• Transactions on Electrical and Electronic Materials
• /
• v.16 no.3
• /
• pp.112-116
• /
• 2015

This work studied the thickness and contact angle of solder joints between SAC 305 lead-free solder alloy and a Copper (Cu) substrate. Intermetallic compound (IMC) thickness and contact angle of 3Sn-Ag-0.5Cu (SAC 305) leadfree solder were measured using varying aging times, at a fixed temperature at 30℃. The thickness of IMC and contact angle depend on the aging time. IMC thickness increases as the aging increases. The contact angle gradually decreased from 39.49° to 27.59° as aging time increased from zero to 24 hours for big solder sample. Meanwhile, for small solder sample, the contact angle increased from 32.00° to 40.53° from zero to 24 hours. The IMC thickness sharply increased from 0.007 mm to 0.011 mm from zero to 24 hours aging time for big solder. In spite of that, for small solder the IMC thickness gradually increased from 0.009 mm to 0.017 mm. XRD analysis was used to confirm the intermetallic formation inside the sample. Cu₆Sn₅, Cu₃Sn, Ni₃Sn and Ni₃Sn₂ IMC layers were formed between the solder and the copper substrate. As the aging time increased, the strength of the solder joint mproved due to reduced contact angle.

• Journal of the Microelectronics and Packaging Society
• /
• v.19 no.1
• /
• pp.47-53
• /
• 2012

Bonding strength of Sn-3.0Ag-0.5Cu solder joint due to degradation characteristic of OSP surface finish was investigated, compared with SnPb finish. The thickness variation and degradation mechanism of organic solderability preservative(OSP) coating were also analyzed with the number of reflow process. To analyze the degradation degree of solder joint strength, FR-4 PCB coated with OSP and SnPb were experienced preheat treatment as a function of reflow number from 1st to 6th pass, respectively. After 2012 chip resistors were soldered with Sn-3.0Ag-0.5Cu on the pre-heated PCB, the shear strength of solder joints was measured. The thickness of OSP increased with increase of the number of reflow pass by thermal degradation during the reflow process. It was also observed that the preservation effect of OSP decreased due to OSP degradation which led Cu pad oxidation. The mean shear strength of solder joints formed on the Cu pads finished with OSP and SnPb were 58.1 N and 62.2 N, respectively, through the pre-heating of 6 times. Although OSP was degraded with reflow process, the feasibility of its application was proven.

• Journal of Welding and Joining
• /
• v.25 no.3
• /
• pp.57-63
• /
• 2007

Electrochemical migration characteristics of Pb-free solder alloys are quantitatively correlated with corrosion characteristics in harsh environment conditions. In-situ water drop test and corrosion resistance test for Sn-3.0Ag-0.5Cu solder alloys were carried out in NaBr and NaF solutions to obtain the electrochemical migration lifetime and pitting potential, respectively. Sn-3.0Ag-0.5Cu solder alloy shows similar ionization and electrochemical migration behavior with pure Sn because of Ag and Cu do not migrate due to the formation of resistant intermetallic compounds inside solder itself. Electrochemical migration lifetime in NaBr is longer than in NaF, which seems to be closely related to higher pitting potential in NaBr than NaF solution. Therefore, it was revealed that electrochemical migration lifetime of Sn-3.0Ag-0.5Cu solder alloys showed good correlation to the corrosion resistance, and also the initial ionization step at anode side is believed to be the rate-determining step during electrochemical migration of Pb-free solders in these environments.

• Journal of Welding and Joining
• /
• v.35 no.3
• /
• pp.7-14
• /
• 2017

The effect of high temperature-moisture on corrosion and mechanical properties for Sn-0.7Cu, Sn-3.0Ag-0.5Cu (SAC305) solders on flexible substrate was studied using Highly Accelerated Temperature/Humidity Stress Test (HAST) followed by three-point bending test. Both Sn-0.7Cu and SAC305 solders produced the internal $SnO_2$ oxides. Corrosion occurred between the solder and water film near flexible circuit board/copper component. For the SAC305 solder with Ag content, furthermore, octahedral corrosion products were formed near Ag3Sn. For the SAC305 and Sn-0.7Cu solders, the amount of internal oxide increased with the HAST time and the amount of internal oxides was mostly constant regardless of Ag content. The size of the internal oxide was larger for the Sn-0.7Cu solder. Despite of different size of the internal oxide, the fracture time during three-point bending test was not significantly changed. It was because the bending crack was always initiated from the three-point corner of the chip. However, the crack propagation depended on the oxides between the flexible circuit board and the Cu chip. The fracture time of the three-point bending test was dependent more on the crack initiation than on the crack propagation.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.22 no.3
• /
• pp.127-133
• /
• 2012

To achieve low-cost and high-efficiency of thin-film solar cells applications, the sol-gel method that can be coated on a large area substrate, obtain homogeneous thin films of high purity was used. We studied structural and optical characteristics versus annealing temperature of $Cu_2ZnSnS_4$ which has kesterite structure by substitution low-cost sulfur (S) instead of high-cost selenium (Se). By analyzing XRD patterns, main peak was observed at $2{\theta}=28.5^{\circ}$ when Zn/Sn ratio is 0.8/1.2. And when we observed kesterite structure which has orientation of (112) direction, the more annealing temperature increase the bigger strength of (112) direction is. $Cu_2ZnSnS_4$ thin film showed characteristics of kesterite structure at $550^{\circ}C$. And when we calculated lattice constant, a = 5.5047 and $c=11.014{\AA}$ as same JCPDS (Joint Committee on Powder Standards) data measured. We measured optical transmittance to analyze optical characteristics. Optical transmittance was lower than 65 % at visible ray (${\lambda}=380{\sim}770nm$).

• Journal of Integrative Natural Science
• /
• v.10 no.4
• /
• pp.245-248
• /
• 2017

The Cu and CuSn/PVP nanofibers were fabricated by electrospinning method by controlling various parameters. The precursor solution was prepared with copper(II) acetate monohydrate ($Cu(CH_3COO)_2$) and tin chloride dihydrate ($SnCl_2{\cdot}2H_2O$), and polyvinylpyrrolidone (PVP) for adjusting viscosity. The fabricated nanofibers were calcined at 873 K in Ar atmospheric environment for 5 hours to remove the solvent and polymer. The morphology and diameter of nanofibers were measured by optical microscopy (OM) with Motic image plus 2.0 program. The components and chemical environment were investigated with X-ray photoelectron spectroscopy (XPS). From the XPS survey spectra, we confirmed that CuSn/PVP nanofibers were successfully fabricated. The XPS peaks of C 1s and N 1s were remarkably decreased after calcination of the nanofibers at 873 K. It implies that the PVP was completely decomposed after calcination at 873 K.

• Korean Journal of Materials Research
• /
• v.9 no.10
• /
• pp.1018-1024
• /
• 1999

The effects of operating temperature and stress on degradation of components in high temperature steam generator were investigated. Several 2.25CrlMo tubes which had operated over 20 years and an unused 9CrlMoVNb tube were tested. For the former samples, the amount of $\textrm{M}_{6}\textrm{C}$ carbide and its size are increased with the aging or operating time. The precipitation behavior of carbides ($\textrm{M}_{2}\textrm{O}$, $\textrm{M}_{6}\textrm{C}$) is changed with the operating temperature of the tubes. However, unused 9CrlMoVNb samples show a different carbide precipitation process due to high chromium, vanadium, and niobium contents. The amount of Cr-rich $\textrm{M}_{23}\textrm{C}_{6}$ carbide is significantly increased with aging time, but that of $\textrm{M}_{6}\textrm{C}$ type carbide is rarely changed with aging time at elevated temperatures.

• Journal of Electrochemical Science and Technology
• /
• v.3 no.2
• /
• pp.85-89
• /
• 2012

This study demonstrates the direct anodic electrodeposition of polypyrrole (PPy), poly(3,4-ethyl-enedioxythiophene) (PEDOT), and polythiophene (PTh) on Cu electrodes by employing a corrosion inhibitor, succinonitrile (SN). SN was found to suppress anodic Cu dissolution beyond the oxidation potential of the polymer monomers. It is also revealed that the Cu surface passivated by SN is still adequately conductive to allow the redox reaction of 1,4-difluoro-2,5-dimethoxybenzene (FMB) and the oxidation of the polymer monomers. Through both cyclic voltammetry and galvanostatic techniques, PPy, PEDOT, and PTh films were successfully synthesized on Cu electrodes in the presence of SN, and the redox behaviors of the films were evaluated.

• Proceedings of the KWS Conference
• /
• 2007.11a
• /
• pp.227-228
• /
• 2007

본 연구에서는 플립칩 범프를 형성하는 여러 가지 방법 중 전해도금을 이용하여 Sn-0.7wt%Cu 솔더 범프를 형성 하고자 하였다. 전류밀도에 따른 전류 효율을 알아보기 위하여 전류밀도에 따른 실험적 증착 속도와 이론적 속도를 비교 분석 하였다. 도금 두께는 FE-SEM(Field Emission Scanning Electron Microscope)을 이용하여 측정 하였으며 최종적으로 $20{\mu}m{\times}20{\mu}m{\times}10{\mu}m$ 크기에 $50{\mu}m$ 피치를 가지는 straight wall 형 Sn-0.7wt%Cu 솔더 범프를 형성하고자 하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2007.04a
• /
• pp.109-110
• /
• 2007

본 연구에서는 범프를 형성하는 여러 가지 방법중 전해도금을 이용하여 Sn-Cu 솔더 범프를 형성하고자 하였다. 기초적인 도금 특성을 알아보기 위하여 전류밀도에 따른 중착속도, 도금 시간에 따른 도금두께 등을 측정하였으며, 최종적으로는 $20{\times}20{\times}10{\mu}m$ 크기에 $50{\mu}m$피치를 갖는 Sn-Cu 솔더 범프를 형성하고자 하였다.