• Tribology and Lubricants
• /
• 제39권3호
• /
• pp.111-117
• /
• 2023

This paper presents an experimental investigation of the tribological characteristics of PTFE composites filled with nano CuO particles under low sliding speed and load. All the specimens were prepared by sintering. Before sintering, the mixture of PTFE powder and CuO particles were mixed by a high-speed mixer using CuO volume fractions of 0.2 vol. % and 5 vol. %. Each mixture was sintered at 350 ℃ for 30 min on the steel disk. We conducted ball-on-disk sliding test an hour using a steel ball against PTFE composites, including pure PTFE. The load and sliding speed used was 2 N and 0.01 m/s, respectively. Adding nano CuO particles increases the friction coefficient because of the abrasiveness of hard nano CuO particles. The highest coefficient of frictions was obtained from 5 vol. % CuO. Conversely, the lowest wear of the composites was obtained from the 5 vol. % CuO nanocomposite. This study reveals that the addition of nano CuO particles can lower the wear of PTFE, despite an increase in the coefficient of friction. However, the coefficient friction is still moderate compared to other engineering polymers. In addition, the amount of CuO nano particles has to be optimized to reduce friction and wear at the same time.

• 한국재료학회지
• /
• 제27권4호
• /
• pp.221-228
• /
• 2017

Various morphologies of copper oxide (CuO) have been considered to be of both fundamental and practical importance in the field of electronic materials. In this study, using Cu ($0.1{\mu}m$ and $7{\mu}m$) particles, flake-type CuO particles were grown via a wet oxidation method for 5min and 60min at $75^{\circ}C$. Using the prepared CuO, AlN, and silicone base as reagents, thermal interface material (TIM) compounds were synthesized using a high speed paste mixer. The properties of the thermal compounds prepared using the CuO particles were observed by thermal conductivity and breakdown voltage measurement. Most importantly, the volume of thermal compounds created using CuO particles grown from $0.1{\mu}m$ Cu particles increased by 192.5 % and 125 % depending on the growth time. The composition of CuO was confirmed by X-ray diffraction (XRD) analysis; cross sections of the grown CuO particles were observed using focused ion beam (FIB), field emission scanning electron microscopy (FE-SEM), and energy dispersive analysis by X-ray (EDAX). In addition, the thermal compound dispersion of the Cu and Al elements were observed by X-ray elemental mapping.

• 한국재료학회지
• /
• 제13권9호
• /
• pp.555-560
• /
• 2003

Ag-coated Cu particles were prepared by dropping method of coating agent and were evaluated by scanning electron microscope and color difference meter. The shape of Cu particles having obvious crystal plan and edge was changed spherically according to the increase of Ag coating amount. When the Ag coating amount was 50 wt% to Cu particles, the whiteness of Ag-coated Cu particles was almost similar to that of pure Ag particles. Adding $NH_4$OH in reductant solution could increase effectively the whiteness of the Ag-coated particles. The Ag-coated particles having the highest whiteness was obtained when the content of hydrazine in reductant solution was 0.48 M.

• 한국표면공학회지
• /
• 제40권1호
• /
• pp.11-15
• /
• 2007

Stable metallic Cu/Zn nanoparticles were prepared in the base oil phase by hydrothermal method. The physical properties, such as crystal structure, crystallite size and crystallinity according to synthesis conditions have been investigated by XRD, FT-IR and TEM. In addition, 4-ball test has been performed in order to investigate the frictional wear properties of prepared nanosized Cu/Zn particles. The peaks of the X-ray diffraction pattern indicate that the particle size was very small and crystallinity of Cu/Zn particles was good. The micrographs of TEM showed that nanosized Cu/Zn particles possessed a spherical morphology with a narrow size distribution. The crystallite size of the Cu/Zn particles synthesized in base oils was 23-30 nm. It was found that the antiwear capacity increases with increasing Cu/Zn concentration. When the concentration of Cu/Zn was 5.0 wt%, the wear scar diameters was 0.38 mm.

• 한국주조공학회지
• /
• 제17권5호
• /
• pp.480-487
• /
• 1997

Particle reinforced metal matrix composites(MMCs) via a centrifugal spray-cast deposition(CSD) process were fabricated by injecting second phase particles($Al_2O_3$<40${\mu}m$, W<17.3${\mu}m$) into copper melt on the atomizing disc. Compositing modes were investigated by combining microstructures and mathematical modeling between Cu droplets and the reinforced particles injected. The $Cu/W_P$ powders were shown that the W particles penetrate and get embedded in the Cu droplets. It is considered that the W particles composite preferentially in Cu melt on the atomizing disc. On the other hand, the $Al_2O_3$, particles did not penetrate into the Cu droplets on the atomizing disc but get attached in surface of Cu droplets during the flight. It is considered that the compositing may be attained in the flight distance which the relative velocity between Cu droplet and $Al_2O_3$, particle is maximum. The microstructure of the $Cu/W_P$ and the $Cu/(Al_2O_3)_p$ composite preform was strongly influenced by compositing modes of droplets, and after subsequent deposition it was comprised as it is called the dispersed type and the cell type of microstructure, respectively.

• 한국재료학회지
• /
• 제13권8호
• /
• pp.524-530
• /
• 2003

In order to prepare the uniform copper particles from copper sulfate solution by using hydrazine as a reduction agents, the reduction behavior of copper particles from copper sulfate was investigated in detail at room temperature by the observation of reaction products. The effects of $NH_4$OH and $Na_4$$P_2$$O_{7}$ on the formation of uniform copper particles were discussed. ($NHCu_3$)$_4$$SO_4$was completely formed at over pH 11 by adding $NH_4$OH in copper sulfate solution. The fine $Cu_2$O with the particle size of 50 nm was produced in the initial reduction process of (NH$Cu_3$)$_4$$SO_4$solution with $Na_4$$P_2$$O_{ 7}$ and then the Cu$_2$O was converted into copper particles by inserting additional hydrazine. When Cu(NH$_3$)$_4$SO$_4$solution with $Na_4$$P_2$$O_{ 7}$ was reduced at $80^{\circ}C$ by hydrazine, the highly dispersed copper particles with the particle size of about 0.8 $\mu\textrm{m}$ was obtained.

• 마이크로전자및패키징학회지
• /
• 제21권4호
• /
• pp.133-137
• /
• 2014

직경 수 마이크론급의 Ag 코팅 Cu 플레이크를 제조하기 위한 선행공정으로 습식 화학적 합성법으로 제조된 서브마이크론급의 Cu 입자를 볼 밀링 공정을 통해 프레이크화 하였다. 입자들의 산화 및 응집을 막기 위해 볼 밀링 유체로는 에틸렌글리콜을 사용하였고, 에틸아세테이트 표면개질제도 첨가하였다. 용기의 회전수에 따른 실험 결과를 통해 회전수에 따른 회전 모드의 변화가 밀링 후 Cu 입자들의 평균적인 형상과 형상 균일도를 크게 변화시킴을 확인할 수 있었다. 또한 첨가한 지르코니아 볼의 직경 역시 Cu 입자들의 플레이크화 균일도를 결정하는 대표 공정변수임을 확인할 수 있었다. 그 결과 다소간의 응집체를 포함한 서브마이크론급의 Cu 입자를 사용했음에도 불구하고, 회전수, 표면개질제 첨가량, 그리고 지르코니아 볼의 직경 등의 대표 공정변수들을 최적화한 볼 밀링 공정을 통해 분산성이 우수한 수 마이크론급의 Cu 플레이크를 성공적으로 제조할 수 있었다.

• 한국재료학회지
• /
• 제15권4호
• /
• pp.263-270
• /
• 2005

In order to prepare the uniform copper particles from copper chloride solution, the reduction behavior of copper particles from copper chloride and the effects of reduction agent and dispersing agent was investigated. In the case that 2.56 M of $C_6H_8O_6$ was used as a reduction agent, the highly dispersed Cu particles with sharp size distribution were generated from 0.96M of copper chloride solution, and the size of Cu particles was $6\~10\;{\mu}m$. To form $Cu(NH_3)_4Cl_2$ complex solution, $NH_4OH$ was added in the copper chloride solution before the reductive reaction of Cu ion. The generated Cu particles have a two kind of shape, spherical and rod-like. In the case that $N_2H_4{\cdot}H_2O$ was used as a reduction agent, the very fine spherical Cu particles with the size of $0.2\~0.5\;{\mu}m$ was obtained. Arabic gum as a dispersing agent was more effective than $Na_4P_2O_7{\cdot}10H_2O$.

• 공업화학
• /
• 제29권6호
• /
• pp.782-788
• /
• 2018

서브 미크론 구리-은 코어-쉘 Cu@Ag 입자를 초음파화학과 결합된 금속교환 반응으로 합성하고 인쇄용 전자부품을 위한 저렴한 전도성 페이스트 적용을 평가하였다. 코어-쉘의 합성을 위한 반응에서 코어로 사용된 $Cu_2O/Cu$ 복합체의 $Cu_2O$는 초음파화학 반응으로 Cu로 환원되고 Cu 원자는 Ag의 금속교환 반응의 환원제로 작용하여 코어 표면에 Ag가 코팅된 코어-쉘 구조를 얻었다. TEM-EDS와 TG-DSC를 이용하여 서브 미크론 입자의 코어-쉘 구조를 확인하였다. 70 wt% Cu@Ag를 용매에 분산시킨 전도성 페이스트를 결합제와 습윤제를 사용하여 제조하고, 스크린 인쇄법을 사용하여 폴리아미드 필름상에 코팅하였다. Ag 함량이 8 at%와 16 at%인 Cu@Ag 입자를 함유하는 인쇄된 페이스트 필름은 공기 중의 $180^{\circ}C$에서 소결한 후 각각 96.2와 $38.4{\mu}{\Omega}cm$의 낮은 비저항 값을 나타내었다.

• 마이크로전자및패키징학회지
• /
• 제24권4호
• /
• pp.65-71
• /
• 2017

내산화성 및 Ag 함량을 증가시킨 Cu계 필러 소재를 제조하고자 평균 직경 $2{\mu}m$의 구형 Cu 입자에 약 40 wt.% 수준으로 Ag를 코팅한 Ag 코팅 Cu 입자를 제조하여 그 내산화 거동을 분석하였다. Ethylenediaminetetraacetic acid 착화제만을 첨가하여 제조된 Ag 코팅 Cu 입자는 Ag 이온들과 Cu 원자들간의 과도한 갈바닉 치환 반응에 의한 Ag shell/Cu core 계면의 분리 및 입자 내부가 비어있는 결함 입자들이 종종 생성되어 Ag 코팅 Cu 입자의 형상이 무너지는 문제점들이 관찰되었다. 그 결과 40 wt.%의 Ag 코팅 후 결함 입자들의 총 분율은 19.88%까지 증가하였다. 그러나 hydroquinone 환원제를 추가적으로 첨가하여 40 wt.% Ag를 코팅시킨 Cu 입자들의 경우 결함 생성률이 9.01%까지 감소하였고, 표면이 매끄럽고 상대적으로 치밀한 Ag shell이 형성되면서 $160^{\circ}C$의 대기 중에서 2시간동안 노출 시에도 산화에 의한 무게 증가가 관찰되지 않아 향상된 내산화 특성을 나타내었다.