• Nuclear Engineering and Technology
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• v.55 no.6
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• pp.2139-2146
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• 2023

During reactor operation, the divertor must withstand unprecedented simultaneous high heat fluxes and high-energy neutron irradiation. The extremely severe service environment of the divertor imposes a huge challenge to the bonding quality of divertor joints, i.e., the joints must withstand thermal, mechanical and neutron loads, as well as cyclic mode of operation. In this paper, potassium-doped tungsten (KW) is selected as the plasma facing material (PFM), oxygen-free copper (OFC) as the interlayer, oxide dispersion strengthened copper (ODS-Cu) alloy as the heat sink material, and reduced activation ferritic/martensitic (RAFM) steel as the structural material. In this study, a vacuum brazing technology is proposed and optimized to bond Cu and ODS-Cu alloy with the silver-free brazing material CuSnTi. The most appropriate brazing parameters are a brazing temperature of 940 ℃ and a holding time of 15 min. High-quality bonding interfaces have been successfully obtained by vacuum brazing technology, and the average shear strength of the as-obtained KW/Cu and ODS-Cu alloy joints is ~268 MPa. And a fabrication route for manufacturing the flat-type divertor target based on brazing technology is set. For evaluating the reliability of the fabrication technologies under the reactor relevant condition, the high heat flux test at 20 MW/m² for the as-manufactured flat-type KW/Cu/ODS-Cu/RAFM mockup is carried out by using the Electron-beam Material testing Scenario (EMS-60) with water cooling. This paper reports the improved vacuum brazing technology to connect Cu to ODS-Cu alloy and summarizes the production route, high heat flux (HHF) test, the pre and post non-destructive examination, and the surface results of the flat-type KW/Cu/ODS-Cu/RAFM mockup after the HHF test. The test results demonstrate that the mockup manufactured according to the fabrication route still have structural and interfacial integrity under cyclic high heat loads.

• Journal of Korea Foundry Society
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• v.12 no.4
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• pp.317-325
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• 1992

Diamond is the hardest material known to humans, also possesses the highest thermal conductivity and a very low thermal expansion coefficient. Therefore, these properties of diamond make them logical choices for many difficult grinding application. Bonding material is a very important factor to performance of a grinding wheel. Grinding glass constitutes one of the major application areas of diamond grinding wheels, and Cu-Sn tin bronze matrix is widely used as a metal bond of diamond wheel in grinding glass but these studies are rarely reported. The bronze test pieces excluding diamond are sintered by the method of hot sizing respectively at $600^{\circ}C$, $650^{\circ}C$, $700^{\circ}C$, with a composition(Cu-10wt%Sn) on ${\alpha}$ phase and two compositions(Cu-20wt%Sn and Cu-23wt%Sn) on ${\alpha}+{\beta}$ phase. The rupture strength of Cu-10wt%Sn is highest. The bronze bonded diamond wheels are manufactured by same conditions as the bronze test pieces. The results of grinding ratio of wheels are highest in case of Cu-10wt%Sn bonded wheel sintered at $650^{\circ}C$ and grinding power is highest in same composition sintered at $700^{\circ}C$.

• Korean Journal of Materials Research
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• v.4 no.6
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• pp.620-625
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• 1994

We recently showed from the neutron diffraction and extended X-ray absorption fine structure studies the structural evidence for the formation of an amorphous phase in immiscible Cu-Ta system subjected to mechanical alloying. In a system with a positive heat of mixing like Cu-Ta, we consider it necessary to confirm the formation of an amorphous phase not only from the structural studies but also from a change in the electronic properties. We show the electronic evidence for the formation of the chemical bonding between the unlike atoms Cu and Ta for the 120 h-milling sample through changes in superconducting transition temperature and X-ray photoemission spectroscopy valence band structure.

• Journal of Welding and Joining
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• v.21 no.2
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• pp.97-101
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• 2003

The change of microstructures in the base metal during transient liquid phase bonding process of directionally Ni base superalloy, GID-111 was investigated. Bonds were fabricated using a series of holding times(0~7.2ks) at three different temperatures. The flip chip bonding utilizing self-aligning characteristic of solder becomes mandatory to meet tolerances for the optical device. In this paper, a parametric study of aging condition and pad size of samples was evaluated. A TiW/Cu/electroplated Cu UBM structure was selected and the samples were aging treated to analyze the effect of intermetallic compounds with the time variations. An FIB technique was applied to the preparation of samples for TEM observations. An FIB technique is very useful to prepare TEM thin foil specimens from the solder joint interface. After aging treatment, the tendency to decrease in shear strength was measured and the structure of the solder and the UBM was observed by using SEM, TEM and EDS. As a result, the shear strength was decreased of about 21% in the 100${\mu}{\textrm}{m}$ sample at 17$0^{\circ}C$ aging compared with the maximum shear strength of the sample with the same pad size. In the case of the 12$0^{\circ}C$ aging treatment, 18% of decrease in shear strength was measured at the 100${\mu}{\textrm}{m}$ pad size sample. An intermetallic compound of Cu6Sn5 and Cu3Sn were also observed through the TEM measurement by using.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.171-171
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• 1999

We studied the charge redistribution in the Pt-M (M=Cu, Co) alloys by X-ray Absorption Near Edge Spectroscopy(XANES) and X-ray Photoelectron Spectroscopy(XPS). These analysis tools provide us information about the charge transfer in the valence band of intermetallic bonding. The samples were prepared by arc-melting method. After annealing this samples in vacuum for several hours, we cold get the ordered samples, which were confirmed with XRD analysis. the core and valence level energy shift in these system were investigated by Mg $K\alpha$(1253.6eV) x-ray source for Pt-Co alloys and monochromatized Al $K\alpha$ (1486.6eV) for Pt-Cu alloys. Pt L2, L3-edge, and Cu, Co K-edge XANES spectra were measured with the total electron-yield mode detector at the 3Cl beam line of the PLS (Pohang light source0. from the changes of White line (WL) area and the core level shifts of the each metal sites, we can obtain the information about the electrons participating in the intermetallic bonding of the Pt-Cu and Pt-Co alloys.

• ETRI Journal
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• v.41 no.6
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• pp.820-828
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• 2019

A highly reliable conductive adhesive obtained by transient liquid-phase sintering (TLPS) technologies is studied for use in high-power device packaging. TLPS involves the low-temperature reaction of a low-melting metal or alloy with a high-melting metal or alloy to form a reacted metal matrix. For a TLPS material (consisting of Ag-coated Cu, a Sn96.5-Ag3.0-Cu0.5 solder, and a volatile fluxing resin) used herein, the melting temperature of the metal matrix exceeds the bonding temperature. After bonding of the TLPS material, a unique melting peak of TLPS is observed at 356 ℃, consistent with the transient behavior of Ag₃Sn + Cu₆Sn₅ → liquid + Cu₃Sn reported by the National Institute of Standards and Technology. The TLPS material shows superior thermal conductivity as compared with other commercially available Ag pastes under the same specimen preparation conditions. In conclusion, the TLPS material can be a promising candidate for a highly reliable conductive adhesive in power device packaging because remelting of the SAC305 solder, which is widely used in conventional power modules, is not observed.

• Journal of Welding and Joining
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• v.14 no.1
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• pp.47-56
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• 1996

The purpose of this study is to develope an insert metal which can be brazed at lower temperature than the conventionally used insert metal and provide higher strength joint than base metal. In the review of binary phase diagram concerning Ti, Cu and Ni resulted in the discovery of Si having eutectic composition with them. The microstructure and the distribution of elements in reaction zone between CP Ti and insert metal were investigated by Optical Microscopy, SEM/EDX, EPMA, X-RAY. The newly developed insert metal is Ti-15wt%Cu-18wt%Ni-2wt%Si, which can yield the lower brazing temperature(1183K) compared with the conventional Ti-Cu-Ni system insert metal. The joints with this insert metal had tensile strength of 385MPa in the bonding temperature range of 1183K to 1243K.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.1
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• pp.128-131
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• 2007

YBaCuO superconducting ceramic thick films were fabricated by chemical process. YBaCuO films have been successfully grown on $SrTiO_3$ substrates without a template layer. The films show poor or non superconductivity although they have excellent crystalline properties. ion channeling measurement made it clear that the strain in the films due to strong chemical bonding between the substrate and epilayer remains, resulting in the poor superconductivity. The X ray diffraction pattern of the YBaCuO thick films contained 90K phase. The self template method have resolved this problem. We obtained high-Jc as-grown YBaCuO on $SrTiO_3$ (100).

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.5
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• pp.570-575
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• 2011

Ultrasonic metal welder is consisted of power supply, transducer, booster, and horn. Precise designing is required since each parts' shape, length and mass can affect driving frequency and vibration mode. This paper analyzed Cu sheet deposition characteristics using ultrasonic metal welder and tension tester. A horn suitable for 40,000Hz was attached to the ultrasonic metal welder in order to weld Cu plates. The Cu sheet welding was done with different amplitude, pressure, and welding time, and its maximum tension was measured with tension tester. Maximum tension of 153.87N was obtained when the pressure was 2.0bar, amplitude was 80%, and welding time was 0.30s. Therefore, excessive welding condition negatively influences maximum tension measurement result.

• Proceedings of the KWS Conference
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• 2004.05a
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• pp.45-47
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• 2004

We have investigated the microstructures and the mechanical properties of TiA1/Cerameti1721 (Ag-Cu-Ti insert metal)/AISI4140 joints at 800$^{\circ}C$ for 60 to 300s using induction brazing method. Two continuous reaction layers of AICuTi and AICu$_2$Ti were formed at the interface between the braze and TiAl, whose thickness increased with the brazing time. The braze consisted of Ag-rich, Ti-rich, CuTi and CuTi$_2$ phases. The maximum tensile strength achieved 296MPa, which was 71% of that of TiAl base metal, for the specimen bonded at 800$^{\circ}C$. Further increase of the brazing temperature and time resulted in constant deterioration of its bonding strength due to large amount of brittle IMC.