• Journal of the Korean Society for Heat Treatment
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• v.10 no.1
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• pp.20-29
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• 1997

Pure copper is widely used for base material for electrical and electronic parts because of its good electrical conductivity. However, it has such a low strength that various alloying elements are added to copper to increase its strength. Nevertheless, alloying elements which exist as solid solution elements in copper matrix severely reduce the electrical conductivity. The reduction of electrical conductivity can be minimized and the strengthening can be maximized by TMT(Thermo-Mechanical Treatment) in copper alloys. In this research, the effects of TMT on mechanical and electrical properties of Cu-Ni-Al-Si-P, Cu-Ni-Al-Si-P-Zr and Cu-Ni-Si-P-Ti alloys aged at various temperatures were investigated. The Cu alloy with Ti showed the hardness of Hv 225, electrical conductivity of 59.8%IACS, tensile strength of 572MPa and elongation of 6.4%.

• Korean Journal of Environmental Biology
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• v.22 no.1
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• pp.120-126
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• 2004

Kenaf plants were hydroponically grown in reactor containing toxic metals as Cd, Cu, Cr, Ni and Zn to examine the ability to take up heavy metal. The plants were fertilized using a nutrient solution, which was appropriately adjusted to optimum pH, DO and conductivity. For n hydraulic retention time of 8 days, Cr, Cd, Cu, Ni and Zn were removed up to 90.5, 80.5, 66.1%, 71.1% and 79.4%, and reduced from 2.34 to 0.54 mg $L^{-1}$, 3.37 to 1.07 mg $L^{-1}$, 4.92 to 3.19 mg $L^{-1}$, 6.31 to 4.41 mg $L^{-1}$ and 6.27 to 2.09 mg $L^{-1}$. Especially, accumulation rate of Cr, Cd, Cu, Ni and Zn in the plant were measured up to 347.32, 275.39, 157.52, 50.48 and 211.01 mg DW kg $L^{-1}d^{-1}$, respectively. We considered that Kenaf plants removed Cr, Cd and Zn more effectively than other toxic metals applied.

• Journal of Korean Society for Atmospheric Environment
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• v.2 no.3
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• pp.57-63
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• 1986

Atmospheric particulate matter (A.P.M.) was collected on quartz fiber filters from March 1985 to May 1986 according to particle size using Andersen high-volume air sampler, and 6 heavy metals (Fe, Mn, Cu, Ni, Zn, Pb) in these particulates were analyzed by atomic absorption spectrophotometry. The arithmetic mean concentration of A.P.M. was 195.57$\mug/m^3$. The arithmetic mean concentrations of 6 metals (Fe, Mn, Cu, Ni, Zn and Pb) were 3385.04, 1451.67, 897.94, 159.68, 127.14 and 59.49 $ng/m^3$ respectively. The order of heavy metals contributing to A.P.M. was as follows: Fe > Zn > Pb > Cu > Mn > Ni. These heavy metals were devided into 3 groups according to their particle size distribution. The contents of heavy metals belonging to the 1st group (Fe, Mn) were increased with the particle size. On the contrary, the content of Pb belonging to the 2nd group (Pb) was increased with the decrease in the particle size. The heavy metal contents in the 3rd group (Ni, Cu, Zn) were lowest in the particle size range of 2.0-3.3 $\mum$ compared with particles larger or smaller tha this range. The seasonal variation of heavy metal concentration were as follows: Fe and Mn contents were highest in spring, but Ni and Pb contents were highest in winter. Statistical analysis showed that there was a significant correlation between A.P.M. and Fe in coarse particles, meanwhile between A.P.M. and Pb in the case of fine particles.

• Journal of the Korean Chemical Society
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• v.33 no.3
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• pp.315-320
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• 1989

A method was presented for the analysis of trace metals in iron oxide ore. The method utilized ammonium pyrrolidinedithiocarbamate (APDC)-methyl isobutyl ketone (MIBK) extraction procedure and analysis by atomic absorption spectroscopy (AA). Citrate at pH $8{\sim}10$ for the determination of Co, Ni and Cu or tiron at pH $6{\sim}7$for the determination of Mn and Cu was added as a masking agent to prevent extraction of Fe(III) into the organic phase. Reduction of solubility of MIBK in water was achieved by addition of NaCl as a salting-out agent. Back extraction of the MIBK extracts with aqueous $HNO_3$ was also studied to increase the stability of metal extracts.

• Resources Recycling
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• v.9 no.3
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• pp.3-12
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• 2000

A Study on the cementation for the recovery of Cu, Ni and Co with Mn metallic powders in leaching solution from the manganese nodule that have removed Fe ions was studied. The results showed that the recovery efficiencies of metal ions with Mn powders increased when the temperature, pH and the concentration of chloride ions were increased in mixed solution. And the recovery efficiencies of Cu was 98% and not changed with the addition amounts of Mn powders but, in case of Co and Ni, the recovery efficiencies were increased with the addition amounts. The particle size of precipitate was about $5\mu\textrm{m}$. From the results of experiment we proposed the two-step cementation process for the recovery of Cu, Ni and Co with Mn powders.

• Journal of Powder Materials
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• v.16 no.4
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• pp.268-274
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• 2009

For the purpose of obtaining basic information on the development of lead-free materials, a high density composites (a) W-Cu, (b) W-Sn (c)W-Cu-Sn and (d) W-Cu-Ni were fabricated by the P/M method. The particle size of used metal powders were under 325 mesh, inner size of compaction mould was $\phi8$ mm, and compaction pressure was 400 MPa. A High density composite samples were sintered at a temperature between $140^{\circ}C$ and $1050^{\circ}C$ for 1 hour under Ar atmosphere. The microstructure, phase transformation and physical properties of the sintered samples were investigated. As the results, the highest relative density of 95.86% (10.87 g/$cm^3$) was obtained particularly in the sintered W-Cu-Sn ternary system sample sintered at 450 for 1hr. And, Rockwell hardness (HRB) of 70.0 was obtained in this system.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.3
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• pp.27-33
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• 2008

With increasing use of portable appliances such as PDA and cellular phone, changing environment of applications requires higher solder joint reliability. The ENIG (Electroless Nickel Immersion Gold) process has been widely used for fine pitch SMT (Surface Mount Technology) and BGA (Ball Grid Array) packaged devices due to its benefits including excellent solderability, high uniformity and substantial legibility throughout the packaging process. Its brittle fracture of solder, however, has received increasingly attentions. It was Down that fracture brittleness is mainly related with black pad resulting from galvanic nickel corrosion and P-enriched layer formation between the IMC (Intermetallic Compounds) and electroless nickel layer. Theoretically, smooth electroless Ni layer was blown to have a advantages in minimizing the black pad phenomenon by uniform solution exchange during immersion gold plating. Nevertheless, how to control the surface morphology of electroless Ni layer has been hardly blown. This study investigates an effect of surface morphology of Cu underlayer on surface morphology of electroless Ni layer. To obtain various kinds of surface morphology of Cu layer, two types of Cu etching chemical and a number of Cu etching treatment were applied.

• Applied Chemistry for Engineering
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• v.9 no.4
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• pp.504-508
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• 1998

Experimental investigation on the adsorption of heavy metal confounds as $Fe^{2+}$, $Cu^{2+}$, $Mn^{2+}$, $Zn^{2+}$, $Ni^{2+}$, $Pb^{2+}$, $Cd^{2+}$, $Cr^{6+}$ using chitosan was carried out. The adsorption of each component of heavy metal compounds was measured by Atomic Absorption apparatus. The range of optimum pH for the removal rates of heavy metal compounds was found pH 7.0~9.0. The maximum time for the removal rate of $Fe^{2+}$ was observed about 15 min. The maximum time for the removal raters of $Cu^{2+}$, $Mn^{2+}$, $Zn^{2+}$, $Ni^{2+}$, $Pb^{2+}$, $Cd^{2+}$, and $Cr^{6+}$ was observed about 25 min. The adsorption rates of heavy metal compounds by chitosan have been found in the order of $Fe^{2+}>Cu^{2+}>Mn^{2+}>Zn^{2+}>Ni^{2+}>Pb^{2+}>Cd^{2+}>Cr^{6+}$.

• Bulletin of the Korean Chemical Society
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• v.11 no.5
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• pp.379-383
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• 1990

$YBa_2Cu_{3-x}Ni_xO_{7-{\delta}}$, with x = 0.05, 0.2, 0.4, 0.7 and 1.0 had been prepared by the thermal decomposition of corresponding nitrates. Among them, the sample with x = 0.05 shows above-liquid-$N_2$ temperature superconductivity with $T_c$ of 88.7K. According to the X-ray diffraction analysis, its crystal symmetry was estimated as orthorhombic with the lattice parameters of a = 3.866${\AA}$, b = 3.893${\AA}$, c = 11.715${\AA}$. The chemical composition of the sample was determined by electron probe microanalysis and the chemical composition around its grain boundaries was carefully studied by the X-ray line scanning technique. From the observed binding energy of Ni-$2p_{3/2}$ orbital electron (B.E. = 853 eV) measured by X-ray photoelectron spectroscopy, the valency state of nickel stabilized in $YBa_2Cu_{2.95}Ni_{0.05}O_{7-{\delta}}$ oxide lattice could be determined to be Ni(II).

• Proceedings of the KWS Conference
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• 2006.05a
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• pp.21-23
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• 2006

The microstructural investigation and thermo-mechanical reliability evaluation of the Sn-3.0Ag-0.5Cu solder bumped flip chip package were carried out during the thermal shock test of the package. In the initial reaction, the reaction product between the solder and Cu mini bump of chip side was Cu6Sn5 layer, while the two phases which were (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 were formed between the solder and Ni-P layer of the package side. The cracks were occurred at the corner solder joints after the thermal shocks of 400 cycles. The primary failure mechanism of the solder joints in this type of package was confirmed to be thermally activated solder fatigue failure.