• Tribology and Lubricants
• /
• v.39 no.3
• /
• pp.111-117
• /
• 2023

This paper presents an experimental investigation of the tribological characteristics of PTFE composites filled with nano CuO particles under low sliding speed and load. All the specimens were prepared by sintering. Before sintering, the mixture of PTFE powder and CuO particles were mixed by a high-speed mixer using CuO volume fractions of 0.2 vol. % and 5 vol. %. Each mixture was sintered at 350 ℃ for 30 min on the steel disk. We conducted ball-on-disk sliding test an hour using a steel ball against PTFE composites, including pure PTFE. The load and sliding speed used was 2 N and 0.01 m/s, respectively. Adding nano CuO particles increases the friction coefficient because of the abrasiveness of hard nano CuO particles. The highest coefficient of frictions was obtained from 5 vol. % CuO. Conversely, the lowest wear of the composites was obtained from the 5 vol. % CuO nanocomposite. This study reveals that the addition of nano CuO particles can lower the wear of PTFE, despite an increase in the coefficient of friction. However, the coefficient friction is still moderate compared to other engineering polymers. In addition, the amount of CuO nano particles has to be optimized to reduce friction and wear at the same time.

• Korean Journal of Materials Research
• /
• v.27 no.4
• /
• pp.221-228
• /
• 2017

Various morphologies of copper oxide (CuO) have been considered to be of both fundamental and practical importance in the field of electronic materials. In this study, using Cu ($0.1{\mu}m$ and $7{\mu}m$) particles, flake-type CuO particles were grown via a wet oxidation method for 5min and 60min at $75^{\circ}C$. Using the prepared CuO, AlN, and silicone base as reagents, thermal interface material (TIM) compounds were synthesized using a high speed paste mixer. The properties of the thermal compounds prepared using the CuO particles were observed by thermal conductivity and breakdown voltage measurement. Most importantly, the volume of thermal compounds created using CuO particles grown from $0.1{\mu}m$ Cu particles increased by 192.5 % and 125 % depending on the growth time. The composition of CuO was confirmed by X-ray diffraction (XRD) analysis; cross sections of the grown CuO particles were observed using focused ion beam (FIB), field emission scanning electron microscopy (FE-SEM), and energy dispersive analysis by X-ray (EDAX). In addition, the thermal compound dispersion of the Cu and Al elements were observed by X-ray elemental mapping.

• Korean Journal of Materials Research
• /
• v.13 no.9
• /
• pp.555-560
• /
• 2003

Ag-coated Cu particles were prepared by dropping method of coating agent and were evaluated by scanning electron microscope and color difference meter. The shape of Cu particles having obvious crystal plan and edge was changed spherically according to the increase of Ag coating amount. When the Ag coating amount was 50 wt% to Cu particles, the whiteness of Ag-coated Cu particles was almost similar to that of pure Ag particles. Adding $NH_4$OH in reductant solution could increase effectively the whiteness of the Ag-coated particles. The Ag-coated particles having the highest whiteness was obtained when the content of hydrazine in reductant solution was 0.48 M.

• Journal of the Korean institute of surface engineering
• /
• v.40 no.1
• /
• pp.11-15
• /
• 2007

Stable metallic Cu/Zn nanoparticles were prepared in the base oil phase by hydrothermal method. The physical properties, such as crystal structure, crystallite size and crystallinity according to synthesis conditions have been investigated by XRD, FT-IR and TEM. In addition, 4-ball test has been performed in order to investigate the frictional wear properties of prepared nanosized Cu/Zn particles. The peaks of the X-ray diffraction pattern indicate that the particle size was very small and crystallinity of Cu/Zn particles was good. The micrographs of TEM showed that nanosized Cu/Zn particles possessed a spherical morphology with a narrow size distribution. The crystallite size of the Cu/Zn particles synthesized in base oils was 23-30 nm. It was found that the antiwear capacity increases with increasing Cu/Zn concentration. When the concentration of Cu/Zn was 5.0 wt%, the wear scar diameters was 0.38 mm.

• Journal of Korea Foundry Society
• /
• v.17 no.5
• /
• pp.480-487
• /
• 1997

Particle reinforced metal matrix composites(MMCs) via a centrifugal spray-cast deposition(CSD) process were fabricated by injecting second phase particles($Al_2O_3$<40${\mu}m$, W<17.3${\mu}m$) into copper melt on the atomizing disc. Compositing modes were investigated by combining microstructures and mathematical modeling between Cu droplets and the reinforced particles injected. The $Cu/W_P$ powders were shown that the W particles penetrate and get embedded in the Cu droplets. It is considered that the W particles composite preferentially in Cu melt on the atomizing disc. On the other hand, the $Al_2O_3$, particles did not penetrate into the Cu droplets on the atomizing disc but get attached in surface of Cu droplets during the flight. It is considered that the compositing may be attained in the flight distance which the relative velocity between Cu droplet and $Al_2O_3$, particle is maximum. The microstructure of the $Cu/W_P$ and the $Cu/(Al_2O_3)_p$ composite preform was strongly influenced by compositing modes of droplets, and after subsequent deposition it was comprised as it is called the dispersed type and the cell type of microstructure, respectively.

• Korean Journal of Materials Research
• /
• v.13 no.8
• /
• pp.524-530
• /
• 2003

In order to prepare the uniform copper particles from copper sulfate solution by using hydrazine as a reduction agents, the reduction behavior of copper particles from copper sulfate was investigated in detail at room temperature by the observation of reaction products. The effects of $NH_4$OH and $Na_4$$P_2$$O_{7}$ on the formation of uniform copper particles were discussed. ($NHCu_3$)$_4$$SO_4$was completely formed at over pH 11 by adding $NH_4$OH in copper sulfate solution. The fine $Cu_2$O with the particle size of 50 nm was produced in the initial reduction process of (NH$Cu_3$)$_4$$SO_4$solution with $Na_4$$P_2$$O_{ 7}$ and then the Cu$_2$O was converted into copper particles by inserting additional hydrazine. When Cu(NH$_3$)$_4$SO$_4$solution with $Na_4$$P_2$$O_{ 7}$ was reduced at $80^{\circ}C$ by hydrazine, the highly dispersed copper particles with the particle size of about 0.8 $\mu\textrm{m}$ was obtained.

• Journal of the Microelectronics and Packaging Society
• /
• v.21 no.4
• /
• pp.133-137
• /
• 2014

As a preceding process for preparing several micrometer sized Ag-coated Cu flakes, ball milling of submicrometer-sized Cu particles synthesized through a wet chemical method was performed in order to convert the particles into flakes. To suppress oxidation and aggregation of the particles during ball milling, ethylene glycol and ethyl acetate were used as a medium and a surface modifying agent, respectively. Results obtained with different rotation speeds of a jar indicated that the rotation speed changes a rotating mode, and strikingly alters the final shapes and shape uniformity of Cu particles after milling. The diameter of zirconia ball was also confirmed. Although there was aggregates in the initial submicrometer-sized Cu particles, therefore, well-dispersed Cu flakes with a size of several micrometers were successfully prepared by ball milling through optimization of rotation speed, amount of ethyl acetate, and diameter of zirconia ball.

• Korean Journal of Materials Research
• /
• v.15 no.4
• /
• pp.263-270
• /
• 2005

In order to prepare the uniform copper particles from copper chloride solution, the reduction behavior of copper particles from copper chloride and the effects of reduction agent and dispersing agent was investigated. In the case that 2.56 M of $C_6H_8O_6$ was used as a reduction agent, the highly dispersed Cu particles with sharp size distribution were generated from 0.96M of copper chloride solution, and the size of Cu particles was $6\~10\;{\mu}m$. To form $Cu(NH_3)_4Cl_2$ complex solution, $NH_4OH$ was added in the copper chloride solution before the reductive reaction of Cu ion. The generated Cu particles have a two kind of shape, spherical and rod-like. In the case that $N_2H_4{\cdot}H_2O$ was used as a reduction agent, the very fine spherical Cu particles with the size of $0.2\~0.5\;{\mu}m$ was obtained. Arabic gum as a dispersing agent was more effective than $Na_4P_2O_7{\cdot}10H_2O$.

• Applied Chemistry for Engineering
• /
• v.29 no.6
• /
• pp.782-788
• /
• 2018

Submicron copper-silver core-shell (Cu@Ag) particles were synthesized using the sonochemical combined transmetallation reaction and the application to printed electronics as a low cost conductive paste was evaluated. $Cu_2O$ of the $Cu_2O/Cu$ composite used as a core in the reaction for the synthesis of core-shell was sonochemically reduced to Cu, and Cu atoms functioned as a reducer for silver ions in transmetallation to achieve the copper-silver core-shell structure. The characterization of submicron particles by TEM-EDS and TG-DSC confirmed the core-shell structure. Conductive pastes in which 70 wt% Cu@Ag was dispersed in solvents were prepared using a binder and wetting agents, and coated on the polyamide film using a screen-printing method. Printed paste films containing synthesized Cu@Ag particles with 8 at% and 16 at% Ag exhibited low resistivity of 96.2 and $38.4{\mu}{\Omega}cm$ after sintering at $180^{\circ}C$ in air, respectively.

• Journal of the Microelectronics and Packaging Society
• /
• v.24 no.4
• /
• pp.65-71
• /
• 2017

To prepare the Cu-based filler material indicating enhanced oxidation resistance property and Ag content, Ag-coated Cu particles was fabricated by Ag plating of 40 wt % on the spherical Cu particles with an average size of $2{\mu}m$ and their oxidation behavior was also evaluated. In the case that ethylenediaminetetraacetic acid was used alone, the fabricated particles frequently showed broken structures such as delamination at Ag shell/core Cu interface and hollow structure that are induced by excessive galvanic displacement reaction. As a result, fraction of defect particles increased up to 19.88% after the Ag plating of 40 wt.%. However, the fraction in the 40 wt.% Ag-coated Cu particles decreased to 9.01% and relatively smooth surface and dense microstructure in the Ag shell were also observed with additional usage of hydroquinone as a complexing agent. Ag-coated Cu particles having the enhanced microstructure did not show any weight increase by oxidation for exposure to air at $160^{\circ}C$ for 2 h, indicating increased oxidation resistance property.