• Title/Summary/Keyword: Cu contact

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Improvement of semiconductor contact hole filling of Copper by ionized cluster beam deposition technique (이온화클러스터빔 증착법에 의한 구리 박막의 반도체 접촉구 메움 향상에 관한 연구)

  • Baek, Min;Son, Ki-Wang;Kim, Do-Jin
    • Journal of the Korean Vacuum Society
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    • v.7 no.2
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    • pp.118-126
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    • 1998
  • A study to improve filling of semiconductor contact holes by enhancement of the directionality of the source beams has been undertaken. The collimation of source beams was improved by the ionized cluster beam deposition technique with modification of the cell geometry. The collimation tested with neutral beam was excellent. But, the Cu flims were grown in a columnar mode due to the lack of surface mobilit of the impinged clusters. A shadow effect also caused cleavage and consequent discontinuity at the steos as films grow. By applying acceleration voltage, the columnar growth in a contact hole of 0.5 $\mu$m diameter and 1 $\mu$m height disappeared and considerable coverage at the side wall of the contacts as well as perfect bottom coverage were observed. These are all due to the assistants of the accelerated ionized clusters with high kinetic energy. Thus we demonstrated that the ICB deposition technique can be used to completely fill sub-half-micron contact holes with high aspect ratio.

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Metal-Semiconductor Contact Behavior of Solution-Processed ZnSnO Thin Film Transistors (용액법으로 제작된 ZnSnO 박막트랜지스터의 전극 물질에 따른 계면 접촉특성 연구)

  • Jeong, Young-Min;Song, Keun-Kyu;Woo, Kyoo-Hee;Jun, Tae-Hwan;Jung, Yang-Ho;Moon, Joo-Ho
    • Korean Journal of Materials Research
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    • v.20 no.8
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    • pp.401-407
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    • 2010
  • We studied the influence of different types of metal electrodes on the performance of solution-processed zinc tin oxide (ZTO) thin-film transistors. The ZTO thin-film was obtained by spin-coating the sol-gel solution made from zinc acetate and tin acetate dissolved in 2-methoxyethanol. Various metals, Al, Au, Ag and Cu, were used to make contacts with the solution-deposited ZTO layers by selective deposition through a metal shadow mask. Contact resistance between the metal electrode and the semiconductor was obtained by a transmission line method (TLM). The device based on an Al electrode exhibited superior performance as compared to those based on other metals. Kelvin probe force microscopy (KPFM) allowed us to measure the work function of the oxide semiconductor to understand the variation of the device performance as a function of the types metal electrode. The solution-processed ZTO contained nanopores that resulted from the burnout of the organic species during the annealing. This different surface structure associated with the solution-processed ZTO gave a rise to a different work function value as compared to the vacuum-deposited counterpart. More oxygen could be adsorbed on the nanoporous solution-processed ZTO with large accessible surface areas, which increased its work function. This observation explained why the solution-processed ZTO makes an ohmic contact with the Al electrode.

Effects of Sm:Ba:Cu Composition Ratio on the Superconducting Properties of SmBCO Coated Conductor Prepared by using a Composition Gradient Method (SmBCO 초전도 선재 특성에 대한 Sm:Ba:Cu 조성비의 영향)

  • Kim, H.S.;Oh, S.S.;Jang, S.H.;Min, C.H.;Ha, H.S.;Ha, D.W.;Ko, R.K.;Youm, D.J.;Moon, S.H.;Chung, K.C.
    • Progress in Superconductivity
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    • v.13 no.1
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    • pp.7-11
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    • 2011
  • The effects of Sm:Ba:Cu composition ratio in SmBCO coated conductor on their superconducting properties were investigated. The SmBCO coated conductors were fabricated by reactive co-evaporation method using EDDC(Evaporation using Drum in Dual Chamber) system. In this system, we could obtain various samples with different composition ratios in a batch by the technique providing composition gradient at deposition zone. From the specimens prepared by EDDC system, we found that composition ratio is uniform parallel to the drum axis, but gradient along the circumferential direction of the drum. We installed a shield having parallelogram open area between the deposition chamber and the evaporation chamber in EDDC system, and attached a 30 cm long template, which is parallel to drum axis, onto the drum surface. In this configuration, we could obtain SmBCO coated conductors having a gradient composition along the length of template. We measured the composition ratios and surface morphologies with periodic interval by SEM and EDAX, and confirmed the profile of composition ratio. We also measured critical current using non-contact Hall probe critical current measurement system and thereby could plot composition ratio vs. critical current. The maximum critical current was obtained, and the surface morphology with the shape of roof tile was observed at the corresponding composition ratio of Sm:Ba:Cu = 1.01:1.99:4.87. It was also found that composition ratio had an effect on not only critical current but also surface morphology.

Human Risk Assessment of Soil Contaminated with Heavy Metal by Waste Reclaimed in Railway Maintenance Site (철도정비부지 내 매립된 폐기물에 의해 중금속으로 오염된 토양의 인체위해성 평가)

  • Braatz, Hatsue Minato;Jung, Minjung;Moon, Seheum;Park, Jinkyu
    • Journal of the Korea Organic Resources Recycling Association
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    • v.27 no.3
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    • pp.63-74
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    • 2019
  • This study carried out a human risk assessment of Cu, Pb, Zn and Ni contained in soil contaminated by improperly buried heavy metal wastes in railway sites. The purpose of the human risk assessment is to derive the need for soil remediation and factors that should be considered during soil remediation. Risk assessment was performed in accordance with the Environment Ministry's Risk Assessment Guidelines. The results of the human risk assessment of contaminated heavy metal soil contaminated by improperly buried waste in the railway site were presented after the process of determining exposure concentration, calculating exposure, and determining carcinogenic hazards. The heavy metal content of soil is 621.3 Cu mg/kg, 2,824.5 Pb mg/kg, 1,559.1 Zn mg/kg and 45 Ni mg/kg, which is the exposure concentration of the target contaminant. The results of human exposure according to exposure pathways were high in the order of soil outdoor dust >soil ingestion >soil contact, and Pb >Zn >Cu >Ni were higher in order of contaminant. The carcinogenic and noncarcinogenic risks of soil contaminated with heavy metal waste were higher than the allowable carcinogenic risks (TCR> $10^{-6}$) and the risk index (Hi < 1.0) suggested by USEPA. Therefore, the site needs to be remediated.

Structure and Conductivity Characteristics of Sandwich Structures with Fullerite Films

  • Berdinsky, A.S.;Shevtsov, Yu. V.;Chun, Hui-Gon;Yoo, Yong-Zoo;Fink, D.;Ayupov, B.M.
    • Journal of Sensor Science and Technology
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    • v.13 no.5
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    • pp.399-404
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    • 2004
  • We report on the technology of formation of sandwich structures based on fullerite films and on experimental results in research of optical and conductivity properties of these sandwich samples. Single crystals of sapphire (100) or silicon were used as substrates. The sandwich specimens were based on the structure M/$C_{60}$/M (M=Cr, Pd, Ag, Al, Cu). The thickness of the fullerite films was about $0.2{\sim}1.0{\mu}m$. The area of the $C_{60}$ film under the top contact was about $1cm^{2}$. The specimens have been investigated by infrared spectroscopy, spectra-photometry, ellipsometry and X-ray diffraction analysis. Measurements of the current/voltage characteristics and research on the temperature dependence of conductivity were performed as well. It was shown that metals such as Cr, Pd, Ag, Al, and Cu penetrate easily into the fullerite films. It appears that these specimens have a large conductivity. For silver/$C_{60}$ and other sandwich structures the conductivities show a semiconductor-like behaviour.

Prediction of Thermal Fatigue Life on $\mu$BGA Solder Joint Using Sn-3.5Ag, Sn-3.5Ag-0.7Cu, and Sn-3.5Ag-3.0In-0.5Bi Solder Alloys (Sn-3.5Ag, Sn-3.5Ag-0.7Cu, Sn-3.5Ag-3.0In-0.5Bi Solder를 이용한 $\mu$BGA Solder접합부의 열피로 수명예측)

  • 김연성;김형일;김종민;신영의
    • Journal of Welding and Joining
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    • v.21 no.3
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    • pp.92-98
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    • 2003
  • This paper describes the numerical prediction of the thermal fatigue life of a $\mu$BGA(Micro Ball Grid Array) solder joint. Finite element analysis(FEA) was employed to simulate thermal cycling loading for solder joint reliability. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. The results show that Sn-3.5mass%Ag solder had the longest thermal fatigue life in low cycle fatigue. Also a practical correlation for the prediction of the thermal fatigue life was suggested by using the dimensionless variable ${\gamma}$, which was possible to use several lead free solder alloys for prediction of thermal fatigue life. Furthermore, when the contact angle of the ball and chip has 50 degrees, solder joint has longest fatigue life.

Human exposure of hazardous elements from different urban soils in Bangladesh

  • Islam, Md.S.;Ahmed, Md.K.;Al-Mamun, Md.H.
    • Advances in environmental research
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    • v.5 no.2
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    • pp.79-94
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    • 2016
  • In order to evaluate the contamination and health risk, levels of six hazardous elements i.e., Cr, Ni, Cu, As, Cd and Pb in soils of 12 different land-uses were measured. The average concentration of Cu, Cr, Ni, Pb, As and Cd in soils were 267, 239, 206, 195, 58 and 16 mg/kg, respectively. Levels of each metal exceeded the environmental action level for soils, which could pose significant risk to human. The metal concentrations were subsequently used to establish hazard indices (for adults and children) where the 5th and 95th percentile values were used to derive the hazard index through different exposure pathways (ingestion, dermal contact and inhalation). Considering the total exposure through each of the three pathways, the hazard index elucidates that there was a potency of non-cancer risk at most of the sites for both the adults and children. The findings of this study suggested that different land-use soils were severely contaminated with hazardous elements and attention is needed on the potential health risks to the exposed inhabitants.

Experimental Study of Evaporation of Nanofluid Droplet (나노유체 액적의 증발에 관한 실험적 연구)

  • Kim, Yeung Chan
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.37 no.7
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    • pp.647-653
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    • 2013
  • The evaporation characteristics of nanofluid droplets on a heated solid surface were experimentally investigated. The experiments were conducted using pure water and a nanofluid of water mixed with CuO nanoparticles, and the solid surface was made of a copper block heated by a nine cartridge heater. The experimental results showed that the evaporation rate of the nanofluid droplet was higher than that of the pure water droplet on the heated solid surface because nanoparticles increased the thermal conductivity of the nanofluid. Furthermore, it was found that the evaporation rate of the nanofluid droplet increased with the solid surface roughness. This may be because the actual area of the liquid-solid interface increased with the solid surface roughness.

Fabrication of Composite Filler Metal by Melt Infiltration (용탕 침투법을 이용한 복합 삽입 금속의 제조)

  • Park, Heung-Il;Kim, Ji-Tae;Kim, Woo-Yeol
    • Journal of Korea Foundry Society
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    • v.23 no.5
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    • pp.244-250
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    • 2003
  • The aim of this study is fabricating of composite filler metal (CFM) by a combination of selective laser sintering (SLS) of stainless steel powders (RapidSteel $2.0^{TM}$ and liquid phase infiltration of Ag-28 wt.%Cu alloy. Porous stainless steel body with inter-connected pore channels was fabricated by SLS, binder decomposing and densification processes. By the direct contact infiltration, the narrow inter-particle channels of the porous body were completely filled with the Ag-28 wt.%Cu alloy infiltrant. During infiltration, the dissolved elements of Fe, Ni and Cr from the porous body were solved into copper solid solution phases, which consist of eutectic structure of composite metal matrix. The S10C/CFM/S10C joints, which have narrow clearance gaps between them up to 10 micrometers, were joined successfully by self-feeding of filler metal from the matrix of CFM. The CFM kept its original thickness and microstructure after brazing. The tensile strength of brazed specimen was higher than 30 kgf/$mm^2$ and showed a typical ductile fracture mode in the CFM.

Arc erosion characteristics of A.T.S. contacts for low power (저용량 A.T.S. 접점의 아크 마모 특성 연구)

  • Han, Se-Won;Cho, Han-Goo;Moon, Hee-Bong
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.05b
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    • pp.164-169
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    • 2005
  • A.T.S.의 스위칭 구조와 접점 환경은 주로 아크 전류, 접촉 저항, 아크 시간 등의 불리적 요인이 주로 마모와 특성에 영향을 미치게 된다. 사용되는 접점 재료는 W 또는 WC-Cu 계로 형상과 크기는 전형적인 반구형 구조의 접촉으로 구동이 이루어진다. 따라서 A.T.S.용 접점의 아크 마모 특성 시험을 위한 고려 요인은 이러한 점을 고려하여 시험과 분석이 이루어 졌다. 접점의 마모 특성 실험식으로부터 실제적인 관점에서 보면 제한된 수명을 나타내는 $n_L$을 보장하기 때문에 b<1의 경우가 가장 바람직한 결과로 ATS 접점 시편의 경우 $b{\fallingdotseq}0.99$로 안정된 접점 아크 마모 특성을 갖는 것으로 판단된다. 아크 전압에 대한 모델링과 실험에서 접점 간극 거리 1<0.1mm, 아크전류 i<100A의 시험 조건에 대해 검토한 결과 ATS 접점 시편의 아크전압은 $u_a=10.2V$로 계산되었다. 이 값은 설험적인 값과 상당히 접근하는 특성을 갖는 것으로 나타났으며, 아크에 의한 마모를 억제하기 위해 첨가하는 WC 또는 W의 복합 소결로 인해 아크 에너지가 감소되는 것을 보여준다. 한편 접점의 아크 동작이 분리되는 순간의 동작 시험에서 기존 W(50%wt)-Cu(50%wt) 접점의 값과 비교하면 분리시 아크 전압은 상대적으로 낮아지는 현상은 W강화 첨가량의 증가로 인한 아크 에너지 감소의 제한성을 나타내는 것으로 사료된다.

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