• Journal of the Microelectronics and Packaging Society
• /
• v.13 no.4
• /
• pp.57-63
• /
• 2006

For chip-stack package applications, Cu filling characteristics into trench vias of $75{\sim}10\;{\mu}m$ width and 3 mm length were investigated with variations of electroplating current density and current mode. At $1.25mA/cm^{2}$ of DC mode, Cu filling ratio higher than 95% was obtained for trench vias of $75{\sim}35{\mu}m$ width. When electroplated at DC $2.5mA/cm^{2}$, Cu filling ratios became inferior to those processed at DC $1.25mA/cm^{2}$. Pulse current mode exhibited Cu filling characteristics superior to DC current mode.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2001.11a
• /
• pp.67-73
• /
• 2001

To investigate the relationships of solder joint characteristics with solder composition and A:V ratio (solder volume per pad area), Sn-37Pb and Sn-4.0Ag-0.5Cu solder balls with 330, 400, 450 and $457{\mu}{\textrm}{m}$ size were reflowed on same substrate. Sn-37Pb and Sn-4.0Ag-0.5Cu was reflowed at $220^{\circ}C$ and $240^{\circ}C$ respectively by IR-type soldering machine. As a result of reflowed solder- ball diameter(D) and height(H) measurement, D/H was decreased with solder ball size increment in range of 330~450 ${\mu}{\textrm}{m}$. But, D/H was increased in the solder joint for 457 ${\mu}{\textrm}{m}$ size, it was caused possibly by decrement of solder ball height increment compared with solder volume increment. As a result of shear and pull test, joint strength with A:V ratio was high. Joint strength of Sn-4.0Ag-0.5Cu was higher than Sn-37Pb. However, Sn-37Pb had more stable solder joint of small standard deviation. A thick and clean scallop type Ni-Cu-Sn intermetallic compound layer was formed in high A:V ratio and Sn-4.0Ag-0.5Cu solder joint interface.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.29 no.7
• /
• pp.414-423
• /
• 2016

In the present study, the $CuN_x-Cu-CuN_x$ layer the partial pressure ratio Cu metal of Ar and $N_2$ gas using a DC magnetron sputtering device, was generated by the In-situ method. $CuN_x$ layer was able to obtain a surface reflectance reduction effect from the advantages of the process and the external light. $CuN_x$ layer is gas partial pressure, DC the Power, the deposition time variable transmittance in response to the thickness and partial pressure ratio, the reflectance was measured. $Ar:N_2$ gas ratio 10:10(sccm), DC power 0.35 A, was derived Deposition time 90 sec optimum conditions. Thus, according to the optimal thickness and the composition ratio was derived surface reflectance of 20.75%. In addition, to derive the value of ${\Delta}$ Ra surface roughness of 0.467. It was derived $CuN_x$ band-gap energy of about 2.2 eV. Thus, to ensure a thickness and process conditions can be absorbed to maximize the light in a wavelength band in the visible light region. As a result, the implementation of the $12k{\Omega}$ base line resistance of using the Cu metal. This is, 5 inch Metal mesh TSP(L/S: $4/270{\mu}m$) is in the range of the reference operation.

• Journal of Powder Materials
• /
• v.12 no.3
• /
• pp.192-200
• /
• 2005

Ultrafine copper powder was prepared from $CuO-H_2O$ slurry with hydrazine, a reductant, under $70^{\circ}C$. The influence of various reaction parameters such as temperature, reaction time, molar ratio of $N_2H_4$, PvP and NaOH to Cu in aqueous solution had been studied on the morphology and powder phase of Cu powders obtained. The production ratio of Cu from CuO was increased with the ratio of $N_2H_4/Cu$ and the temperature. When the ratio of $N_2H_4/Cu$ was higher than 2.5 and the temperature was higher than $60^{\circ}C$, CuO was completely reduced into Cu within 40 min. The crystalline size of Cu obtained became fine as the temperature increase, whereas the aggregation degree of particles was increased with the reaction time. The morphology of Cu powder depended on that of the precursor of CuO and processing conditions. The average particle size was about $0.5{\mu}m$.

• Journal of the Korean Magnetics Society
• /
• v.5 no.3
• /
• pp.203-209
• /
• 1995

A study of the dependence of the magnetoresistance in $glass\[Cu_{x\AA}\NiFe_{50\AA}\Cu_{x\AA}\Co_{50\AA}](X;\=\;8,\;10,\;14,\;18,\;22,\;26,\;28,\;38,\;48,\;58\;\AA,\;N\;=\;2,\;3,\;4,\;10,\;20)$ multilayers prepared by dc magnetron sputtering on the interlayer thickness of Cu (X), the number of multylayer(N) and annealing temperature has been performed. Resistance measurement were made by four terminal method, and the magnetic field applied to perpendicular and parallel for the current. The maximum magnetoresistance(MR) ratio(%) was appeared in the vicinity of $10\;\AA$ in Cu layer, and it was oscillated with the thickness of Cu. The MR ratio was increased with the number of layers N, however the ratio for the N = 4 layers decreased rather than the N = 3 layers. The dependence of the ratio on the annealing temperature was increased to $250^{\circ}C$.

• Journal of the Korean Magnetics Society
• /
• v.8 no.2
• /
• pp.79-85
• /
• 1998

The $[Ni_{80}Fe_{20}/Cu/Co/Cu]$ multilayers were grown by evaporation technique, and according to magnetic exchange coupling relation, magnetoresistance ratio and magnetization curve were studied by Co inserting $Ni_{80}Fe_{20}/Cu$ interface. Insertion of Co layer to the antiferromagnetically coupled system, i. e $t_{Cu} = 25\;{\AA}$, decrese the MR ratio contrary to previous reports. However the insertion to the ferromagneticalyl coupled $(t_{Cu} = 27\;{\AA})$ and the noncoupled $(t_{Cu} = 47\;{\AA})$ systems increase the ratio to 3.5 % and 6 % respectively. The results imply that the insertion change the magnetic exchange coupling state as well as the spin dependent scattering of conduction electrons. Besides, insertion of Co layer between Cu and $Ni_{80}Fe_{20}$ layer enhaces thermal stability to the 300 $^{\circ}C$, which indicates that insertion of Co has a role of the effective diffusion barrier.

• Journal of the Korean Magnetics Society
• /
• v.14 no.1
• /
• pp.25-28
• /
• 2004

The dependence of sensitivity, MR ratio, coercivity (Hc) and switching fields as a function of thickness of each magnetic layers(Co, NiFe and Cu) were investigated in pseudo spin valves with a structure of Ta/NiFe/Cu/Co. As measured results dependence of the thickness of each magnetic layer, we obtained MR ratio of 7.26% for Ta(4 nm)/NiFe(7.5 nm)/Cu(3 nm)/Co(5 nm) pseudo spin valves. Also, we could control properties of magnetoresistance for independent magnetization courses of each magnetic layer. Especially, we found that we could control coercivity as constant MR ratio dependence of Co thickness.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.02a
• /
• pp.370-370
• /
• 2012

Feature size of Cu interconnects keep shrinking into several tens of nanometer level. For this reason, the Cu interconnects face challenging issues such as increase of electro-migration, line-width dependent electrical resistivity increase, and gap-filling difficulty in high aspect ratio structures. As the thickness of the Cu film decreases below 30 nm, the electrical resistivity is not any more constant, but rather exponential. Research on alloying with other elements have been started to inhibit such escalation in the electrical resistivity. A faint trace of Al added in Cu film by sputtering was reported to contribute to suppression of the increase of the electrical resistivity. From an industrial point of view, we introduced cyclic metal organic chemical vapor deposition (MOCVD) in order to control Al concentration in the Cu film more easily by controlling the delivery time ratio of Cu and Al precursors. The amount of alloying element could be lowered at level of below 1 at%. Process of the alloy formation was applied into gap-filling to evaluate the performance of the gap-filling. Voidless gap-filling even into high aspect ratio trenches was achieved. In-depth analysis will be discussed in detail.

• Pediatric Gastroenterology, Hepatology & Nutrition
• /
• v.27 no.1
• /
• pp.53-61
• /
• 2024

Purpose: Although the 24-hours urinary copper excretion is useful for the diagnosis of Wilson disease (WD), there are practical difficulties in the accurate and timed collection of urine samples. The purpose of this study was to verify if the spot morning urinary Copper/Zinc (Cu/Zn) ratio could be used as a replacement parameter of 24-hours urinary copper excretion in the diagnosis of WD. Methods: A cross-sectional study was conducted at the Department of Pediatric Gastroenterology and Nutrition, Bangabandhu Sheikh Mujib Medical University (BSMMU), Dhaka, Bangladesh, from June 2019 to May 2021 on 67 children over three years of age who presented with liver disease. Twenty-seven children who fulfilled the inclusion criteria for WD were categorized into the test group, and the remaining forty children were considered to have non-Wilsonian liver disease and were categorized into the control group. Along with other laboratory investigations, spot morning urinary samples were estimated for the urinary Cu/Zn ratio in all patients and were compared to the 24-hour urinary copper excretion. The diagnostic value of the Cu/Zn ratio was then analyzed. Results: Correlation of spot morning urinary Cu/Zn ratio with 24-hours urinary copper excretion was found to be significant (r=0.60). The area under ROC curve with 95% confidence interval of morning urinary Cu/Zn ratio measured using 24-hours urine sample was 0.84 (standard error, 0.05; p<0.001). Conclusion: Spot morning urinary Cu/Zn ratio seems to be a promising parameter for the replacement of 24-hours urinary copper excretion in the diagnosis of WD.

• Journal of the Korean Applied Science and Technology
• /
• v.31 no.2
• /
• pp.313-319
• /
• 2014

This study was performed to obtain high conversion efficiency of $NH_3$ and minimize generation of nitrogen oxides using metal-supported catalyst with Ag : Cu ratio. Through structural analysis of the prepared catalyst with Ag : Cu ratio ((10-x)Ag-xCu ($0{\leq}x{\leq}6$)), it was confirmed that the specific surface area was decrease with increasing metal content. A prepared catalysts showed Type II adsorption isotherms regardless of the ratio Ag : Cu of metal content, and crystalline phase of $Ag_2O$, CuO and $CuAl_2O$ was observed by XRD analysis. In the low temperature($150{\sim}200^{\circ}C$), a conversion efficiency of AC_10 recorded the highest(98%), whereas AC_5 (Ag : Cu = 5 : 5) also showed good conversion efficiency(93.8%). However, in the high temperature range, the amounts of by-products(NO, $NO_2$) formed with AC_5 was lower than that of AC_10. From these results, It is concluded that AC_5 is more environmentally and economically suitable.