• 제목/요약/키워드: Cu nanoplates

검색결과 3건 처리시간 0.018초

Controlled Synthesis of Colloidal Cu Nanowires and Nanoplates and Their Tunable Localized Surface Plasmon Resonances

  • Seokhwan Kim;Jong Wook Roh;Dong Choon Hyun;Seonhwa Park;Yuho Min
    • 한국전기전자재료학회논문지
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    • 제37권5호
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    • pp.547-553
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    • 2024
  • Precise control over the morphology of nanostructures is critical for tailoring their physical and chemical properties. This study addresses the challenge of developing a simple, integrated method for synthesizing both 1D and 2D colloidal Cu nanostructures in a single system, achieving successful tuning of their localized surface plasmon resonance (LSPR) properties. A facile hydrothermal synthesis utilizing potassium iodide (KI) and hexadecylamine (HDA) is presented for controlling Cu nanostructure morphologies. The key to achieving 1D nanowires (NWs) and 2D nanoplates (NPs) depends on the controlled adsorption of HDA molecules and iodide (I-) ions on specific crystal facets. Depending on the morphologies, the resultant Cu nanostructures exhibit tunable LSPR peaks from 558 nm [nanoplates (NPs)] to 590 nm [nanowires (NWs)]. These results pave the way for the scalable and cost-effective production of plasmonic Cu nanostructures with tunable optical properties, holding promise for applications in sensing, catalysis, and photonic devices.

NH4OH 수용액 하에서 Cu 호일의 산화를 통해 합성한 CuO 나노벽의 가스센싱 특성 (Gas sensing properties of CuO nanowalls synthesized via oxidation of Cu foil in aqueous NH4OH)

  • 슈엔하이엔뷔엔;팜티엔헝;풍딘호앗;이시홍;이상욱;이준형;김정주;허영우
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2018년도 춘계학술대회 논문집
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    • pp.141-141
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    • 2018
  • Copper is one of the most abundant metals on earth. Its oxide (CuO) is an intrinsically p-type metal-oxide semiconductor with a bandgap ($E_g$) of 1.2-2.0 eV 1. Copper oxide nanomaterials are considered as promising materials for a wide range of applications e.g., lithium ion batteries, dye-sensitized solar cells, photocatalytic hydrogen production, photodetectors, and biogas sensors 2-7. Recently, high-density and uniform CuO nanostructures have been grown on Cu foils in alkaline solutions 3. In 2011, T. Soejima et al. proposed a facile process for the oxidation synthesis of CuO nanobelt arrays using $NH_3-H_2O_2$ aqueous solution 8. In 2017, G. Kaur et al. synthesized CuO nanostructures by treating Cu foils in $NH_4OH$ at room temperature for different treatment times 9. The surface treatment of Cu in alkaline aqueous solutions is a potential method for the mass fabrication of CuO nanostructures with high uniformity and density. It is interesting to compare the gas sensing properties among CuO nanomaterials synthesized by this approach and by others. Nevertheless, none of above studies investigated the gas sensing properties of as-synthesized CuO nanomaterials. In this study, CuO nanowalls versus nanoparticles were synthesized via the oxidation process of Cu foil in NH4OH solution at $50-70^{\circ}C$. The gas sensing properties of the as-prepared CuO nanoplates were examined with $C_2H_5OH$, $CH_3COCH_3$, and $NH_3$ at $200-360^{\circ}C$.

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Interconnecting Nanomaterials for Flexible Substrate and Direct Writing Process

  • 좌용호
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2012년도 춘계학술발표대회
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    • pp.58.1-58.1
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    • 2012
  • Direct write technologies provide flexible and economic means to manufacture low-cost large-area electronics. In this regard inkjet printing has frequently been used for the fabrication of electronic devices. Full advantage of this method, which is capable of reliable direct patterning with line and space dimensions in the 10 to 100 um regime, is only made with all-solution based processing. Among these printable electronic materials, silver and copper nanoparticles have been used as interconnecting materials. Specially, solutions of organic-encapsulated silver and copper nanoparticles may be printed and subsequently annealed to form low-resistance conductor patterns. In this talk, we describe novel processes for forming silver nanoplates and copper ion complex which have unique properties, and discuss the optimization of the printing/annealing processes to demonstrate plastic-compatible low-resistance conductors. By optimizing both the interconnecting materials and the surface treatments of substrate, it is possible to produce particles that anneal at low-temperatures (< $200^{\circ}C$) to form continuous films having low resistivity and appropriate work function for formation of rectifying contacts.

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