• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.658-662
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• 2000

The microstructure, adhesion strength and conductivity of electroplated Sn-Cu Films on Alloy42 lead Frame were measured for comparison. In the case of electroplated 90Sn10Cu, 99Sn1Cu, Cu$\sub$10/Sn$_3$Phase was formed and Ni$_3$Sn$_2$Phase was formed after 200$^{\circ}C$, 30min annealing. In the case of electroplated 99Sn1Cu, Cu$\sub$10/Sn, Ni$_3$Sn phases were formed and Ni$_3$Sn$_4$, Ni$_3$Sn$_4$phases were formed after 200$^{\circ}C$, 30min annealing. 90Sn10Cu film was measured better uniformity, adhesion strength and conductivity than 99Sn1Cu.

• Tribology and Lubricants
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• 제37권3호
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• pp.83-90
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• 2021

In this study, an ultrasonic nanocrystal surface modification (UNSM) was used to improve the mechanical properties, scratch resistance and tribological performance of Cu-based bimetals, which are usually used to manufacture sliding bearings and bushings for internal combustion engines (ICEs). Two different Cu-based bimetals, namely CuPb10Sn10 and CuSn10Bi7, were sintered onto a low carbon steel substrate. The mechanical properties and dry tribological performance using a tensile tester and micro-tribo tester were evaluated, respectively. The scratch resistance was assessed using a micro-scratch tester at an incremental load. The tensile test results showed that the yield strength (YS) and ultimate tensile strength (UTS) of both Cu-based bimetals increased after UNSM. Furthermore, the scratch and tribological tests results revealed that the scratch resistance and tribological performance of both Cu-based bimetals were improved by the application of UNSM. These improvements were mainly attributed to the eliminated pores, increased hardness and reduced roughness after UNSM. CuSn10Bi7 demonstrated better mechanical properties, scratch resistance and tribological performance than CuPb10Sn10. It was found that the presence of Bi in CuSn10Bi7 formed a Cu₁₁Bi₇ intermetallic phase, which is harder than Cu₃Sn. Hence, CuSn10Bi7 demonstrated higher strength and wear resistance than CuPb10Sn10. In addition, a CuSn10Bi7 formed both SnO₂ and Bi₂O₃ that prevented adhesion and improved the tribological performance. It can be expected that under dry tribological conditions, ICEs can utilize UNSM bearings and bushings made of CuSn10Bi7 instead of CuPb10Sn10 under oil-lubricated conditions.

• 한국분말재료학회지
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• 제19권4호
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• pp.317-321
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• 2012

In this study, Cu-5Ni-10Sn(wt%) spinodal alloy was manufactured by gas atomization spray forming, and the microstructural features and mechanical properties of Cu-5Ni-10Sn alloy have been investigated during homogenization, cold working and age-hardening. The spray formed Cu-5Ni-10Sn alloy consisted of an equiaxed microstructure with a mixture of solid solution ${\alpha}$-(CuNiSn) grains and lamellar-structure grains. Homogenization at $800^{\circ}C$ and subsequent rapid quenching formed a uniform solid solution ${\alpha}$-(CuNiSn) phase. Direct aging at $350^{\circ}C$ from the homogenized Cu-5Ni-10Sn alloy promoted the precipitation of finely distributed ${\gamma}$' or ${\gamma}-(Cu,Ni)_3Sn$ phase throughout the matrix, resulting in a significant increase in microhardness and tensile strength. Cold working prior to aging was effective in strengthening Cu-5Ni-10Sn alloy, which gave rise to a maximum tensile strength of 1165 MPa. Subsequent aging treatment slightly reduced the tensile strength to 1000-1100 MPa due to annealing effects.

• 한국재료학회지
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• 제13권2호
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• pp.133-136
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• 2003

Sn-2.5Cu alloy layers were deposited on the Alloy 42 lead-frame substrates by the electroplating method, and their microstructures, adhesion strength, and electrical resistivity were measured to evaluate the applicability of Sn-Cu alloy as a surface finishing material of electronic parts. The Sn-2.5Cu layers were electroplated in the granular form, and composed of pure Sn and Cu$_{6}$Sn$_{5}$ intermetallic compound. Surfaces of the electroplated Sn-2.5Cu layers were rather rough and also the thickness variance was large. The adhesion strength of the Sn-2.5Cu electroplated layers was highly comparable to that of the electroplated Cu alloy layer and the electrical conductivity was about 10 times higher than the pure Sn. After the 20$0^{\circ}C$ 30 min. annealing of the electroplated Sn-2.5Cu layers, the surface roughness was reduced, and adhesion strength and conductivity were improved. These results showed the Sn-Cu alloys can be used as an excellent surface finishing material.ial.

• 마이크로전자및패키징학회지
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• 제19권2호
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• pp.35-39
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• 2012

플립칩 접합시 발생하는 계면반응 거동과 접합특성을 계면에 생성되는 금속간화합물의 관점에서 접근하였다. 이를 위하여 Al/Cu와 Al/Ni의 under bump metallization(UBM) 층과 Sn-Cu계 솔더(Sn-3Cu, Sn-0.7Cu)와의 반응에 의한 금속간화합물의 형성거동 및 계면접합성을 분석하였다. Al/Cu UBM 상에서 Sn-0.7Cu 솔더를 리플로우한 경우에는 솔더/UBM 계면에서 금속간화합물이 형성되지 않았으며, Sn-3Cu를 리플로우한 경우에는 계면에서 생성된 $Cu_6Sn_5$ 금속간화합물이 spalling 되어 접합면이 분리되었다. 반면에 Al/Ni UBM 상에서 Sn-Cu계 솔더를 리플로우한 경우에는 0.7 wt% 및 3 wt%의 Cu 함량에 관계없이 $(Cu,Ni)_6Sn_5$ 금속간화합물이 계면에 형성되어 있었으며, 계면접합이 안정적으로 유지되었다.

• 마이크로전자및패키징학회지
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• 제21권2호
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• pp.91-97
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• 2014

본 연구에서는 고속 전단시험의 변형속도를 500 mm/s로 설정한 상태에서 Sn-Ag-Cu계(Sn-1.0wt.%Ag-0.5Cu 및 Sn-4.0Ag-0.5Cu)뿐만이 아니라 4종의 4원계 Sn-Ag-Cu-In 조성(Sn-1.0Ag-0.5Cu-1.0In, Sn-1.2Ag-0.5Cu-0.4In, Sn-1.2Ag-0.5Cu-0.6In, Sn-1.2Ag-0.7Cu-0.4In)을 포함하는 무연 솔더 접합부의 솔더링 직후 및 시효 시간에 따른 파면 생성결과, 접합강도 및 접합부 파괴에너지값의 변화를 측정, 비교해 보았다. 그 결과, 리플로우 솔더링 직후 및 $125^{\circ}C$에서의 500 시간 시효까지 주로 연성 파괴모드 및 준연성 파괴모드가 관찰되었으며, 준연성 파괴모드의 발생 빈도를 분석할 때 고속 전단조건에서 상용 무연 솔더 조성인 Sn-3.0Ag-0.5Cu 이상의 연성파괴 특성을 나타내는 것으로 파악되었다. 또한 4원계 무연 솔더 조인트는 평균적으로 Sn-Ag-Cu계 조성 수준의 파단에너지값을 나타내었는데, 약 100 시간의 시효 후 최고의 파단에너지값이 관찰되었으나 500 시간의 시효 후에는 파단에너지값의 확연한 감소가 관찰되어 500 시간의 시효시점부터 솔더 접합 계면부의 신뢰성 감소가 가속화되는 경향을 관찰할 수 있었다.

• 마이크로전자및패키징학회지
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• 제20권3호
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• pp.45-51
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• 2013

3차원 적층 패키지를 위한 Cu/Sn-3.5Ag 미세범프의 솔더 구조에 따른 금속간화합물 성장거동을 분석하기 위해 솔더 두께가 각각 $6{\mu}m$, $4{\mu}m$인 서로 다른 구조의 미세범프를 $130^{\circ}C$, $150^{\circ}C$, $170^{\circ}C$ 조건에서 실시간 주사전자현미경을 이용하여 실시간 금속간화합물 성장 거동을 분석하였다. Cu/Sn-3.5Ag($6{\mu}m$) 미세범프의 경우, 많은 양의 솔더로 인해 접합 직후 솔더가 넓게 퍼진 형상을 나타내었고, 열처리 시간경과에 따라 $Cu_6Sn_5$ 및 $Cu_3Sn$금속간화합물이 성장한 후, 잔류 Sn 소모 시점 이후 $Cu_6Sn_5$가 $Cu_3Sn$으로 상전이 되는 구간이 존재하였다. 반면, Cu/Sn-3.5Ag($4{\mu}m$) 미세범프의 경우, 적은양의 솔더로 인해 접합 직후 솔더의 퍼짐 현상이 억제 되었고, 접합 직후 잔류 Sn상이 존재하지 않아서 금속간화합물 성장구간이 억제되고, 열처리 시간경과에 따라 $Cu_6Sn_5$가 $Cu_3Sn$으로 상전이 되는 구간만 존재하였다. 두 시편의 $Cu_3Sn$상의 활성화 에너지의 값은 Cu/Sn-3.5Ag($6{\mu}m$) 및 Cu/Sn-3.5Ag($4{\mu}m$) 미세범프가 각각 0.80eV, 0.71eV로 나타났고, 이러한 차이는 반응기구 구간의 차이에 따른 것으로 판단된다. 따라서, 솔더의 측면 퍼짐 보다는 접합 두께가 미세범프의 금속간화합물 반응 기구를 지배하는 것으로 판단된다.

• 한국재료학회지
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• 제10권11호
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• pp.770-777
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• 2000

기계적 합금화 공정으로 제조한 $1{\mu\textrm{m}}$ 이하 크기의 $Cu_6Sn_5$를 63Sn-37Pb 솔더합금에 첨가하여, $Cu_6Sn_5$ 첨가분율에 따른 미세구조와 기계적 성질을 Cu를 첨가한 솔더합금과 비교하였다. $Cu_6Sn_5$를 첨가한 솔더합금에 비해 Cu를 첨가한 솔더합금에서 첨가분율에 따른 $Cu_6Sn_5$ 함량의 증가와 크기 성장의 정도가 더욱 현저하게 발생하였다. Cu를 첨가한 솔더합금에 비해 $Cu_6Sn_5$를 첨가한 솔더합금에서 항복강도의 향상 정도는 저하하였으나, 더 높은 최대인장강도를 얻을 수 있었다. 1~9 vol%의 $Cu_6Sn_5$를 첨가함에 따란 63Sn-37Pb 솔더합금의 항복강도가 23 MPa에서 36MPa 정도로 증가하였으며, 1~9vol%의 Cu 첨가시에는 항복강도가 40 MPa로 향상되었다. 각기 5 vol%의 $Cu_6Sn_5$와 Cu를 첨가함에 따라 63Sn-37Pb 솔더합금의 인장강도가 34.7 MPa에서 45.3MPa and to 43.1 MPa로 향상되었다.

• Journal of Welding and Joining
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• 제25권2호
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• pp.82-88
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• 2007

Sn-3.0Ag-0.5Cu lead fee solder was generally utilized in electronics assemblies. But it is insufficient to research about activation energy(Q) that is applying to evaluate the solder joint reliability of environmental friendly electronics assemblies. Therefore this study investigated Q values which are needed to IMC formation and growth of Sn-3.0Ag-0.5Cu/Cu and Sn-40pb/Cu solder joints during aging treatment. We bonded Sn-3.0Ag-0.5Cu and Sn-40Pb solders on FR-4 PCB with Cu pad$(t=80{\mu}m)$. After reflow soldering, to observe the IMC formation and growth of the solder joints, test specimens were aged at 70, 150 and $170^{\circ}C$ for 1, 2, 5, 20, 60, 240, 960, 15840, 28800 and 43200 min, respectively. SEM and EDS were utilized to analysis the IMCS. From these results, we measured the total IMC$(Cu_6Sn_5+Cu_3Sn)$ thickness of Sn-3.0Ag-0.5Cu/Cu and Sn-40Pb/Cu interface, and then obtained Q values for the IMC$(Cu_6Sn_5,\;Cu_3Sn)$ growth of the solder joints.

• 대한금속재료학회지
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• 제49권2호
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• pp.180-186
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• 2011

Isothermal annealing and electromigration tests were performed at $125^{\circ}C$ and $125^{\circ}C$, $3.6{\times}10_4A/cm^2$ conditions, respectively, in order to compare the growth kinetics of the intermetallic compound (IMC) in the Cu/thin Sn/Cu bump. $Cu_6Sn_5$ and $Cu_3Sn$ formed at the Cu/thin Sn/Cu interfaces where most of the Sn phase transformed into the $Cu_6Sn_5$ phase. Only a few regions of Sn were not consumed and trapped between the transformed regions. The limited supply of Sn atoms and the continued proliferation of Cu atoms enhanced the formation of the $Cu_3Sn$ phase at the Cu pillar/$Cu_6Sn_5$ interface. The IMC thickness increased linearly with the square root of annealing time, and increased linearly with the current stressing time, which means that the current stressing accelerated the interfacial reaction. Abrupt changes in the IMC growth velocities at a specific testing time were closely related to the phase transition from $Cu_6Sn_5$ to $Cu_3Sn$ phases after complete consumption of the remaining Sn phase due to the limited amount of the Sn phase in the Cu/thin Sn/Cu bump, which implies that the relative thickness ratios of Cu and Sn significantly affect Cu-Sn IMC growth kinetics.