• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.19-27
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• 2003

Surface finishes of PCB laminates are important in the solder joint reliability of flip chip package because the types and thicknesses of intermetallic compound(IMC), and compositions and hardness of solders are affected by them. In this study, effects of surface finishes of PCB on the low cycle fatigue resistance of Sn-based lead-free solders; Sn-3.5Ag, Sn-3.5Ag-XCu(X=0.75, 1.5), Sn-3.5Ag-XBi(X=2.5, 7.5) and Sn-0.7Cu were investigated for the Cu and Au/Ni surface finish treatments. Displacement controlled room temperature lap shear fatigue tests showed that fatigue resistance of Sn-3.5Ag-XCu(X=0.75, 1.5), Sn-3.5Ag and Sn-0.7Cu alloys were more or less the same each other but much better than that of Bi containing alloys regardless of the surface finish layer used. In general, solder joints on the Au/Ni finish showed better fatigue resistance than those on the Cu finish. Cross-sectional fractography revealed microcracks nucleation inside of the interfacial IMC near the solder mask edge, more frequently on the Cu than the Au/Ni surface finish. Macro cracks followed the solder/IMC interface in the Bi containing alloys, while they propagated in the solder matrix in other alloys. It was ascribed to the Bi segregation at the solder/IMC interface and the solid solution hardening effect of Bi in the $\beta-Sn$ matrix.

• Journal of Surface Science and Engineering
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• v.44 no.5
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• pp.185-189
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• 2011

$Cu_2ZnSnSe_4$ thin films for solar absorber application were prepared by pulsed laser deposition of a synthesized $Cu_2ZnSnSe_4$ compound target. The film's composition revealed that the deposited films possess an identical composition with the target material. Further film compositional control toward a stoichiometric composition was performed by optimizing substrate temperature, deposition time and target rotational speed. At the optimum condition, X-ray diffraction patterns of films showed that the films demonstrated polycrystalline stannite single phase with a high degree of (112) preferred orientation. The absorption coefficient of $Cu_2ZnSnSe_4$ thin films were above 104 cm.1 with a band gap of 1.45 eV. At an optimum condition, films were identified as a p type semiconductor characteristic with a resistivity as low as $10^{-1}{\Omega}cm$ and a carrier concentration in the order of $10^{17}cm^{-3}$.

• Journal of Welding and Joining
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• v.26 no.5
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• pp.43-48
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• 2008

Characteristics of Sn-1.7%Bi-0.7%Cu-0.6%In (hereafter, SBIC) lead-free solder was investigated in this study. The results from SBIC were compared to other lead-free solders such as Sn-3.5%Ag-0.7%Cu (hereafter, SAC), Sn-0.7%Cu (hereafter, SC), and lead-bearing Sn-37%Pb (hereafter, SP) alloy. Tensile properties of bulk solder, wettability, spreading index, bridge and dross were evaluated. As experimental results, tensile strength and elongation of SBIC was 62.5MPa and 21.5%, respectively. The tensile strength was comparable to that of SP solder. The wetting time of SBIC was 1.2 sec at $250^{\circ}C$, and its wetting properties including wetting force were as good as the SAC alloy. However, wettability of the SC was not so good as the SBIC and SAC. The spreading index of SBIC at $250^{\circ}C$ was 71 %, and it was similar level to those of SAC and SC solders. Bridging was not found for all solders of SBIC, SAC and SC in the range from 240 to $260^{\circ}C$. In dross test at $250^{\circ}C$ for an hour, the amount of dross produced from SBIC was about 57% compared to that from SAC.

• Proceedings of the KWS Conference
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• 2006.05a
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• pp.36-38
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• 2006

We investigated that the metallurgical, mechanical and electrical properties of the Sn-3.SAg/Cu ball grid array (BGA) solder joints at a reflow temperature of $255^{\circ}C$ for different reflow times of 10, 60, 300 and 1800 s. Two different intermetallic compound (IMC) layers, consisting of scallop-shaped $Cu_6Sn_5$ and very thin $Cu_3Sn$, formed at the solder/substrate interface, and their thicknesses increased with increasing reflow time. The shear force peaked after reflow for 60 s, and then significantly decreased with increasing reflow time. The fracture occurred along the solder ball in the initial reflow, but the fraction of the brittle fracture increased with increasing reflow time. The IMC growth and the volume of Cu dissolved in the solder balls affected the electrical property.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.10 no.9
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• pp.1641-1647
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• 2006

A dual micro gas sensor way for detecting reducing gas and bad order was fabricated using nano sized $SnO_2$ thin film fabrication method. To make nano-sized thin gas sensitive $SnO_2$ thin rilm, thin tin metal layer $2500{\AA}$ thick was oxidized between 600 and $800^{\circ}C$ by thermal oxidation. The gas sensing layers such as $SnO_2,\;SnO_2(+Pt)\;and\;SnO_2(+CuO)$ were patterned by metal shadow mask for simple fabrication process on the silicon substrate. The micro gas sensors with $SnO_2(Pt)$ and $SnO_2(+CuO)$ showed good selectivity to CO gas among reducing gases and good sensitivity to $H_2S$ that is main component of bad odor, separately.

• Journal of the Korean Applied Science and Technology
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• v.33 no.2
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• pp.401-410
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• 2016

The $Pt-Sn/Al_2O_3$ catalysts mixed with metal oxides for propane dehydrogenation were studied. $Cu-Mn/{\gamma}-Al_2O_3$, $Ni-Mn/{\gamma}-Al_2O_3$, $Cu/{\alpha}-Al_2O_3$ was prepared and mixed with $Pt-Sn/Al_2O_3$ to measure the activity for propane dehydrogenation. As standard sample, $Pt-Sn/Al_2O_3$ catalyst mixed with glassbead was adopted. In the case of catalytic activity test after non-reductive pretreatment of catalyst and metal oxide, $Pt-Sn/Al_2O_3$ mixed with $Cu-Mn/{\gamma}-Al_2O_3$ showed higher conversion of 15% and similar selectivity at $576.5^{\circ}C$, compared to conversion of 8% in standard sample. In the case of catalytic activity test after reductive pretreatment of catalyst and metal oxde, $Cu/{\alpha}-Al_2O_3$ showed higer yield than standard sample. But, increase of yield of most of samples after reductive pretreatment was not significant, so it was found that lattice oxygen of $Cu-Mn/{\gamma}-Al_2O_3$ is effective to propane dehydrogenation.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.71-76
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• 2012

A chip interconnection technology for smart fabrics was investigated by using flip-chip bonding of SnBi low-temperature solder. A fabric substrate with a Cu leadframe could be successfully fabricated with transferring a Cu leadframe from a carrier film to a fabric by hot-pressing at $130^{\circ}C$. A chip specimen with SnBi solder bumps was formed by screen printing of SnBi solder paste and was connected to the Cu leadframe of the fabric substrate by flip-chip bonding at $180^{\circ}C$ for 60 sec. The average contact resistance of the SnBi flip-chip joint of the smart fabric was measured as $9m{\Omega}$.

• Korean Journal of Materials Research
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• v.15 no.8
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• pp.536-542
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• 2005

Recently European Council(EU) published the RoHS(restriction of the use of certain hazardous substances in electrical and electronic equipment) which is prohibit the use of Pb, Hg, Cd, $Cr^{+6}$, PBB or PBDE in the electrical and electronic equipments. So EU member States shall ensure that, from 1 July 2006, new electrical and electronic equipment put on the market does not contain 6 hazardous substances. The one of the most important in electronics manufacturing process is soldering. Soldering process use the chemical substances which are applied in fluxing and cleaning processes and it can generate the malfunction of electronics caused by corrosion in the fields conditions. Therefore this study researched on the polarization and Tafel properties of Sn40Pb and Sn3.0Ag0.5Cu(SAC) solder based on the electrochemical theory. We prepared SnPb specimens which was aged in $150^{\circ}C,\;180^{\circ}C$ for 15 minutes ana Sn3.0Ag0.5Cu specimens that was aged in $180^{\circ}C,\;220^{\circ}C$ for 10 minutes. Experimental polarization curves were measured in distilled ionized water and $3.5 wt\%$, 1 mole NaCl electrolyte of $40^{\circ}C$, pH 7.5. Ag/AgCl and graphite were utilized by reference and counter electrode, respectively. To observe the electrochemical reaction, polarization test was conducted from -250 mV to +250 mV. From the polarization curves that were composed of anodic and cathodic curves, we obtained Tafel slop, reversible electrode potential(Ecorr) and exchange current density(Icorr). In these results, corrosion rate for two specimen were compared Sn3.0Ag0.5Cu with SnPb solders

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.12
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• pp.1120-1127
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• 2013

In this paper, novel chip-on-chip(CoC) flip-chip bump structures using chip-on-wafer(CoW) process technology are proposed, designed and fabricated, and their microwave frequency responses are analyzed. With conventional bumps of Cu pillar/SnAg and Cu pillar/Ni/SnAg and novel Polybenzoxazole(PBO)-passivated bumps of Cu pillar/SnAg, Cu pillar/Ni/SnAg and SnAg with the deposition option of $2^{nd}$ Polyimide(PI2) layer on the wafer, 10 kinds of CoC samples are designed and their frequency responses up to 20 GHz are investigated. The measurement results show that the bumps on the wafers with PI2 layers are better for the batch flip-chip process and have average insertion loss of 0.14 dB at 18 GHz. The developed bump structures for chips with fine-pitch pads show similar or slightly better insertion loss of 0.11~0.14 dB up to 18 GHz, compared with that of 0.13~0.17 dB of conventional bump structures in this study, and we find that they could be utilized in various microwave packages for high integration density.

• Journal of Conservation Science
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• v.1 no.1 s.1
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• pp.27-39
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• 1992

Metallurgical studies of the bronze artifacts excavated from Miruksa Temple were performed by chemical analysis and metallographic observation. Alloy systems of the bronze artifacts were classified into two groups of Cu-Sn and Cu-Sn-Pb, according to the items. The contents of impurities such as Sb, As, Ni and Fe in bronze artifacts are within the limiting range of the mod ern standard bronze castings. Chemical compositions of the kitchen utensils such as bronze vessels and dishes in the Unified Silla dynasty, are in the follow ing range, Cu : 74.8-79.4% and Sn : 18.6-21.1%. Chemical composition of the Buddha-image in Koryo dynasty are 820Cu-7.0Sn-10.3Pb, showing increased Pb content and decreased Sn content. The results of chemical analysis suggest that the chemical compositions were good controlled. Any casting defects such as voids and shrinkage holes are not found microscopically, indicating high casting skill. Zinc atoms are not contained in the all bronze artifacts of Miruksa Temple site. This is the common facts founded in the east asian bronze artifacts of Korea, China and Japan. It is comparable with the European bronze of Cu-Sn-Pb-Zn system, after the Middle Age.