• Corrosion Science and Technology
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• 제11권6호
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• pp.263-269
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• 2012

Copper alloys are commonly applied to ship's propellers, pumps and valves which are serviced in seawater due to their good castability and corrosion resistance. In the environment of high flow velocity, however, erosion damage predominates over corrosion damage. In particular, the cavitation in seawater environment accelerates surface damage to copper alloys, resulting in degradation of products and economic losses and also threatening safety. The surface was coated with WC-27NiCr by high velocity oxygen fuel(HVOF) spraying technique to attain durability and cavitation resistance of copper alloys under high velocity/pressure flow. The cavitation test was performed for the WC-27NiCr coating deposited by HVOF in seawater at the amplitude of $30{\mu}m$ with seawater temperature. The cavitation at $15^{\circ}C$ caused exfoliation of the coating layer in 17.5 hours while that of $25^{\circ}C$ caused the exfoliation in 12.5 hours. When the temperature of seawater was elevated to $25^{\circ}C$ from $15^{\circ}C$, more damage was induced by over 160%. Although WC-27NiCr has good durability, corrosion resistance and eletrochemical stability, the cavitation damage rate of the coating layer could remarkably increase at the elevated temperatures under cavitation environments.

• 한국재료학회지
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• 제17권6호
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• pp.293-297
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• 2007

Microstructure and tensile strength of the vacuum brazed stainless steel(STS303) and Cu were investigated. For brazing, the BNi-2, 3, 4, 6 and 7 (A.W.S standard) were used as filler metals. The Oxides such as $Cr_2O_3$ and $SiO_2$ were observed at brazed layers between STS303 and Cu matrix. Also, the intermetallic compounds of Cr-B and Ni-P were observed at brazed layers. Brazed STS303-Cu specimens with BNi-2, 3, 4 filler metals showed almost elastic deformation followed by plastic yielding and strain hardening up to a peak stress. On the other hand, it is likely that the fracture of the brazed specimens with BNi-6 and 7 was occurred in elastic range without plastic yielding up to a peak stress. Among these filler metals, the BNi-2 brazed at $1050^{\circ}C$ showed excellent wettability and the highest tensile strength (101.6MPa).

• 한국주조공학회지
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• 제23권5호
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• pp.244-250
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• 2003

The aim of this study is fabricating of composite filler metal (CFM) by a combination of selective laser sintering (SLS) of stainless steel powders (RapidSteel $2.0^{TM}$ and liquid phase infiltration of Ag-28 wt.%Cu alloy. Porous stainless steel body with inter-connected pore channels was fabricated by SLS, binder decomposing and densification processes. By the direct contact infiltration, the narrow inter-particle channels of the porous body were completely filled with the Ag-28 wt.%Cu alloy infiltrant. During infiltration, the dissolved elements of Fe, Ni and Cr from the porous body were solved into copper solid solution phases, which consist of eutectic structure of composite metal matrix. The S10C/CFM/S10C joints, which have narrow clearance gaps between them up to 10 micrometers, were joined successfully by self-feeding of filler metal from the matrix of CFM. The CFM kept its original thickness and microstructure after brazing. The tensile strength of brazed specimen was higher than 30 kgf/$mm^2$ and showed a typical ductile fracture mode in the CFM.

• Journal of Welding and Joining
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• 제10권3호
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• pp.63-72
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• 1992

The joining methods of ceramics to metals which can be expected to obtain high temperature strength are mainly classified into the solid-state diffusion bonding method and the active brazing method. Between these two, the solid-state diffusion bonding method is given attentions as substituting method for active brazing method due to being capable of obtaining higher bonding strength at high temperature and accurate bonding. In this paper, the solid-state diffusion bonding of $Al_{2}$O$_{3}$ ceramics to Ni-Cr-Mo alloy steel (SNCM21) using insert metal was carried out. The insert metal employed in this study was experimentally home-made, Ag-Cu-Ti alloy. Influence of several bonding parameters of $Al_{2}$O$_{3}$SNCM21 joint was quantitatively evaluated by bonding strength test, and microstructural analyses at the interlayer were performed by SEM/EDX. From above experiments, the optimum bonding condition of the solid-state diffusion bonding of $Al_{2}$O$_{3}$/SNCM21 using Ag-Cu-Ti insert metal was determined. Futhermore, high temperature strength and thermal-shock properties of $Al_{2}$O$_{3}$/SNCM21 joint were also examined. The results obtained are as follows. 1. The maximum bonding strength was obtained at the temperature of 95% melting point of insert metal. 2. The high temperature strength of $Al_{2}$O$_{3}$/SNCM21 joint appeared to bemaximum value at test temperature 500.deg.C and the bonding strength with increasingtemperature showed parabolic curve. 3. The strength of thermal-shocked specimens was far deteriorated than those of as-bonded specimens. Especially, water-quenched specimen after heated up to 600.deg. C was directly fractured in quenching.

• 한국해양공학회:학술대회논문집
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• 한국해양공학회 2001년도 추계학술대회 논문집
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• pp.258-263
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• 2001

In this paper, the real-time prediction of high temperature creep life was carried out for the friction welded joints of dissimilar heat resistintg steels (CulCr0.5Zr-STS316L). Various life prediction methods such as LMP (Larson-Miller Parameter) and ISM (initial strain method) were applied. The creep behaviors of those steels and the welds under static load were examined by ISM combined with LMP at 300, 400 and 50$0^{\circ}C$, and the relationship between these two methods was investigated. A real-time creep life (tsub/r/, hr) prediction equation by initial strain ($\varepsilon_0$, %) under any creep stress ($\sigma$, MP$\alpha$) at any high temperature (T, K) was developed

• 대한전기학회:학술대회논문집
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.1529_1530
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• 2009

The process conditions for fabricating p-type silicon pillars were optimized by controlling current density, bath temperature. To get best process flexibility for pillar arrays formation, three factors affecting pillar formation were changed. First, the solution bath was designed to keep constant temperature during the experiment irrespective of external temperature. Second, the counter Pt electrode was changed from rod type to mesh to obtain uniform distribution of current density. Third, Cr-Cu alloy electrode instead of Cu was used to increase electrode current density.

• 대한치과기공학회지
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• 제7권1호
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• pp.13-18
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• 1985

Casting alloys, both precious and non-precious, were by heat in order to observe the change in HB and the results were : 1. The hard treatment showed 1.4 - 1.5 times as high as the soft treatment in HB. 2. The experiment shows that Au-Pt should be contained more than 75% to prevent color change. 3. Cu by hard teatment played the greatect part in creasing the solidity of Ag-Cu alloy. 4. Casting Co-Cr alloys showed little difference of HB in heat treatment.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.434-437
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• 2005

Chemical Mechanical Polishing (CMP) has become an essential step in the overall semiconductor wafer fabrication technology. In general, CMP is a surface planarization method in which a silicon wafer is rotated against a polishing pad in the presence of slurry under pressure. The polishing pad, generally a polyurethane-based material, consists of polymeric foam cell walls, which aid in removal of the reaction products at the wafer interface. It has been found that the material removal rate of any polishing pad decreases due to the so-called 'pad glazing' after several wafer lots have been processed. Therefore, the pad restoration and conditioning has become essential in CMP processes to keep the urethane polishing pad at the proper friction coefficient and to allow effective slurry transport to the wafer surface. Diamond pad conditioner employs a single layer of brazed bonded diamond crystals. Due to the corrosive nature of the polishing slurry required in low pH metal CMP such as copper, it is essential to minimize the possibility of chemical interaction between very low pH slurry (pH <2) and the bond alloy. In this paper, we report an exceptional protective coated conditioner for in-situ pad conditioning in low pH Cu CMP process. The protective Cr-coated conditioner has been tested in slurry with pH levels as low as 1.5 without bond degradation.

• 한국재료학회지
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• 제4권8호
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• pp.906-914
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• 1994

상온과 액체질소온도에서 압축시험을 통하여 $LI_{2}$단상함금 및 $LI_{2}$상에 제 2상을 수 %또는 20%정도 포함하는 합금조성을 선택하였다. 일반적으로 제 2상을 20%정도 포함하는 2상합금들은 $Ll_{2}$단상합금에 비해 항복강도는 높으나 연성은 좋지 않았다. 그러나 $Cr_{2}AI$을 제 2상으로하는 20%정도 포함하는 Al-21Ti-23Cr합금은 다른 합금들에 비해 비교적 높은 항복강도와 함계 우수한 연성을 나타내었다. 또한 $Li_{2}$단상합금 및 $Cr_{2}Al$을 수% 포함하는 2상합금에 대한 소성거동도 조사하였다. 균질화처리 후에 제 2상의 양은 줄었으나 pore의 양은 증가하였다. 균질화처리 후에 $Ll_{2}$단상조직에서 나타나는 pore의 양은 Cr의양이 증가할수록 줄어들었으며, Cr 의 양이 더욱 증가하여 $Cr_{2}$Al이 제2상으로 생성될 때는 pore가 완전히 소멸하였다. 변형속도를 $1.2 \times 10^{-4}/s$와 $1.2 \times 10^{-2}/s$의 두가지 조건으로 변화시키면서 압축시험을 행하여 합금의 연성에 미치는 환경취성의 영향을 조사하였다. $LI_{2}$단상합금인 AI-25Ti-10Cr합금이 환경취성의 영향을 가장 적게 받는 것으로 나타났다. 그러나 pore의 생성, 환경취성, ingot 주조조직 등을 종합평가해 보면 $Cu_{2}Al$을 제 2상으로 20%정도 포함하는 Ak-21Ti-23Cr합금이 가장 우수한 인장연싱율을 나타낼 것으로 기대된다.

• 한국세라믹학회지
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• 제49권3호
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• pp.247-252
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• 2012

Crystal structure and chemical compositions of Plasma electrolytic oxidized layer of A-1100, A-2024, A-5052, A-6061, A-6063, A-7075, ACD-7B and ACD-12 were investigated. The electrolyte for plasma electrolytic oxidation was mixture of distilled water, $Na_2P_2O_7$, Cu, Cr metal salts and KOH. ${\eta}$-Alumina, as well as ${\alpha}$-alumina, was main crystal phase. Another crystals such as $(Al_{0.948}Cr_{0.052})_2O_3$ and $(Al_{0.9}Cr_{0.1})_2O_3$ were also formed in the oxide layer. It was thought that the effect of electrolyte compositions on the physical properties and crystal system of PEO layers was greater than the effect of Al alloy composition variation.