• 한국기계연구소 소보
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• s.9
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• pp.67-74
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• 1982

• 기계와재료
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• v.5 no.4 s.18
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• pp.67-86
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• 1993

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.67-74
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• 2011

Keys to high wiring density semiconductor packages include flip-chip bonding and build-up substrate technologies. The current issues are the establishment of a fine pitch flip-chip bonding technology and a low coefficient of thermal expansion (CTE) substrate technology. In particular, electromigration and thermomigration in fine pitch flipchip joints have been recognized as a major reliability issue. In this paper, electromigration and thermomigration in Cu/Sn-3Ag-0.5Cu (SAC305)/Cu flip-chip joints and electromigration in Cu/In/Cu flip chip joints are investigated. In the electromigration test, a large electromigration void nucleation at the cathode, large growth of intermetallic compounds (IMCs) at the anode, a unique solder bump deformation towards the cathode, and the significantly prolonged electromigration lifetime with the underfill were observed in both types of joints. In addition, the effects of crystallographic orientation of Sn on electromigration were observed in the Cu/SAC305/Cu joints. In the thermomigration test, Cu dissolution was accelerated on the hot side, and formation of IMCs was enhanced on the cold side at a thermal gradient of about $60^{\circ}C$/cm, which was lower than previously reported. The rate of Cu atom migration was found comparable to that of electromigration under current conditions.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.67-73
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• 2012

After flash memory card(FMC) was manufactured by $B^2it$ process, interfacial reaction of silver bump with thermal stress was studied. To investigate bonding reliability of Ag bump, thermal shock and thermal stress tests were conducted and then examined on the crack between Cu land and Ag bump interface. Diffusion reaction of Ag bump/Cu land interface was analyzed using SEM, EDS and FIB. The Ag-Cu alloy layer due to the interfacial reaction was formed at the Ag/Cu interface. As the diffusivity of Ag ${\rightarrow}$ Cu is faster than Cu ${\rightarrow}$ Ag, a lot of (Cu, Ag) alloy layers were observed at the Cu layer than Ag. These alloy layers contributed to increase the Cu-Ag bonding strength and its reliability.

• Korean Journal of Microbiology
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• v.42 no.4
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• pp.326-331
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• 2006

In the present study, we examined biosorption characteristics of heavy metals onto the extracellular polysaccharide (EPS) produced by the purple nonsulfur photosynthetic bacteria Rhodopseudomonas sp. KH4, which was isolated from a stream in Anyang, Kyonggi-Do. When Cd (100 mg/L) and Cu (100 mg/L) were added to EPS (1.0 g/L) in the optimal condition (Cd; pH 8, Cu; pH 5, $40^{\circ}C$), 84.2 mg/L of Cd and 70.0 mg/L of Cu were adsorbed within 30 min and 10 min, respectively. When 100 mg/L of Cd and Cu were present as mixture, 16.8 mg/L of Cd and 48.7 mg/L of Cu were adsorbed at $25^{\circ}C$, pH 5. The maximum adsorption capacity determined by fitting Langmuir isotherms model was suitable for describing the biosorption of Cd (76.9 mg/g) and Cu (67.1 mg/g) by EPS. The neutral monosaccharide in the EPS determined by GC consisted of arabinose (2.4%), glucose (7.1%) and mannose (90.5%).

• Korean Chemical Engineering Research
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• v.43 no.1
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• pp.140-145
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• 2005

The desulfurization abilities using GC/microreactor have been examined for $CuO-Fe_2O_3$ sorbents with respect to calcination temperatures of 700, 900 and $1,100^{\circ}C$. CuO was used as a main active component, $Fe_2O_3$ was used as an additive one and 25 wt% $SiO_2$ was used as a support. The desulfurization reaction temperature was $500^{\circ}C$ and the regeneration reaction temperature was $700^{\circ}C$. From the XRD results, the $CuFeO_2$ compound has been observed for the fresh sorbent calcined at $1,100^{\circ}C$ and the $CuFeS_2$ compound for the reacted sorbent calcined at $1,100^{\circ}C$. By the BET results, however any significant differences among sorbents calcined at the three different temperatures of 700, 900 and $1,100^{\circ}C$ haven't been observed. Especially CFS1 (CuO : $Fe_2O_3$ : $SiO_2$=67.5 wt% : 7.5 wt% : 25 wt%) sorbent calcined at $1,100^{\circ}C$ maintained about 10 g sulfur/100 g sorbent for 100 cycles by the cyclic test.

• KIEE International Transactions on Electrophysics and Applications
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• v.4C no.2
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• pp.64-67
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• 2004

In this paper, to discover the brightness improvement of ZnS:Cu powder electroluminescence (EL), a new structure is proposed in which phosphor and dielectric are mixed between electrodes. Dielectric and phosphor material are BaTiO$_3$ and ZnS:Cu, respectively. The effect of the mixed layer on EL sample is considered the improvement of source efficiency. Although the number of electrons introduced into the phosphor increases only modestly, the high electric field region of phosphor grains increases comparatively in the characteristics of brightness-voltage. Furthermore, the relaxation occurs through leading and trailing edge pairs, which is relatively efficient in characteristics of decay time. With these results, we found that the brightness of newly proposed ZnS:Cu powder electroluminescence was 167.24 cd/$m^2$ at ac voltage of 100V and frequency of 400Hz.

• Journal of Environmental Health Sciences
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• v.23 no.1
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• pp.105-108
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• 1997

For the removal of heavy metals, Cd, Cu and Cr were used. The initial concentration of Cd and Cu were 1-10 ppm, the removal efficiency of Cd and Cu was 76.2-89.0% and 69.0-79.0%, respectively. The initial concentration of Cr were 1~5 ppm, and the-removal efficiency was low especially at high concentration. In general, the initial concentrations of heavy metals had no relation to the removal efficiency. At the beginning, the removal efficiency was very high, but it was maintained at constant concentration. The trends of accumulations of heavy metals in the stem increased in proportion to the initial concentration. The removal efficiency of heavy metals increased a little bit when nutrients existed in the solution. So that, the initial concentration of Cd and Cu were 1-10 ppm, the removal efficiency of Cd and Cu was 84.8-91.0% and 75.9-82.0%. The initial concentration of Cr were 1-5 ppm, the removal efficiency was 25.0-67.0%.

• Transactions of the Korean Society of Automotive Engineers
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• v.16 no.5
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• pp.60-67
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• 2008

The catalytic filter of Cu-ZSM5/alumina beads was considered to reduce NOx in the urea SCR system. Catalytic support of porous alumina beads with mean pore size $130{\mu}m$ and porosity $75{\sim}83%$ were prepared using foaming and gel-casting method. The Cu-ZSM5 catalysts were coated on the supporting alumina beads using $Cu(NO_3)_2$ by ion exchange method. After a washcoating process was applied to coat 10w% Cu-ZSM5 on porous alumina bead, coating layer was estimated $20{\mu}m$ in thickness. The characterization and the feasibility as a catalytic supports were investigated. And the NOx conversion test in Cu-ZSM5/Alumina Beads filter system was conducted by using Urea as reductants under laboratory test. The NOx conversion was increased as size and porosity of beads and observed more than 95% excellent NOx conversion above $300^{\circ}C$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.1
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• pp.63-67
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• 2024

In this study, we successfully synthesized copper oxide (Cu₂O) particles through a hydrothermal method at a relatively low temperature (150℃). The synthesis involved the precise control of molar concentrations of NaOH. Notably, Cu₂O particles were effectively synthesized when NaOH concentrations of 0.15 M and 0.20 M were utilized. While attempts were made at different molar concentrations, the synthesis of pure Cu₂O particles was only achieved at concentrations of 0.15 M and 0.20 M. In this experimental investigation, Cu₂O synthesized under these specific conditions exhibited absorption characteristics within the wavelength range of 640 to 570 nm, consistently exhibiting a band gap energy of 1.9 eV. These Cu₂O particles, characterized by their small band gap energy and straightforward synthetic method, hold significant promise for various applications including semiconductors and solar cells.