• Proceedings of the Materials Research Society of Korea Conference
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• 1992.05a
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• pp.16-16
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• 1992

We have studied the effect of platinum addition on the supercon ducting properties of YB $a_2$C $u_3$$O_{7-x}$ (123) compound and elucidated the mechanism of fine dispersion of $Y_2$BaCu $O_{5}$(211) particles in YB $a_2$C $u_3$$O_{7-x}$ superconductor prepared by melting method from the metallurgical point of view. In this study, BaCu $O_2$ and CuO-rich phase unreacted during the peritecitc reaction markedly decreased by the 211 powder addition. The 211 particle of Pt-fee sintered samples exhibited 8~10$\mu$m in size, but in 1wt%Pt-added sample, 211 particles were finely dispersed in 123 matrix and the size of 211 particle was about 1~2$\mu$m. And, the critical temperature( $T_{c. zero}$) of Pt doped samples was 91.5K and the transport critical current density ( $J_{c}$) of Pt-doped samples was much more than 10$^4$A/$\textrm{cm}^2$. The high $J_{c}$ and fine dispersion of 211 particles of Pt doped YB $a_2$C $u_3$$O_{7-x}$ superconductor are attributed to $Ba_4$CuP $t_2$ $O_{8}$ compounds formed during the partial melting, which were considered als nucleation sites of 211 particles, rather than Pt inself.han Pt inself.

• Applied Microscopy
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• v.43 no.3
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• pp.122-126
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• 2013

The heterogeneous nucleation of the ${\Theta}^{\prime}$ phase on nanoscale precipitates has been investigated using a combination of three-dimensional atom probe tomography and high-resolution transmission electron microscopy. Two types of ${\Theta}^{\prime}$ phases were observed, namely small (~2 nm thick) cylindrical precipitates and larger (~100 nm) globular precipitates and both appear to be heterogeneously nucleated on the nanoscale precipitates. The composition and crystal structure of precipitates were directly analyzed by combination of two advanced characterization techniques.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.65-68
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• 1999

A well oriented Bi2212 superconductor thick films were fabricated by screen printing with a Cu-free Bi-Sr-Ca-O mixture powder on a copper plate and heat-treating at 820-88$0^{\circ}C$ for several minute in air. During the heat-treatment, the printing layer partially melted by reaction between the Cu-free precursor and CuO of the oxidizing copper plate. In the partial melting state, it is believed that the solid phase is Bi-free phase and Cu-rich phase and the composition of the liquid is around Bi : Sr : Ca : Cu = 2 : 2 : 0 : 1. Following the partial melting, the Bi2212 superconducting phase is formed at Bi-free phase/liquid interface by nucleation and grows. With decreasing the Bi composition in the precursor powder, the critical temperature(T$_{c}$) of the fabricated Bi2212 thick film increased to about 79 K.K.

• Journal of Korea Foundry Society
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• v.5 no.3
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• pp.19-26
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• 1985

This study has been carried out to examine into wettability of Cu-5%Sn alloy in $Al_2O_3$, MgO, $SiO_2$ and graphite, respectively and investigated into the change in macrostructure of Cu-5%Sn alloy according to kind and mixing rate of mold-coating. The results obtained from the experiment are summerized as follows; 1. Cu Cu-5%Sn alloy, wettabilities of $Al_2O_3$ and MgO were good, on the other hand, wettabilities of $SiO_2$ and graphite were bad. 2. The fine equiaxed zone was created because of the role of $Al_2O_3$ and MgO as preferential nucleation sites. 3. Notwithstanding change of mixing rate of $SiO_2$ in mold coating the equixed zone was not created. 4. The area of equiaxed zone was varied according to mixing rate in the case of using $Al_2O_3$ and MgO in mold-coating.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.69-72
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• 1999

A Well oriented Bi$_2$re$_2$CaCu$_2$O$\sub$8/(Bi2212) superconductor thick films were formed successfully on a copper substrate by liquid reaction between a Cu-free precursor and Cu tape using method in which Cu-free BSCO powder mixture was printed on copper plate and heat-treated. And we examined the mechanism for the rapid formation of Bi2212 superconducting films from observing the surface microstructure with heat-treatment time. At heat-treatment temperature, the printing layer partially melt by reacting with CuO of the oxidizing copper plate, and the nonsuperconducting phases present in the melt are typically Bi-free phases and Cu-free phases. Following the partial melting, the Bi$_2$Sr$_2$CaCu$_2$O$\sub$8/ superconducting phase is formed at Bi-free phase/liquid interface by nucleation and grows. It was confirmed that the phase colony from the phase diagram of Bi$_2$O$_3$-(SrO+CaO)/2-CuO system is similar to the observed result.

• Journal of Powder Materials
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• v.4 no.4
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• pp.304-309
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• 1997

The synthesis of W-l5wt%Cu nanocomposite powder by hydrogen reduction of ball milled W-Cu oxide mixture was investigated in terms of powder characteristics such as particle size, mixing homogeneity and micropore structure. It is found that the micropores in the ball milled oxide (2-50 nm in size) act as an effective removal path of water vapor, followed by the formation of dry atmosphere at reaction zone. Such thermodynamic condition enhances the nucleation of W phase but suppresses the growth process, being in favor of the formation of W nanoparticles (about 21 nm in size). In addition, the superior mixing homogeneity of starting oxide mixture turned out to Play a significant role for forming extraordinary chemical homogeneity of W-l5wt%Cu nanocomposite powder.

• Journal of the Korean institute of surface engineering
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• v.24 no.4
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• pp.187-195
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• 1991

Adhesion strength of electroless-plated Ni, Ni-P and Cu deposites on alumina substrate has been studied. Grain boundary spaces produced on the substrate surface by etching treatment provided anchoring sites for enhancing the adhesion strength. Adhesion strengths of Ni-P and Ni deposit were higher than that of Cu deposit, because of higher initial nucleation rates than the latter. The electroless-plated Ni-P and Ni underlayer improved the adhesion strength of the Cu deposit. In could be attributed to the enhanced adhesion between the substrate and those underlayers as well as the satisfactory adhesion between Cu deposits and those underlayers. Heat treatment was also conducted in order to enhance the adhesion strength of Cu layer. The strength was enhanced by about 19% when the treatment was conducted at $150^{\circ}C$ for 2 hours. The enhancement was attributed to relief of internal stress and release of hydrogen.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.97-97
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• 2017

This study investigated the corrosion protection by electrodeposited copper layer on AZ31 Mg alloy with and without additional silver layer by immersion test, salt spray test, OCP transient and potentiodynamic polarization experiment. The single electrodeposited Cu layer on AZ31 Mg alloy showed a nodular structure with many imperfections of crevices between the nodules, which resulted in the fast initiation of pitting corrosion within first few hours of immersion. Double-layer coating of Cu and outer Ag layer slightly increased the initiation time for pitting corrosion. Triple-layer coatings of Cu/Ag/Cu exhibited the most efficient corrosion protection of AZ31 Mg alloy, compared to the single- and double-layer coatings. Surface morphology of the outer Cu layer in the triple-layer was changed from the nodular structure to fine particle structure with no crevices due to the presence of an additional Ag layer. Thus, the improved corrosion resistance of AZ31 Mg alloy by electrodeposited Cu/Ag or Cu/Ag/Cu layers is readily ascribed to the decreased number of imperfections in the electrodeposited layers due to the additional silver layer. It is concluded that the additional silver layer provides many nucleation sites for the second Cu plating, resulting in the formation of finer and denser structure than the first Cu electrodeposit.

• Proceedings of the Korean Vacuum Society Conference
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• 2009.02a
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• pp.176.2-176.2
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• 2009

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.67-74
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• 2011

Keys to high wiring density semiconductor packages include flip-chip bonding and build-up substrate technologies. The current issues are the establishment of a fine pitch flip-chip bonding technology and a low coefficient of thermal expansion (CTE) substrate technology. In particular, electromigration and thermomigration in fine pitch flipchip joints have been recognized as a major reliability issue. In this paper, electromigration and thermomigration in Cu/Sn-3Ag-0.5Cu (SAC305)/Cu flip-chip joints and electromigration in Cu/In/Cu flip chip joints are investigated. In the electromigration test, a large electromigration void nucleation at the cathode, large growth of intermetallic compounds (IMCs) at the anode, a unique solder bump deformation towards the cathode, and the significantly prolonged electromigration lifetime with the underfill were observed in both types of joints. In addition, the effects of crystallographic orientation of Sn on electromigration were observed in the Cu/SAC305/Cu joints. In the thermomigration test, Cu dissolution was accelerated on the hot side, and formation of IMCs was enhanced on the cold side at a thermal gradient of about $60^{\circ}C$/cm, which was lower than previously reported. The rate of Cu atom migration was found comparable to that of electromigration under current conditions.