• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.179-179
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• 2011

관통전극(TSV, Trough Silicon Via) 기술은 전자부품의 소형화, 고성능화, 생산성 향상을 이룰 수 있는 기술이다. Cu는 현재 배선 기술에 적용되고 있고 전기적 저항이 낮아서 TSV filling 재료로 사용된다. 하지만 확산 방지막에 의해 완벽히 감싸지지 않는다면, Cu+은 빠르게 절연막을 통과하여 Si 웨이퍼로 확산된다. 이런 현상은 절연막의 누설과 소자의 오동작 등의 신뢰성 문제를 일으킬 수 있다. 현재 TSV의 제조와 열 및 기계적 응력에 관한 연구는 활발히 진행되고 있으나 Biased-Thermal Stress(BTS) 조건하의 Cu 확산에 관한 연구는 활발하지 않는 것이 실정이다. 이를 위해 본 연구에서는 TSV용 Cu 확산 방지막 Ti에 대해 Cu+의 drift 억제 특성을 조사하였다. 실험을 위해 Cu/확산 방지막/Thermal oxide/n-type Si의 평판 구조를 제작하였고 확산 방지막의 두께에 따른 영향을 조사하기 위해 Ti의 두께를 10 nm에서 100 nm까지 변화하였으며 기존 Cu 배선 공정에서 사용되는 확산 방지막 Ta와 비교하였다. 그리고 Cu+의 drift 측정을 위해 Biased-Thermal Stress 조건(Thermal stress: $275^{\circ}C$, Bias stress: +2MV/cm)에서 Capacitance 및 Timedependent dielectric breakdown(TDDB)를 측정하였다. 그 결과 Time-To Failure(TTF)를 이용하여 Cu+의 drift를 측정할 수 있었으며, 확산 방지막의 두께가 증가할수록 TTF가 증가하였고 물질에 따라 TTF가 변화하였다. 따라서 평판 구조를 이용한 본 실험의 Cu+의 drift 측정 방법은 향후 TSV 구조에서도 적용 가능한 방법으로 생각된다.

• Korean Journal of Metals and Materials
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• v.46 no.5
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• pp.283-288
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• 2008

We observed the in-situ stress behavior of Cu and Ag thin films during deposition using a thermal evaporation method. Multi-beam curvature measurement system was used to monitor the evolution of in-situ stress in Cu and Ag thin films on 100 Si(100) substrates. The measured curvature was converted to film stress using Stoney formula. To investigate the effects of the deposition rates on the stress evolution in Cu and Ag thin films, Cu and Ag films were deposited at rates ranging from 0.1 to $3.0{\AA}/s$ for Cu and from 0.5 to $4.0{\AA}/s$ for Ag. Both Cu and Ag films showed a unique three stress stages, such as 'initial compressive', 'a tensile maximum' and followed by 'incremental compressive' stress. For both Cu and Ag films, there is no remarkable effect of deposition rate on the thickness and average stress at the tensile maximum. There is, however, a definite decrease in the incremental compressive stress with increasing deposition rate.

• Journal of the Korean Geotechnical Society
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• v.34 no.2
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• pp.5-17
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• 2018

In this study, the in-situ stress, strength and stress-strain characteristics with shear parameters (UU, CU, ${\bar{CU}}$) are analytically evaluated and the stability analyses are carried out under loading/unloading conditions. The in-situ stress and the stress-strain behaviour may become different according to input shear parameters in finite element analyses with construction step, Especially, if the internal friction angle in Mohr-Coulomb model is set to zero, the in-situ stress and the stress-strain behaviour might not be properly predicted. The results from CU parameter of total stress analysis have no significant difference with the results from CU of effective stress analysis. Therefore, in the numerical analysis for soft ground, CU parameters can be applied to predict in-situ stress and stress-strain behaviors. In addition, the calculation method was proposed to determine the shear parameter of Mohr-Coulomb model, which is corresponding to the shear strength equivalent to that of in-situ soil.

• Journal of the Korean institute of surface engineering
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• v.42 no.5
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• pp.191-196
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• 2009

Nanocrystalline Cu thin films were electrodeposited from sulfate baths and investigated systematically the influences of $Cu^{2+}$ concentration and additives on current efficiency, residual stress, surface morphology, and XRD patterns of electrodeposited Cu film. Current efficiency was nearly 100% at from 0.2M to 1.0 M $Cu^{2+}$ concentration. but it was linearly increased with $Cu^{2+}$ concentration at less than 0.2M. The residual stress was observed in range of 7.9 to 18.4 MPa and tensile stress mode. Dendritic and powdered form was obtained at below 0.1 M. As increased with $Cu^{2+}$ concentration in solution, the main peak in the XRD pattern shifted (111) and (220) from (200). In the other hand, all about 100% current efficiency observed in all additive concentration systems, and residual stress observed in range of 20.4 to 26.3 MPa tensile stress. The condition 5(Ultra make-up - 10 ml/l, Ulta A - 0.5ml/l, Ultr B - 0.5 ml/l) was good surface morphology, and fcc(111) peak in XRD patterns increased with increasing additive concentration.

• Korean Journal of Metals and Materials
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• v.47 no.8
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• pp.466-473
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• 2009

Our group previously observed the intrinsic stress evolution of Cu thin films during deposition by changing the deposition rate. Intrinsic stress of Cu thin films, which show Volmer-Weber growth, is reported to display three unique stress stages, initial compressive, broad tensile, and incremental compressive stress. The mechanisms of the initial compressive stress and incremental compressive stages remain subjects of debate, despite intensive research inquiries. The tensile stress stage may be related to volume contraction through grain growth and coalescence to reduce over-accumulate Cu adatoms on the film surface. The in-situ intrinsic stresses behavior in Cu thin films was investigated in the present study using a multi-beam curvature measurement system attached to a thermal evaporation device. The effect of substrate surface roughness was monitored by observed the in-situ intrinsic stress behavior in Cu thin films during deposition, using $100{\mu}m$ thick Si(111) wafer substrates with three different levels of surface roughness.

• Journal of the Korean Society of Safety
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• v.29 no.4
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• pp.28-33
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• 2014

Recently, the actuator worked by the driving recovery-force of the thermo elastic martensitic transformation of shape memory alloys(SMA) has been studied. This paper presents a study on the fatigue life of shape memory alloy (SMA) actuators undergoing thermally induced martensitic phase transformation under various stress levels. shape memory recoverable stress and strain of Ti-44.5at.%Ni-8at.%Cu alloys were by means of constant temperature tensile tests. Differential scanning calorimetry (DSC) was employed in order to investigate the transformation characteristics of the alloy before the tests. the results were summarized as follows. The martensite inducing stress incerased with the increasing of the Cu-contents. The fatigue life decreased with the increasing of the test load and the Cu-content. The data acquired will be very useful during the design process of an SMA NiTiCu element as a functional part of an actuator.

• Korean Journal of Materials Research
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• v.9 no.10
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• pp.962-969
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• 1999

Elastic and elasto-plastic stress analyses of AlN/Cu and AlN/W pints produced by active-metal brazing method using Ag-Cu-Ti insert-metal were performed with use of Finite-Element-Method(FEM). The results of stress analyses were compared with those from the pint strength tests and the observations of fracture behaviors. It was shown that a remarkably larger maximum principal stress is built in the AlN/Cu pint compared to the A1N/ W joint. Especially, the stress concentration with tensile component was confirmed at the free surface close to the bonded interface of AlN/Cu. The elasto-plastic analysis under consideration of stress relaxation effect of Ag-Cu-Ti insert possessing a so-called 'soft-metal effect' showed that the insert leads to a lowering of maximum principal stress in AlNiCu pint, even though an increase of the insert thickness above 100$\mu\textrm{m}$ could not bring its further decrease. The maximum pint strengths measured by shear test were 52 and 108 MPa for AlNiCu and AlN/W pints. respectively. Typical fractures of AlN/Cu pints occurred in a form of 'dome' which initiated from the free surface of AlN close to the bonded interface and proceeded towards the AlN inside forming a large angle. AlN/W pints were usually fractured at AlN side along the interface of AlN/insert-metal.

• Journal of the Korean Magnetics Society
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• v.20 no.1
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• pp.8-12
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• 2010

The magnetostriction and stress of multilayer $NiFeCr/(Cu/Co_{90}Fe_{10}){\times}N/NiFeCr$ films were investigated. As the number of Cu $15{\AA}$/CoFe $15{\AA}$ bilayers was increased, the saturation magnetostriction decreased from $-5.6\times10^{-6}$ at 2 bilayers to $-8.5\times10^{-6}$ at 20 bilayers. A change of CoFe thickness from 10 to $20{\AA}$ caused a decrease in the magnitude of tensile stress from 980MPa to 590MPa as the number of Cu $15{\AA}$/CoFe $15{\AA}$ bilayers increased from 2 to 20. The maximum magnetostrictive anisotropy field that could be developed due to nonzero magnetostriction and stress is calculated to be 135.7 Oe when the number of Cu $15{\AA}$/CoFe $15{\AA}$ bilayers is 10.

• Journal of the Korean Society for Precision Engineering
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• v.10 no.2
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• pp.146-153
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• 1993

Thd specimens were melited in high frequency induction furnace. The samples for measurements were prepared by machining cylinder of 9.5mm diameter and 15mm height. These samples were then hot-pressed according to strain rate ( .epsilon. ). These samples were decanned and cut out, and subsequently heat treated at 1000 .deg. C for 4hours. These were investigated for the change of microstructure, domain pattern, X-ray diffraction and magnetic properties. The stress distributions in the specimens during compressing process were calculated by a finite element method program(SPID). The calculated stresses were effective stress( .sigma. $_{eff}$), compressive direction stress( .sigma. $_{z}$), and shear stress( .tau. $_{rz}$ ). These stresses were compared with the experimental data.a.a.

• Journal of Ecology and Environment
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• v.30 no.3
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• pp.257-264
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• 2007

Over-expression of a copper/zinc superoxide dismutase (Cu/ZnSOD) resulted in substantially increased tolerance to cadmium exposure in Arabidopsis thaliana. Lower lipid peroxidation and $H_2O_2$ accumulation and the higher activities of $H_2O_2$ scavenging enzymes, including catalase (CAT) and ascorbate peroxidase (APX) in transformants (CuZnSOD-tr) compared to untransformed controls (wt) indicated that oxidative stress was the key factor in cadmium tolerance. Although progressive reductions in the dark-adapted photochemical efficiency (Fv/Fm) and quantum efficiency yield were observed with increasing cadmium levels, the chlorophyll fluorescence parameters were less marked in CuZnSOD-tr than in wi. These observations indicate that oxidative stress in the photosynthetic apparatus is a principal cause of Cd-induced phytotoxicity, and that Cu/ZnSOD plays a critical role in protection against Cd-induced oxidative stress.