• 대한치과교정학회지
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• 제48권3호
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• pp.153-162
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• 2018

Objective: The aim of this trial was to compare the alignment efficiency and intermaxillary arch dimension changes of nickel-titanium (NiTi) or copper-nickel-titanium (CuNiTi) round archwires with increasing diameters applied sequentially to the mandibular arch. Methods: The initial alignment phase of fixed orthodontic treatment with NiTi or CuNiTi round archwires was studied in a randomly allocated sample of 66 patients. The NiTi group comprised 26 women, 10 men, and the CuNiTi ($27^{\circ}C$) group comprised 20 women, 10 men. The eligibility criteria were as follows: anterior mandibular crowding of minimum 6 mm according to Little's Irregularity Index (LII), treatment requiring no extraction of premolars, 12 to 18 years of age, permanent dentition, skeletal and dental Class I malocclusion. The main outcome measure was the alignment of the mandibular anterior dentition; the secondary outcome measure was the change in mandibular dental arch dimensions during 12 weeks. Simple randomization (allocation ratio 1:1) was used in this single-blind study. LII and mandibular arch dimensions were measured on three-dimensional digital dental models at 2-week intervals. Results: No statistically significant difference was observed between NiTi and CuNiTi according to LII (p > 0.05). Intercanine and intermolar arch perimeters increased in the CuNiTi group (p < 0.001). Inter-first premolar width showed a statistically significant interaction in week ${\times}$ diameter ${\times}$ application (p < 0.05). Conclusions: The effects of NiTi and CuNiTi round archwires were similar in terms of their alignment efficiency. However, the intercanine and intermolar arch perimeters, and the inter-first premolar width changes differed between groups.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.85-91
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• 2002

Even though electroless Hi and Sn-Ag-Cu solder are widely used materials in electronic packaging applications, interfacial reactions of the ternary Ni-Cu~Sn system have not been known well because of their complexity. Because the growth of intermetallics at the interface affects reliability of solder joint, the intermetallics in Ni-Cu-Sn system should be identified, and their growth should be investigated. Therefore, in present study, interfacial reactions between electroless Ni UB7f and 95.5Sn-4.0Ag-0.5Cu alloy were investigated focusing on morphology of the IMCs, thermodynamics, and growth kinetics. The IMCs that appear during a reflow and an aging are different each other. In early stage of a reflow, ternary IMC whose composition is Ni$_{22}$Cu$_{29}$Sn$_{49}$ forms firstly. Due to the lack of Cu diffusion, Ni$_{34}$Cu$_{6}$Sn$_{60}$ phase begins growing in a further reflow. Finally, the Ni$_{22}$Cu$_{29}$Sn$_{49}$ IMC grows abnormally and spalls into the molten solder. The transition of the IMCs from Ni$_{22}$Cu$_{29}$Sn$_{49}$ to Ni$_{34}$Cu$_{6}$Sn$_{60}$ was observed at a specific temperature. From the measurement of activation energy of each IMC, growth kinetics was discussed. In contrast to the reflow, three kinds of IMCs (Ni$_{22}$Cu$_{29}$Sn$_{49}$, Ni$_{20}$Cu$_{28}$Au$_{5}$, and Ni$_{34}$Cu$_{6}$Sn$_{60}$) were observed in order during an aging. All of the IMCs were well attached on UBM. Au in the quaternary IMC, which originates from immersion Au plating, prevents abnormal growth and separation of the IMC. Growth of each IMC is very dependent to the aging temperature because of its high activation energy. Besides the IMCs at the interface, plate-like Ag3Sn IMC grows as solder bump size inside solder bump. The abnormally grown Ni$_{22}$Cu$_{29}$Sn$_{49}$ and Ag$_3$Sn IMCs can be origins of brittle failure.failure.

• 한국분말재료학회지
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• 제6권1호
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• pp.36-41
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• 1999

The present work has attempted to investigate the dependence of Cu infiltration kinetics on in-situ structure modification of W powder skeleton in W-Cu system. In-situ structure modification of W skeleton by addition of 0.3wt%Ni-P eutectic alloy was designed to proceed during heat-up of the W compact for Cu infiltration process. It was found that the Ni-P added W skeleton underwent remarkable stucture change only during heating-up. its structure was composed of large necks of W particles above 0.5 in the ratio of neck to particle size and smooth pore channels. The infiltration experiment showed that the infiltration kinetics for the W-Ni-P followed well the linear relationship of h vs. $t^{1/2}$ the rate constant K of which was in good agreement with the theoretical value. On the other hand, in case of the pure W skeleton a lower K value by 20% than the theoretical one was obatined. Such discrepancy is discussed in terms of skeleton structure induced infiltration mechanics.

• 대한화학회지
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• 제40권1호
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• pp.50-58
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• 1996

일정한 pH에서 Co(II), Ni(II), Sr(II), Cu(II), Fe(III) 및 U(VI) 등의 금속이온농도가 증가할 수록 흄산의 침적율이 증가하였으며, Sr

• 한국전기전자재료학회논문지
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• 제24권4호
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• pp.328-332
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• 2011

The formation of front metal contact silicon solar cells is required for low cost, low contact resistance to silicon surface. One of the front metal contacts is Ni/Cu plating that it is available to simply and inexpensive production to apply mass production. Ni is shown to be a suitable barrier to Cu diffusion into the silicon. The process of Ni electroless plating on front silicon surface is performed using a chemical bath. Additives and buffer agents such as ammonium chloride is added to maintain the stability and pH control of the bath. Ni deposition rate is found to vary with temperature, time, utilization of bath. The experimental result shown that Ni layer by SEM (scanning electron microscopy) and EDX analysis. Finally, plated Ni/Cu contact solar cell result in an efficiency of 17.69% on $2{\times}2\;cm^2$, Cz wafer.

• 마이크로전자및패키징학회지
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• 제21권3호
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• pp.51-56
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• 2014

솔더조인트의 신뢰성에는 인쇄회로기판의 표면처리 특성이 많은 영향을 미치고 있다. 본 연구에서는 ENEPIG 표면처리에서 Sn-4.0wt%Ag-0.5wt%Cu (SAC405) 솔더와 Pd 촉매 처리 시간에 따른 high speed shear 에너지 및 파괴 모드를 연구하였다. 또한 Pd 촉매 처리 시간과 무전해 Ni-P 도금의 표면 거칠기 (Ra)와의 관계를 규명하였다. Pd 촉매 처리 시간이 길어질수록 Ni-P nodule의 면적은 넓어지고, Ni-P 도금의 표면 거칠기 (Ra)는 감소한다. 이러한 영향으로 질산 기상 처리한 시편의 high speed shear 평가후 quasi-brittle과 brittle 모드의 점유율은 감소한다. 이는 Pd 촉매 처리 시간의 증가가 SAC405 솔더조인트의 신뢰도를 향상시키는 역할을 한다는 것을 나타낸다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2011년도 춘계학술대회 및 Fine pattern PCB 표면 처리 기술 워크샵
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• pp.137-138
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• 2011

구리 이온은 -0.40V (vs. SCE)에서 전기화학적 환원이 일어나는 반면, 니켈 이온은 -1.19V (vs. SCE)에서 전착이 발생한다. 따라서, 단일 도금욕조 내에서 Ni-Cu 합금도금층을 제조하기 위해서는 두 금속 이온종 간의 전위차를 줄여주어야 하는데, 이를 위해 본 연구에서는 $Na_3C_6H_5O_7{\cdot}2H_2O$를 착화제로 사용하였다. 다양한 Ni-Cu 합금 도금층의 조성을 얻기 위하여 기본 도금욕 내 황산니켈과 황산구리의 비율을 10:1로 설정하였다. 도금 공정 조건에 따른 합금 도금층 조성 변화를 관찰하기 위하여 도금액 pH와 교반 속도에 따른 도금층 조성 변화를 분석하였으며, 도금액의 UV-VIS과 도금층의 XRD 와 SEM 측정을 통하여 도금욕과 도금층 간의 상관 관계를 유추하였다. 본 도금액에 사용된 $Na_3C_6H_5O_7{\cdot}2H_2O$ 착화제의 효과는 pH3에서 가장 현저하였으며, pH 변화 및 교반 속도 변화를 이용하여 다양한 합금 조성을 얻을 수 있었다.

• 한국세라믹학회지
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• 제52권4호
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• pp.264-268
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• 2015

Cu films were plated in an eco-friendly electroless bath (No-Formaldehyde) on Ni/screen printed Ag pattern/PET substrate. For electroless Cu plating, we used sodium-phosphinate ($NaH_2PO_2{\cdot}H_2O$) as reducing agent instead of Formaldehyde. All processes were carried out in electroless solution of pH 7 to minimize damage to the PET substrate. According to the increase of sodium-phosphinate, the deposition rate, the granule size, and rms roughness of the electroless Cu film increased and the Ni content also increased. The electroless Cu films plated using 0.280 M and 0.575 M solutions of sodium-phosphinate were made with Cu of 94 at.% and 82 at.%, respectively, with Ni and a small amount P. All electroless Cu plated films had typical FCC crystal structures, although the amount of co-deposited Ni changed according to the variation of the sodium-phosphinate contents. From these results, we concluded that a formation of higher purity Cu film without surface damage to the PET is possible by use of sodium-phosphinate at pH 7.

• 한국의류산업학회지
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• 제4권3호
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• pp.266-272
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• 2002

This research is compared and analyzed variations of the heavy metal contents in human hairs according to treating permanent wave manipulation before and after and permanent wave agents. This is the survey of women's hairs in 19 years old. On the basis of this we would like to analyze a extend of exposing of heavy metal scientifically. Also, we would to show a basic data for the permitted limits of heavy metal to keep the healthy hair The conclusion is as follows.; Mean contents of heavy metal in hairs is 2.11 ppm (Pb), 0.25 ppm (Cd), 2.62 ppm (Ni), 256 ppm (Zn), 8.45 ppm (Cu). In reducing agents (processing lotions) of perm, 1.50 ppm (Pb), 0.03 ppm (Cd), 0.05 ppm (Ni), 15.45 ppm (Zn), 0.86 ppm (Cu) in a perm (S), 2.30 ppm (Pb), 0.05 ppm (Cd), 0.05 ppm (Ni), 13.05 ppm (Zn), 0.65 ppm (Cu) in a perm (T). In oxidizing agents (neutralizer) of perm, 1.40 ppm (Pb), 0.03 ppm (Cd), 0.09 ppm (Ni), 9.05 ppm (Zn), 0.65 ppm (Cu) in a perm (S), 1.50 ppm (Pb), 0.02 ppm (Cd), 0.16 ppm (Ni), 8.00 ppm (Zn), 0.85 ppm (Cu) in a perm (T). Mean contents of lead(Pb) didn't show significant differences according to treating cysteine perm agents, showed it according to 3 treating thioglycolic acid perm agents (p<0.05). Mean contents of cadmium(Cd) showed significant differences (p<0.001) according to 2 treating both perm agents. Mean contents of nickel (Ni) showed neither. Mean contents of zinc (Zn) showed significant differences according to 2 treating cysteine perm agents (p<0.001) and 1 treating thioglycolic acid perm agents (p<0.01). Mean contents of copper (Cu) didn't show significant differences according to treating cysteine perm agents, showed it according to 1 treating thioglycolic acid perm agents (p<0.001).

• 한국진공학회지
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• 제4권1호
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• pp.67-76
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• 1995

자기저항헤드용 Ni-Fe-Co/Cu/Ni-Fe-Co/Fe-Mn 다층박막에서 자기적 성질과 전기적 성질에 관하여 조사하였다. 저 포화자계에서 고 자기저항을 나타내는 스핀 밸브형 다층박막을 제작하기 위하여 Borond이 도핑된 p-type Si(100)기판위에 Ni-Fe-Co 단층박막과 Si/Ni-Fe-Co/Cu/Ni-FeCo, Si/Ni-Fe-Co/Fe-Mn 구조의 다층막을 제작하여 자기적 특성을 조사하였다. Ni-Fe-Co 단층박막의 자기적 특성은 고정된 아르곤 분압에서 박막의 두께 등에 의존성이 있는 것으로 나타났다. 또한 Si/Ni-Fe-Co($70AA$)/Fe-Mn 구조에서 Ni-Fe-Co와 Fe-Mn 계면에서의 두 자성층의 이방성 차이에 의해서 발생되어지는 교환자기이방성이 존재하였으며, 교환자기이방성자계값은 Fe-Mn 두께가 $150\AA$일 때 가장 큰 값을 나타내었다. Ni-Fe-Co texture와 교환자기이방성자계값은 Fe-Mn 두께가 $150\AA$일 때 가장 큰 값을 나타내었다. Ni-Fe-Co texture와 교환자기이방성자계값의 의존성을 알아보기 위하여 Ti, Cu를 바닥층으로 사용하였다. Ti을 바닥층으로 사용하였을 경우, 교환자기이방성자계값은 23.5 Oe 정도의 가장 큰 값을 나타내었다. XRD 분석결과, Ti 바닥층이 Cu 바닥층이나, 바닥층이 없는 경우와 비교하여 성막된 Ni-Fe-Co 자성층의 강한 fcc(111) texture를 형성하는 것으로 나타났다. 각각의 단층박막과 다층박막에서의 자기적 특성을 측정한 후, Si/Ti($50\AA$)/Ni-Fe-Co($70\AA$)/Cu($23\AA$)/Ni-Fe-Co($70\AA$)/Fe-Mn(150$\AA$)/Cu(50$\AA$)의 스핀밸브구조를 갖는 다층박막을 제작하였으며, 11 Oe의 낮은 포화자계값에서 4.1%의 고 자기저항값을 얻을 수 있었다.