comparison with eutectic Sn-37Pb alloy. After solid aging of 300 hrs, thickness of In-Ni layer increased to about $2{\mu}{\textrm}{m}$ in the both as-reflow case. It was observed that In atoms diffuse through the AuIn$_2$phase to react with underlaying Ni layer. The metallurgical reaction properties between In-l5Pb-7Ag alloy and Au/Ni surface finish were analysed to result in suppression of Au-embrittlement in the solder joints.

• 품질경영학회지
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• 제45권4호
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• pp.1003-1020
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• 2017

Purpose: The purpose of this study is to find the optimum working conditions for spot welding of wire Cu alloys to achieve high-level quality. The parts subject to spot welding are brush card assemblies, which are the main module of the electric movement method of the car seat. Methods: In this study, the signal-to-noise ratio(SN ratio) and the loss function [L(y)] are used as Taguchi method for dynamic characteristics. Results: The results of the study are as follows. First, the analysis of variance using SN ratio showed 6 significant factors(p = 0.1% or less) among 7 factors except press force. Second, the optimal design of the dynamic characteristics is the tip exchange cycle: 50,000 ea., the welding time is 110 ms, the pressing force is 11 kgf/cm2, the rise time is 40 ms, and the tip dressing is 3,000 ea., Tip angle is 12o and electric current is 1,800 A. Conclusion: The validity of the spot welding process of the manufacturer's brush card assembly was verified and proved to be consistent with the study results. The results of this study are expected to standardize the welding conditions and guarantee the quality level required by the customers.

• 한국정밀공학회지
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• 제29권12호
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• pp.1346-1350
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• 2012

Contact wire is one of the most important components supplying electricity to railroad cars. At the beginning of the research on contact wire, wear problem caused by friction between contact wire and pantograph was considered even more important issue for the failure of contact wire. However, since several fatigue fractures were reported from Shinkansen in Japan, fatigue fracture has become another important issue for the failure of contact wire. Despite of its importance, standard of the fatigue test of contact wire has not been established yet. Thus, fatigue characteristics of contact wire is very difficult issue to evaluate quantitatively. Hence, in this study, test method simulating operating conditions of contact wire by Minsung Kang and etc. is used to evaluate the fatigue characteristics of copper alloy contact wire. Also, test results is compared with the result of Minsung Kang's research on pure copper contact wire.

• Restorative Dentistry and Endodontics
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• 제9권1호
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• pp.81-87
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• 1983

The purpose of this study was to observe and identify the phases of amalgam and to know the transformation of microstructure in the set amalgam by lapse of time. In this study, shofu spherical-D alloy was used. After trituration of amalgam alloy and mercury (Wig-L-Bug), it was filled in the stone dies. This specimens being polished and etched by usual method was observed under optical microscope using metallurgical microscope. And then X-ray diffractometer was used to analyze the phases contents and transformation of microstructure at $2{\frac{1}{2}}$ hours, 15 hours, 28 hours and 2 years after being amalgamated. The following results were obtained: 1. Shofu spherical-D alloy powder was composed of ${\gamma}$ phase, ${\epsilon}$phase and Ag-Cu eutectic phases. 2. ${\gamma}_2$ phases were appeared at $2{\theta}$ values ($32.0^{\circ}$ and $43.8^{\circ}$) in the amalgam which was analyzed at $2{\frac{1}{2}}$ hours and 15 hours after trituration with mercury. 3. In the amalgam at 28 hours, ${\gamma}_2$ phase was found at $2{\theta}$ value ($43.8^{\circ}$) at 35 hour, $r_2$ phase was appeared at $2{\theta}$ value $32.0^{\circ}$. 4. No ${\gamma}_2$ phases were observed in the 2 years old amalgam. But ${\eta}$ ($Cu_6Sn_5$) phases were found at $2{\eta}$ values $29.4^{\circ}$ and $42.4^{\circ}$.

• Corrosion Science and Technology
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• 제6권6호
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• pp.282-285
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• 2007

Smaller size and higher integration of electronic systems make narrower interconnect pitch not only in chip-level but also in package-level. Moreover electronic systems are required to operate in harsher conditions, that is, higher current / voltage, elevated temperature / humidity, and complex chemical contaminants. Under these severe circumstances, electronic components respond to applied voltages by electrochemically ionization of metals and conducting filament forms between anode and cathode across a nonmetallic medium. This phenomenon is called as the electrochemical migration. Many kinds of metal (Cu, Ag, SnPb, Sn etc) using in electronic packages are failed by ECM. Eutectic SnPb which is used in various electronic packaging structures, that is, printed circuit boards, plastic-encapsulated packages, organic display panels, and tape chip carriers, chip-on-films etc. And the material for soldering (eutectic SnPb) using in electronic package easily makes insulation failure by ECM. In real PCB system, not only metals but also many chemical species are included. And these chemical species act as resources of contamination. Model test systems were developed to characterize the migration phenomena without contamination effect. The serpentine-shape pattern was developed for analyzing relationship of applied voltage bias and failure lifetime by the temperature / humidity biased(THB) test.

• 한국분말재료학회지
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• 제20권1호
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• pp.33-36
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• 2013

A bulk metallic glass-forming alloy, $Ni_{59}Zr_{20}Ti_{16}Si_2Sn_3$ metallic glass powders was used for good commercial availability and good formability in supercooled liquid region. In this study, the Ni-based metallic glass was synthesized using by high pressure gas atomized metallic glass powders. In order to create a bulk metallic glass sample, the $Ni_{59}Zr_{20}Ti_{16}Si_2Sn_3$ metallic glass powders with ball-milled Ni-based amorphous powder with 40%vol brass powder and Cu powder for 20 hours. The composite specimens were prepared by Spark Plasma Sintering for the precursor. The SPS was performed at supercooled liquid region of Ni-based metallic glass. The amorphous structure of the final sample was characterized by SEM, X-ray diffraction and DSC analysis.

• Journal of Welding and Joining
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• 제32권3호
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• pp.74-80
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• 2014

Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and automotive electronics have to eliminate toxic substance from their devices and system. Especially, reliability issue of lead-free solder joint is increasing in car electronics due to ELV (End-of-Life Vehicle) banning from 2016. We have prepared engine control unit (ECU) modules soldered with Sn-40Pb and Sn-3.0Ag-0.5Cu (SAC305) solders, respectively. Degradation characteristics of solder joint strength were compared with various conditions of automobile environment such as cabin and engine room. Thermal cycle test (TC, $-40^{\circ}C$ ~ ($85^{\circ}C$ and $125^{\circ}C$), 1500 cycles) were conducted with automotive company standard. To compare shear strength degradation rate with eutectic and Pb-free solder alloy, we measured shear strength of chip components and its size from cabin and engine ECU modules. Based on the TC test results, finally, we have known the difference of degradation level with solder alloys and use environmental conditions. Solder joints degradation rate of engine room ECU is superior to cabin ECU due to large CTE (coefficient of thermal expansion) mismatch in field condition. Degradation rate of engine room ECU is 50~60% larger than cabin room electronics.

• 열처리공학회지
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• 제18권4호
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• pp.235-241
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• 2005

Thermal creep properties of the advanced zirconium fuel claddings named by HANA alloys which were developed for high burn-up application were evaluated. The creep test of HANA cladding tubes was carried out by the internal pressurization method in temperature range from 350 to $400^{\circ}C$ and in the hoop stress range from 100 to 150 MPa. Creep tests were lasted up to 800 days, which showed the steady-state secondary creep rate. The creep resistance of HANA fuel claddings was affected by final annealing temperature and various factors, such as alloying element, applied stress and testing temperature. From the results the microstructure observation of the samples before and after creep test by using TEM, the dislocation density was increased in the sample of after creep test. The Sn as an alloying element was more effective in the creep resistance than other elements such as Nb, Fe, Cr and Cu due to solute hardening effect of Sn. In case of HANA fuel claddings, the improved creep resistance was obtained by the control of final heat treatment temperature as well as alloying element.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 International Symposium
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• pp.261-278
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• 2003

Concepts.Wafer-Level Chip-Scale Concept with Handling Substrate.Low Accuracy Placement Layout with Isolation Trench.Possible Pitch of Interconnections down to $10{\mu}{\textrm}{m}$ (Sn-Grains).Wafer-to-Wafer Equipment Adjustment Accuracy meets this Request of Alignment Accuracy (+/-1.5 ${\mu}{\textrm}{m}$).Adjustment Accuracy of High-Speed Chip-to-Wafer Placement Equipment starts to meet this request.Face-to-Face Modular / SLID with Flipped Device Orientation.interchip Via / SLID with Non-Flipped Orientation SLID Technology Features.Demonstration with Copper / Tin-Alloy (SLID) and W-InterChip Vias (ICV).Combination of reliable processes for advanced concept - Filling of vias with W as standard wafer process sequence.No plug filling on stack level necessary.Simultanious formation of electrical and mechanical connection.No need for underfiller: large area contacts replace underfiller.Cu / Sn SLID layers $\leq$ $10{\mu}{\textrm}{m}$ in total are possible Electrical Results.Measurements of Three Layer Stacks on Daisy Chains with 240 Elements.2.5 Ohms per Chain Element.Contribution of Soldering Metal only in the Range of Milliohms.Soldering Contact Resistance ($0.43\Omega$) dominated by Contact Resistance of Barrier and Seed Layer.Tungsten Pin Contribution in the Range of 1 Ohm