• Nano
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• v.13 no.12
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• pp.1850140.1-1850140.9
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• 2018

An electrochemical sensor ($Cu^{2+}$-IIPs/GCE) was developed for detection of $Cu^{2+}$ in water. $Cu^{2+}$-IIPs/GCE was prepared by dispersing $Cu^{2+}$ imprinted polymers ($Cu^{2+}$-IIPs) on a preprocessed glassy carbon electrode. $Cu^{2+}$-IIPs were synthesized on the surface of modified carbon spheres by ion imprinting technology. The electrochemical performance of $Cu^{2+}$-IIPs/GCE was evaluated by differential pulse voltammetry method. The response of $Cu^{2+}$-IIPs/GCE to $Cu^{2+}$ was linear in $1.0{\times}10^{-5}mol/L$ to $1.0{\times}10^{-3}mol/L$. The detection limit was $5.99{\times}10^{-6}mol/L$ (S=N = 3). The current response value of $Cu^{2+}$-IIPs/GCE was 2.14 times that of the nonimprinted electrode. These results suggest that $Cu^{2+}$-IIPs/GCE can detect the concentration of $Cu^{2+}$ in water, providing a new way for heavy metal ions adsorption and testing.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.20 no.1
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• pp.30-34
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• 2010

$CoSb_3$-based skutterudite compounds are promising candidates as thermoelectric (TE) materials used in intermediate temperature region. In this study, sintering of $CoSb_3$ powder and joining of $CoSb_3$ to copper-molybdenum electrode have been simultaneously performed by spark plasma sintering technique. The Ti foil was used for preventing the diffusion of copper into $CoSb_3$ and the Cu : Mo = 3 : 7 Vol. ratio composition was selected by the consideration of thermal expansion coefficients. The insertion of Ti interlayer between Cu-Mo and $CoSb_3$ was effective to join $CoSb_3$ to Cu-Mo by forming an intermediate layer of $TiSb_2$ at the Ti-$CoSb_3$ boundary. However, the formation of TiSb and TiCoSb intermediate layers deteriorated the joining properties by the generation of cracks in the interface of intermediate layer/$CoSb_3$ and intermediate/intermediate layers.

• Journal of Advanced Marine Engineering and Technology
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• v.20 no.2
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• pp.92-92
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• 1996

Recently, with the rapid development in the oceanic systems such as the oceanic structures and vessel, there occurs much interest in the impingement erosion-corrosion. In this paper, Cu-metal was tested by using of erosion apparatus with water-jet type and was investigated under the behaviour of impingement erosion-corrosion according to various environmental conditions, and the properties of Cu-metal were evaluated through the measurement by weight loss, weight loss rate, protective efficiency. The results were compared with those obtained using Cu-metal applied to cathodic protection and Cu-alloys added to Zn or Al-metal. As a basis of those results, the best protective efficiencies could be taken as using cathodic protection method and Cu-alloy with Al & Zn material addings, and will be suggested as the fundamental data of the anti-impingement erosion-corrosion on Cu-metal of impeller material for oceanic centrifugal pump.

• Journal of Advanced Marine Engineering and Technology
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• v.20 no.2
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• pp.24-31
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• 1996

Recently, with the rapid development in the oceanic systems such as the oceanic structures and vessel, there occurs much interest in the impingement erosion-corrosion. In this paper, Cu-metal was tested by using of erosion apparatus with water-jet type and was investigated under the behaviour of impingement erosion-corrosion according to various environmental conditions, and the properties of Cu-metal were evaluated through the measurement by weight loss, weight loss rate, protective efficiency. The results were compared with those obtained using Cu-metal applied to cathodic protection and Cu-alloys added to Zn or Al-metal. As a basis of those results, the best protective efficiencies could be taken as using cathodic protection method and Cu-alloy with Al & Zn material addings, and will be suggested as the fundamental data of the anti-impingement erosion-corrosion on Cu-metal of impeller material for oceanic centrifugal pump.

• Korean Journal of Materials Research
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• v.12 no.9
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• pp.740-746
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• 2002

In this study, the polycarbonate surface was treated by $O_2$/ Ar gases plasma for the enhancement of adhesion with Cu electrode. From the point of view of hydrophilicity and the functionality, the micro-roughness, new functional groups and oxygen content of the polycarbonate surface were increased by the $O_2$/ Ar gases plasma treatment. The Cu films deposited on the as-received polycarbonate were easily detached while, after the$ O_2$/ Ar gases plasma treatment the adhesive Cu films on polycarbonate could be obtained. These results can be explained that the polycarbonate had a hydrophilic surface with uniform micro-roughness and new functional groups by $O_2$/ Ar gases plasma treatment. Therefore,$O_2$/ Ar gases plasma treatment is a promising method for improvement of adhesion between polycarbonate and Cu electrode.

• Journal of the Korean Applied Science and Technology
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• v.16 no.4
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• pp.307-311
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• 1999

Interfacial properties of electrode and organic thin layer is one of the most important factor in performing a Light Emitting Diodes(LED). Phthalocyanine copper was used as a buffer layer to improve interface characteristic, so that device efficiency was improved. In this study, LEDs were fabricated as like structures of Indium-Tin-Oxide (ITO) / N,N' -Diphenyl-N,N'-di(m-tolyl)-benzidine (TPD) / 8-Hydroxyquinoline aluminum(Alq) / Aluminum(Al) and Indium-Tin-Oxide(ITO) / N,N'-Diphenyl-N,N' -di(m-tolyl)-benzidine(TPD) / 2-(4-Biphenylyl)-5(4-tert-butyl-phenyl)-1,3,4-oxadiazole(PBD) / Aluminum(Al). In these devices, CuPC was layered at electrode/organic layer interface. As position is changing and thickness is changing, devices showed characteristic luminescence efficiency and luminescence inensity respectively. We showed in this study that luminescence efficiency was improved with CuPC layer in LEDs. The efficiency of device with layer CuPC is higher than that of 2 layer CuPC. However, the luminescence of 2 layer CuPC device got higher value.

• Transactions of the Korean hydrogen and new energy society
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• v.34 no.6
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• pp.785-791
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• 2023

Copper sulfide (Cu_xS) has been extensively utilized as a counter electrode (CE) material for quantum dot solar cells (QDSCs) due to its exceptional catalytic activity for polysulfide electrolytes. The typical fabrication method of Cu₂S CEs based on brass substrate is dangerous, involving the use of a highly concentrated hydrochloric acid solution in a relatively high temperature. In contrast, electroplating presents a safer alternative by employing a less acidic solution at a room temperature. In addition, the electroplating method increases the probability of obtaining CEs of consistent quality compared to the brass method. In this study, the optimized electroplating cycle for CuS CEs in QDSCs has been studied for the highly efficient photovoltaic performances. The QDSCs, featuring electroplated CuS CEs, achieved an impressive efficiency of 7.18%, surpassing the conventional method employing brass CEs, which yielded an efficiency of 6.62%.

• Korean Journal of Materials Research
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• v.26 no.12
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• pp.714-720
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• 2016

We performed this study to understand the effect of a single-crystalline anode on the mechanical properties of as-deposited films during electrochemical deposition. We used a (111) single- crystalline Cu plate as an anode, and Si substrates with Cr/Au conductive seed layers were prepared for the cathode. Electrodeposition was performed with a standard 3-electrode system in copper sulfate electrolyte. Interestingly, the grain boundaries of the as-deposited Cu thin films using single-crystalline Cu anode were not distinct; this is in contrast to the easily recognizable grain boundaries of the Cu thin films that were formed using a poly-crystalline Cu anode. Tensile testing was performed to obtain the mechanical properties of the Cu thin films. Ultimate tensile strength and elongation to failure of the Cu thin films fabricated using the (111) single-crystalline Cu anode were found to have increased by approximately 52 % and 37 %, respectively, compared with those values of the Cu thin films fabricated using apoly-crystalline Cu anode. We applied ultrasonic irradiation during electrodeposition to disturb the uniform stream; we then observed no single-crystalline anode effect. Consequently, it is presumed that the single-crystalline Cu anode can induce a directional/uniform stream of ions in the electrolyte that can create films with smeared grain boundaries, which boundaries strongly affect the mechanical properties of the electrodeposited Cu films.

• Applied Chemistry for Engineering
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• v.7 no.3
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• pp.473-480
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• 1996

Synthesis of n-perfluorooctanesulfonyl fluoride(n-PFOSF), which is valuable precursor perfluoro-chemicals, was studied by electrochemical fluorination(ECF). Of prime concern was to investigate the cyclic voltamograms of Ni electrode in anhydrous hydrogen fluoride(AHF) with and without the reactants and to measure fluorine evolution potential. In a batch cell, chronoampherometric electrolysis and various chemical analysis such as GC, GC/MS and IR were used to understand the amphere change of electrode and the reaction paths. Fluorine equilibrium potential was found to be about 2.8V(vs. $Cu/CuF_2$) from the cyclic voltammograms and decay curves of anode potential in AHF. In batch processes, the ECF proceeded in two distinguished steps. The first step proceeded electrochemically and the second one chemically. Under 7V(vs. $Cu/CuF_2$), amount of crude products was proportional to the applied anode potential. Above 7V(vs. $Cu/CuF_2$), it had a hundred percentage with weight ratio of reactants and productivity of PFOSF was almost constant.

• Journal of the Korean Chemical Society
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• v.23 no.6
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• pp.385-391
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• 1979

It was found that cupric ion selective electrode, which was prepared by mixing CuS and $Ag_2S$ with the ratio four to one and PVC, was hard and durable. The response potentials were reproducible and linear in the range from 1.0 ${\times}$ $10^{-1}M$ to 1.0 ${\times}$ $10^{-5}M$ copper (II) solution and its slope was 25.0 mV per decade concentration at $298^{\circ}K$, slightly different from Nernstian slope. The copper (II) indicating electrode was applied in precipitation titration of 1.0 ${\times}$ $10^{-2} M Cu(II)$ sample solution containing proper amounts $NaNO_3$ with 0.1 M NaOH standard solution. Also, this electrode could be used in complex titration of Zn(II), Mg(II), Ca(II) with EDTA and stability constant of EDTA complex of Ca(II) and Mg(II) was calculated by using known Cu-$EDTA^{2-}$ stability constant.