• Journal of the Korea Institute of Military Science and Technology
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• v.14 no.6
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• pp.1018-1025
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• 2011

The improved properties of corrosion for 90Cu10NiFe alloy in natural seawater were explained by sodium diethyl dithio carbamate(NaDDC), namely organic compound, which is reagent for heavy metal extractions of waste water. The efficiency of NaDDC as corrosion inhibitor for 90Cu10NiFe alloy has been investigated in seawater after immersion in various concentrations of NaDDC solutions for 12~36hrs at pH 8.2 by weight loss test and electrochemical techniques including potentiodynamic polarization and SEM-EDS measurements. The results showed that the corrosion resistance of 90Cu10NiFe alloy improves with the increasing concentration of NaDDC but it did not improves with increasing time any more, so the highest inhibition efficiency was 93% at 100mg/L, 36hrs. The results obtained from weight losses and corrosion rates in polarization curve measurements were in good agreement. Therefore, it showed that NaDDC is a good inhibitor for copper corrosion of 90Cu10NiFe alloy.

• Journal of Korea Foundry Society
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• v.22 no.1
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• pp.42-48
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• 2002

Effects of coating treatment of metallic Cu, Ni-P film on $SiC_p$, for $SiC_p$/iron aluminide composites were studied. Porous hybrid preforms were fabricated by reactive sintering after mixing the coated $SiC_p$, Fe and Al powders. Then the final composites were manufactured by squeeze casting after pouring AC4C Al alloy melts in preforms. The change of reactive temperature, density, microstructure of the preforms and microstructure of the composites were investigated. The exprimental results were summarized as follows. The thickness of Cu and Ni-P metallic layer formed on $SiC_p$ by electroless plating method were about $0.5{\mu}m$ and coated uniformly. There was no remakable change in the ignition temperature with variation of the mixing ratio of Fe and Al powder while in the case of coated $SiC_p$ it was lower about $20^{\circ}C$ than in the non-coated $SiC_p$. The maximum reaction temperature increased with increasing Al contents, but decreased with increasing $SiC_p$ contents. Expansion ratio of preform after reactive sintering increased with amount of Cu coated $SiC_p$. In the case of Fe-70at.%Al, the expansion ratio was about 7% up to 8wt.% of $SiC_p$, addition but further addition of $SiC_p$, increased the ratio significantly. And in the case of Fe-50 and 60at.%Al, it was about 20% up to 16wt.% of $SiC_p$ addition and about 28% in 24wt.% of $SiC_p$, addition. The microstructures of compounds showed that the grains became finer as amount of $SiC_p$, and mixing ratio of iron powder increased and the shape of compounds was changed gradually from irregular to spheroidal.

• Journal of the Korean Magnetics Society
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• v.12 no.6
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• pp.212-217
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• 2002

The pseudo spin valve with a structure of Tl/CoFe(t $\AA$)/Cu(30 $\AA$)/NiFe(50 $\AA$)/Ta, showing giant magnetoresistance properties by utilizing coercivity difference between only two soft ferromagnetic layers were produced by d.c UHV magnetron sputtering system. In pseudo spin valve Ta/CoFe/Cu/NiFe/Ta, the magnetic and magnetoresistance properties with change of CoFe thickness were investigated. When the thickness of CoFe was 60 $\AA$, a typical MR curve of pseudo spin valve structure was obtained, showing MR ratio of 3.8 cio and the coercivity difference of 27.4 Oe with a sharp change of hard layer switching. When the CoFe thickness was varied from 20 to 100 $\AA$, coercivity difference between two layers was increased to 40 $\AA$. and decreased to 100 $\AA$ gradually. It is thought the change in coercivity of hard layer was due to the crystallinity and magnetostriction of thin CoFe layer. In order to improve the MR property in CoFe/Cu/NiFe trier layer structure, CoFe layer with change of 2-20 $\AA$ thick was inserted between Cu and NiFe. When the thickness of CoFe was 10 $\AA$, MR ratio was 6.7％, showing excellent MR property. This indicates 50 ％ higher than that of CoFe/Cu/NiFe pseudo spin valve.

• Journal of Welding and Joining
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• v.35 no.3
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• pp.1-6
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• 2017

The effect of metal turnover (MTO) of electroless Ni plating bath on the brittle fracture behavior of electroless nickel electroless palladium immersion gold (ENEPIG)/Sn-3.0wt%Ag-0.5wt%Cu(SAC305) solder joint was evaluated in this study. The MTOs of the electroless Ni for the ENEPIG surface finish were 0 and 3. As the MTO increased, the interfacial IMC thickness increased. The brittle fracture behavior of the ENEPIG/SAC305 solder joint was evaluated with high speed shear (HSS) test. The HSS strength decreased with increasing the MTO of the electroless Ni bath. The brittle fracture increased with increasing the shear speed of the HSS test. The percentage of the brittle fracture for the 3 MTO sample was much higher than that for the 0 MTO sample.

• Journal of Plant Biology
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• v.16 no.3_4
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• pp.40-44
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• 1973

Hawkeye(Fe-chlorosis resistant) and PI 54619-5-1(Fe-chlorosis sensitive) soybeans were grown with and without DPTA(diethylene triamine pentaacetic acid) in Yolo loam soil. The major purpose of the study was to compare leaf-stem distribution of microelements for different treatments which increase concentrations of microelements in plants to evaluate the role of the chelating agent in increasing translocation of the microelements. Plant responses and yields were recorded and Fe, Mn, Zn, Cu, Al, Co, N, Sn, Pb and Mo contents of leaves and stems were determined by emission spectrography. Sulfur(soil pH4) increased leaf concentrations of Mn, Zn, Cu, CO, Ni, Sn and Pb. DTPA, particularly at 50ppm in soil, increased leaf concentrations of Fe, Mn, Zn, Cu, Co, Ni and Mo. It increased Ti in leaves for the PI 54619-5-1 soybeans only. DTPA increased the ratios of the concentration in leaves to that in stems for Fe, Zn, Cu, Al, Ti, CO, Ni and Mo. Sulfur which increased the microelement concentration in both leaves and stems did not have this effect. DTPA increased the ratio at soil pH 6 and 8.5 in leaves to that in stems of the bush bean plants for Fe, Zn, Cu, Ni, but to a lesser extent in bush beans than in soybeans. PI 54619-5-1 soybeans tended to contain less of most of the metals than did Hawkeye soybeans.

• Journal of Electrochemical Science and Technology
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• v.7 no.3
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• pp.190-198
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• 2016

Application of fuel cell to produce renewable energy for commercial purpose is limited by the high cost of Pt based electrode materials. Development of inexpensive, high energetic electrode is the need of the hour to produce pollution free energy using bio-fuel through a fuel cell. Ni-Cu and Ni-CeO₂-Cu electrode materials, electro synthesized by pulse current have been developed. The surface morphology of the electrode materials is controlled by different deposition parameters in order to produce a high current from the electro-oxidation of the fuel, the ethanol. The developed materials are electrochemically characterized by Cyclic Voltammetry (CV), Chronoamperometry (CA) and Potentiodynamic polarization tests. The results confirm that the high current is due to their enhanced catalytic properties viz. high exchange current density (i₀), low polarization resistance (R_p) and low impedance. It is worthwhile to mention here that the addition of CeO₂ to Ni-Cu has outperformed Pt as far as the high electro catalytic properties are concerned; the exchange current density is about eight times higher than the same on Pt surface. The morphology of the electrode surface examined by SEM and FESEM exhibits that the grains are narrow and sub spherical with 3D surface, containing vacancies in between the elongated grains. The fact has enhanced more surface area for electro oxidation of the fuel, giving rise to an increase in current. Presence of Ni, CeO₂, and Cu is confirmed by the XRD and EDXS. Fuel cell fabricated with Ni-CeO₂-Cu material electrode is expected to produce clean electrical energy at cheaper rates than conventional one, using bio fuel the derived from biomass.

• Korean Journal of Materials Research
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• v.12 no.9
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• pp.750-760
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• 2002

In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu were screen printed on both electroless Ni/Au and OSP metal finished micro-via PCBs (Printed Circuit Boards). The interfacial reaction between PCB metal pad finish materials and solder materials, and its effects on the solder bump joint mechanical reliability were investigated. The lead free solders formed a large amount of intermetallic compounds (IMC) than Sn-37Pb on both electroless Ni/Au and OSP (Organic Solderabilty Preservatives) finished PCBs during solder reflows because of the higher Sn content and higher reflow temperature. For OSP finish, scallop-like $Cu_{6}$ /$Sn_{5}$ and planar $Cu_3$Sn intermetallic compounds (IMC) were formed, and fracture occurred 100% within the solder regardless of reflow numbers and solder materials. Bump shear strength of lead free solders showed higher value than that of Sn-37Pb solder, because lead free solders are usually harder than eutectic Sn-37Pb solder. For Ni/Au finish, polygonal shaped $Ni_3$$Sn_4$ IMC and P-rich Ni layer were formed, and a brittle fracture at the Ni-Sn IMC layer or the interface between Ni-Sn intermetallic and P-rich Ni layer was observed after several reflows. Therefore, bump shear strength values of the Ni/Au finish are relatively lower than those of OSP finish. Especially, spalled IMCs at Sn-3.5Ag interface was observed after several reflow times. And, for the Sn-3.8Ag-0.7Cu solder case, the ternary Sn-Ni-Cu IMCs were observed. As a result, it was found that OSP finished PCB was a better choice for solders on PCB in terms of flip chip mechanical reliability.

• Journal of Surface Science and Engineering
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• v.49 no.1
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• pp.54-61
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• 2016

Screen printing of commercially available Ag paste is the most widely used method for the front side metallization of Si solar cells. However, the metallization using Ag paste is expensive and needs high temperature annealing for reliable contact. Among many metallization schemes, Ni/Cu/Sn plating is one of the most promising methods due to low contact resistance and mass production, resulting in high efficiency and low production cost. Ni layer serves as a barrier which would prevent copper atoms from diffusion into the silicon substrate. However, Ni based schemes by electroless deposition usually have low thermal stability, and require high annealing process due to phosphorus content in the Ni based films. These problems can be resolved by adding W element in Ni-based film. In this study, Ni-W-P alloys were formed by electroless plating and properties of it such as sheet resistance, resistivity, specific contact resistivity, crystallinity, and morphology were investigated before and after annealing process by means of transmission line method (TLM), 4-point probe, X-ray diffraction (XRD), and Scanning Electron Microscopy (SEM).

• Journal of the Korean Magnetics Society
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• v.5 no.6
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• pp.928-936
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• 1995

In this research, the processing control of NiCuZn Ferrite has been developed. The mixing and the size reduction of raw materials have been proceeded. In order to produce NiCuZn Ferrite, highly concentrated slurry with fixed ratio and wet ball milling were used. First, the dispersion behavior of raw mixture at the region of pH4~pH11 has been studied. Using wet ball milling operation, the best conditions of mixing and size reduction have been determined. Further more, the most suitable conditions, such as, dispersant kind, dispersant amount, milling time, and slurry concentration have been studied. The poly acrylic ammonium salt (PAN) was chosen as a suitable dispersant to have effective dispersion in basic region. The slurry of raw mixture without dispersant, showed high viscosity and poor grindability. As 0.7 wt% of PAN was added, the concentrated slurry (up to 55 vol%) was possible, and showed well grindability. After 18 h ball milling of 30 vol% of mixture slurry with 0.7 wt% of PAN, the average particle size and specific surface area of raw mixture were $0.54\mu\textrm{m}$ and $12.92m^{2}/cc$, respectively. The ball milled raw mixture, calcined at $700^{\circ}C$ for 3h, was totally changed into NiCuZn Ferrite with spinel phase.

• Resources Recycling
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• v.8 no.5
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• pp.44-50
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• 1999

The sbdy iwestlgaled ihc propa-ties of Lhe dust\ulcorner rrom fe~~oallomya ~~ufacturTeh. e chemical composition, cornpasitlon material, p d c l e sire md shapes of the bulk dust, sired dust and magnetically separated durl were mvesligaled. As the re\ulcornerulL, we suppose that the dust from &gh Carbon Fenama~~gunesMc anuiact~vingP rocess is not sufiicient as solulce material of Mn because of ale low Mn canlenl (13.5%) and complicaled composition mate~ial. The dust from Bug F!lter or AOD Proccss is mi~inlym ade up of 0.2-2 pm Mn30, (Hausmam~iu)p iutlde in spherical shape and thc Mn content is 63.190.The dust from Cooler of AOD Process is inninly made up of coarse Ca(O1-Or)zM. n,FeyO,, SiO, and fine Mn30d.