• Korean Journal of Materials Research
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• v.11 no.6
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• pp.527-532
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• 2001

Dry etching of copper film using $O_2$ plasma and H(hfac) has been investigated. A one-step process consisting of copper film oxidation with an $O_2$ plasma and the removal of surface copper oxide by the reaction with H(hfac) to form volatile Cu(hfac)$_2$ and $H_2O$ was carried but. The etching rate of Cu in the range from 50 to 700 /min was obtained depending on the substrate temperature, the H(hfac)/O$_2$ flow rate ratio, and the plasma power. The copper film etch rate increased with increasing RF power at the temperatures higher than 215$^{\circ}C$. The optimum H(hfac)/O$_2$ flow rate ratio was 1:1, suggesting that the oxidation process and the reaction with H(hfac) should be in balance. Cu patterning using a Ti mask was performed at a flow rate ratio of 1:1 on 25$0^{\circ}C$\ulcorner and an isotropic etching profile with a taper slope of 30$^{\circ}$was obtained. Cu dry patterning with a tapered angle which is necessary for the advanced high resolution large area thin film transistor liquid-crystal displays was thus successfully obtained from one step process by manipulating the substrate temperature, RF power, and flow rate ratio.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.65-71
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• 2007

For chip-stack package applications, Cu filling characteristics into trench vias of $75{\sim}10\;{\mu}m$ width and 3 mm length were investigated with variations of the electroplating current density and the speed of a rotating disc electrode (RDE). Cu filling characteristics into trench vias were improved with increasing the RDE speed. There was a Nernst relationship between half width of trench vias of Cu filling ratio higher than 95% and the minimum RDE speed, and the half width of trenches with 95% Cu filling ratio was linearly proportional to the reciprocal of root of the minimum RED speed.

• Bulletin of the Korean Chemical Society
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• v.26 no.11
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• pp.1728-1734
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• 2005

The interactions of Cu(II)-meso-Tetrakis(n-N-methylpyridiniumyl)porphyrin (n = 2,3,4), respectively referred to as o-, m- and p-CuTMPyP, and DNA, poly$[d(A-T)_2]$ and poly$[d(G-C)_2]$ were investigated by circular and linear dichroism (CD and LD). In the o-CuTMPyP case, in which the rotation of the pyridinium ring is prevented, the shape of the CD spectrum when associated to DNA and poly$[d(A-T)_2]$ resembles and is characterized by a positive band at a low drug to DNA concentration ratio (R ratio) and is bisignate at a high R ratio. The former CD spectrum shape has been attributed to porphyrin that is bound monomerically outside of DNA while the latter can be attributed to those that are stacked. When o-CuTMPyP is bound to poly$[d(G-C)_2]$, the excitonic CD appeared at a relatively high R ratio. In contrast, a characteristic negative CD band in the Soret region was apparent for both m- and p-CuTMPyP when bound to DNA and poly$[d(G-C)_2]$ at the low R ratios, indicating that the porphyrin molecule intercalates. However, the DNA is bent near the intercalation site and the plane of the porphyrin molecule tilts relative to the DNA helix axis, as judged by the magnitude of the reduced LD. Various stacking patterns were identified by the shape of the CD spectrum for m- and p-CuTMPyP when bound to poly$[d(A-T)_2]$. Three species for the former complex and two for the latter complex were found which may reflect the extent of the stacking.

• Korean Journal of Materials Research
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• v.11 no.4
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• pp.312-318
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• 2001

The mechanical and electrical properties of Cu-Nb filamentary nanocomposite fabricated by the bundling and drawing process were examined. The strength increased gradually with increasing Nb content while the ductility was insensitive to Nb content. The ratio of yield stresses at 293K and 75K are found to be 치ose to that of Young's moduli in various Cu-Nb nanocomposites, suggesting that athermal obstacles primarily control the strength. The fracture morphologies show ductile fractures irrespective of Nb contents. Secondary cracking along the interfaces between subelemental wires was occasionally observed and the frequency of secondary cracking increased with increasing Nb content. The conductivity and the resistivity ratio decreased with increasing Nb content. The decrease of the conductivity and the resistivity ratio(${\rho}_{293k}$/$\{rho}_{75k}$) can be explained by the increasing contribution of interface scattering.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.50 no.1
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• pp.11-16
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• 2001

CuNi alloy films are deposited by co-sputtering of dual targets (Cu and Ni, respectively). Effects of the co-sputtering conditions, such as powers applied to the targets, deposition pressures, and substrate temperatures, on the structural and electrical properties of deposited films are systematically investigated. The composition ratio of Ni/Cu is almost linearly decreased by increasing the DC power applied to the Cu target from 25.6 W to 69.7 W with the RF power applied to the Ni target unchanged(140 W). it is noted that the chamber pressure during deposition and the film thickness give rise to a change of the Ni/Cu ratio within the films deposited. The former may be due to a higher sputtering yield of Cu atom and the latter due to the re-sputtering phenomenon of Cu atoms on the surface of deposited film. The film deposited at higher pressures or at lower substrate temperatures have a smaller crystallite size, a higher electrical resistivity, and much more voids. This may be attributed to a lower surface mobility of sputtered atoms over the substrate.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.7 no.5
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• pp.811-816
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• 2006

The single layered magnetic thin films with anisotropic magnetoresistance behavior have advantage on micro integration due to their low cost in manufacturing. Although the conventional MCo (M=Cu, Ag) amorphous ribbons using a rapid solidification process have showed appropriate for magnetic property for bulk devices, they are not appropriate for micro-scale devices due to their brittleness. We prepared the thermal evaporated 100 nm-thick $Cu_{1-x}Co_x\;and\;Ag_{1-x}Co_x(x=0.1{\sim}0.7)$ films on silicon wafers and investigated the magnetic property of the as-depo films such as magnetization and magnetoresistance ratio. We confirmed that the maximum MR ratio of 1.4 and 2.6% at the external field of 0.5 Tesla in $CuCo_{30},\;AgCo_{40}$ films, respectively. Our result implies that AMR may be slightly less than those of the conventional CuCo and AgCo ribbons due to surface scattering, but their AMR ratio be enough for micro-scale application with easy integration compatibility for the process without surface oxidation.

• Journal of the Korean Applied Science and Technology
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• v.34 no.4
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• pp.883-891
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• 2017

For the preferential oxidation of CO contained in the fuel of polymer electrolyte membrane fuel cell (PEMFC), CuO-$CeO_2$ mixed oxide catalysts were prepared by the sol-gel and co-precipitation methods to replace noble metal catalysts. In the catalyst preparation by the sol-gel method, Cu/Ce ratio and hydrolysis ratio were changed. The catalytic activity of the prepared catalysts was compared with the catalytic activity of the noble metal catalyst($Pt/{\gamma}-Al_2O_3$). Among the catalysts prepared with different Cu/Ce ratios, the catalyst whose Cu/Ce ratio was 4:16 showed the highest CO conversion (90%) and selectivity (60%) at $150^{\circ}C$. As the hydrolysis ratio was increased in the catalyst preparation, surface area increased, and catalytic activity also increased. The highest CO conversions with the CuO-$CeO_2$ mixed oxide catalyst prepared by the co-precipitation method and the noble metal catalyst (1wt% $Pt/{\gamma}-Al_2O_3$) were 82 and 81% at $150^{\circ}C$, respectively, whereas the highest CO conversion with the CuO-$CeO_2$ mixed oxide catalyst prepared by the sol-gel method was 90% at the same temperature. This indicates that the catalyst prepared by the sol-gel method shows higher catalytic activity than the catalysts prepared by the co-precipitation method and the noble metal catalyst. From the CO-TPD experiment, it was found that the catalyst having CO desorption peak at a lower temperature ($140^{\circ}C$) revealed higher catalytic activity.

• Journal of Powder Materials
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• v.11 no.2
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• pp.143-148
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• 2004

In the present study, $TiO_2$ imbedded composite powders have been successfully prepared from the (Cu. Zn)/$TiO_2$ composite salt solution. The composite (Cu, Zn)/$TiO_2$ powders were formed by drying the solution at 200~$600^{\circ}C$ in the hydrogen atmosphere. Photocatalytic characteristics was evaluated by detecting the decomposition ratio of aniline blue with UV-visible spectrophotometer(Shimazu Co., UV-1601). Phase analysis of (Cu, Zn)/$TiO_2$ composite powders was carried out by XRD and DSC, and powder size was measured with TEM. The mean particle size of composite powders was about 100mm. As the reduction temperature increases, a few zinc sulfide and oxide phases was formed and copper oxide phase was reduced. The decomposition ratio of aniline blue was about 80％ under the UV irradiation by the TiO$_2$ phase in the composite (Cu, Zn)/$TiO_2$ powders and similar decomposition ratio of 80％ was obtained at the UV lightless condition by virtue of Cu and Zn compounds.

• Journal of the Korean institute of surface engineering
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• v.30 no.2
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• pp.136-143
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• 1997

The photvoltaic power system has received considerable attention as the petroleumalterative energies to the environmental problems in the wored scale. $CuLnSe_2$is one ofthe most promising materials for the fabrication of large-area modules and low cost photovoltaic devices. Sulfur solute CuInSe2 thin films were prepared by RF sputtering using powder targer which were previously compacted by powder of $Cu_2Se, \;In_2Se_3, \;Cu_2S, \;and\;In_2S_3$ in various ratios. The results induicated that the sulfur ratio, the(112) texture, and the energy band gap were increased by the increase of the S/(S+Se) that was controlled by stoichiometric compound. The energy band gap can be shifted from 1.04eV to 1.50eV by abjusting the S/(S+Se) ratio, which maich it possible to obtain perfect match to the solar spectrum.

• Bulletin of the Korean Chemical Society
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• v.22 no.12
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• pp.1371-1374
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• 2001

Metal doping was adopted to modify TiO2 (P-25) and enhance the photocatalytic degradation of harmful cyanides in aqueous solution. Ni, Cu, Co, and Ag doped TiO2 were found to be active photocatalysts for UV light induced degradation of aqueous cyanides generating cyanate, nitrate and ammonia as main nitrogen-containing products. The photoactivity of Ni doped TiO2 was greatly affected by the state of Ni, that is, the crystal size and the degree of reduction of Ni. The modification effects of some mixed oxides, that is, Ni-Cu/TiO2 were also studied. The activity of Ni-Cu/TiO2 for any ratio of Cu/Ni was higher than that of Ni- or Cu-doped TiO2, and the catalyst at the Cu/Ni ratio of 0.3 showed the highest activity for cyanide conversion.