• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1988.05a
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• pp.7-9
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• 1988

This paper considers problems which must be overcome to produce long lengths of superconductor wire from the 90K Tc superconducting ceramic material, $Y_1Ba_2Cu_3Ox$. Attention is focused on the powder-in-tube process where the superconducting powder is placed in a tube which is then formed into wire. Two major problems are considered, control of the oxygen level and improvement of Jc in the final wire. The results show that Jc of the wire were $400A/cm^2$ at liquid nitrogen temp.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.7-13
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• 2019

Power module is getting attention from electronic industries such as solar cell, battery and electric vehicles. Transient liquid phase (TLP) boding, sintering with Ag and Cu powders and wire bonding are applied to power module packaging. Sintering is a popular process but it has some disadvantages such as high cost, complex procedures and long bonding time. Meanwhile, TLP bonding has lower bonding temperature, cost effectiveness and less porosity. However, it also needs to improve ductility of the intermetallic compounds (IMCs) at the joint. Wire boding is also an important interconnection process between semiconductor chip and metal lead for direct bonded copper (DBC). In this study, TLP bonding using Sn-based solders and wire bonding process for power electronics packaging are described.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.820-823
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• 2000

The characteristics of wire deflection, surface roughness and roundness were observed on changing discharge time for electrical discharge machining(EDM) of tungsten carbide in various conditions of thickness. The wire deflection was decreased as increasing discharge time and wire tension, the gap of deflection was decreased after thickness 60mm and discharge time of 6$\mu\textrm{s}$ due to the changing from fundamental mode to vibration mode. The deflection is the smallest at the water specific resistivity of 7.5 kΩ ㆍcm. The deflection is found to be decreased as increasing dwell time, and the result is due to the vibration of the pressure and the amount of the dielectric. The component of copper(Cu) and zinc(Zn), which is the main material of wire electrode, was observed for rough wire-cutting EDM of STD-11. This phenomena is found to be decreased as the number of EDM is increased. But it will be improved by changing the material and the shape of wire. The roundness of middle is found to be worse than that of upper and it is increased as the thickness of material is increased.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.7-11
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• 2013

As thermosonic ball bonding is developed for more and more advanced applications in the electronic packaging industry, the control of process stresses induced on the integrated circuits becomes more important. If Cu bonding wire is used instead of Au wire, larger ultrasonic levels are common during bonding. For advanced microchips the use of Cu based wire is risky because the ultrasonic stresses can cause chip damage. This risk needs to be managed by e.g. the use of ultrasound during the impact stage of the ball on the pad ("pre-bleed") as it can reduce the strain hardening effect, which leads to a softer deformed ball that can be bonded with less ultrasound. To find the best profiles of ultrasound during impact, a numerical model is reported for ultrasonic bonding with capillary dynamics combined with a geometrical model describing ball deformation based on volume conservation and stress balance. This leads to an efficient procedure of ball bond modelling bypassing plasticity and contact pairs. The ultrasonic force and average stress at the bond zone are extracted from the numerical experiments for a $50{\mu}m$ diameter free air ball deformed by a capillary with a hole diameter of $35{\mu}m$ at the tip, a chamfer diameter of $51{\mu}m$, a chamfer angle of $90^{\circ}$, and a face angle of $1^{\circ}$. An upper limit of the ultrasonic amplitude during impact is derived below which the ultrasonic shear stress at the interface is not higher than 120 MPa, which can be recommended for low stress bonding.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.263-266
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• 2003

The fine $YBa_2Cu_3O_x$ powder ($0.2{\sim}1.0\;{\mu}m$) is produced by sol-gel method, and electrophoresis deposition is used for the preparation of $YBa_2Cu_3O_x$ thick films which are deposited on Ag wire. The oriented $YBa_2Cu_3O_x$ was tried to be prepared by the zone-melting method under low oxygen partial pressure. The orientation and the phase composition were examined by the X-ray diffraction and the superconductivities were measured by 4 line method. The critical current densities are still quite low, which may be due to unsuitable technical parameters for zone-melting of $YBa_2Cu_3O_x$ thick films. Therefore the heat treatment condition and controlling of low oxygen partial pressure should be improved in the future experiment.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.806-809
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• 2000

A key technology for achieving commercial Nb$_3$Sn superconducting wires may be driven from fabrication Process of big-scale billets. Sub-element billet with diameter of 200 mm was designed and fabricated. This billet was hot-extruded and drawn. Cu stabilizer tube, Nb barrier tube and 19 sub-elements inserted Sn core were composed for strand. There was no breakage in the strand that was constituted with annealed sub-element. It was need that billet had to treat HIP because of remove of voids and goad contact between Cu and Nb filaments. Ta wound sheet was better than Ta tube thor barrier in the strand. Ic of the Nb$_3$Sn wire at 127, 4.2K was over than 120 A.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.04a
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• pp.222-224
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• 1997

This study is about a connective method of High Tc wire for long wire. We prepared silver-sheathed BiPbSrCaCuO wires by the powder-in-tube method. Since the superconducting wires are ceramic, it is very hard to connect each other. In this study, we used a silver sleeve to contract wires and pressed them by various preasures. Then optimum preasure was 9,000 Kgf/$\textrm{cm}^2$ to get the high critical current. The higest critical current was 10A.

• Electrical & Electronic Materials
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• v.9 no.6
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• pp.600-604
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• 1996

High-T$_{c}$, superconducting wire is very important element for the application of electrical power systems. But it is very difficult to develope the long high T, wire with excellent properties. BiSrCaCuO multi-layer tapes are fabricated by a rolling method and pressing method sintered for several step at 840.deg. C. The critical current densities of 637 filament multi-layer tapes sintering 100 hours fabricated by the rolling method and pressing method are 1.3*10$^{4}$ A/cm$^{2}$ and 5.5*10$^{3}$ A/cm$^{2}$. The critical cur-rent densites of multi-layer tapes made by rolling method are found to be better than those fabricated by the powder-in-tube method and pressing process. As result, the rolling method is the best way to fabricated the multi-layer filament.t.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.956-959
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• 2001

In die and mould industry, major material such as cemented carbide is broadly used for increasing the life time and decreasing the cost. It is also required the development for the skills of wire-cut electrical discharge machining(WEDM), but the WEDMed surface was found to be worst due to the attached components of wire. Precision machining method like lapping is necessary for obtaining high quality surface. The lapping compound such as Al2O3 and SiC and cast iron lap can be used for lapping process. The components of Cu and Zn were found WEDMed surface of the specimen. As the result, the low quality of precision was obtained and the heat damage layer of the specimen was occurred. The value of surface hardness was deteriorated, and therefore finish process was required.

• Transactions of Materials Processing
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• v.14 no.2 s.74
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• pp.147-152
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• 2005

The objective of this study is to develop an optimal drawing die for the clad wire drawing process. Cu-clad wire, which has the advantages of the high strength of a steel core and the electro-conductivity, corrosion resistance of a copper layer, is widely being used in the field of the telecommunications, electric-electronic and military technology industries. It is important to obtain uniformly coated rate when producing clad wires. Drawing process of clad wire will be influenced on damage and coated rate of core and sleeve for process variables such as semi-die angle and reduction in area. Therefore, in this study, the finite-element result obtained in this study was analyzed to the effect of the various forming parameters, which included the semi-die angle and reduction in area. The coated rate will be predicted with observation of copper coated rate variation according to total reduction in area and the optimal pass schedule will be set up through proper reduction in area and semi-die angle variation.