• Journal of the Semiconductor & Display Technology
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• v.6 no.3
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• pp.1-6
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• 2007

The integrated thermal-chemical-mechanical (TCM) material removal model presented in the companion paper is dynamically simulated in this work. The model is applied to a Cu CMP process for the simulation and the results of the three individual ingredients composing the model are presented separately first. These results are then incorporated to calculate the total material removal rate (MRR) of the Cu CMP. It is shown that the non-linear trend of MRR with respect to the applied mechanical power (i.e., non-Prestonian behavior), which is not well explained with the models established in principle on conventional contact mechanics, may be due to the chemical reaction(s) varying non-linearly with the temperature in the wafer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.806-809
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• 2000

A key technology for achieving commercial Nb$_3$Sn superconducting wires may be driven from fabrication Process of big-scale billets. Sub-element billet with diameter of 200 mm was designed and fabricated. This billet was hot-extruded and drawn. Cu stabilizer tube, Nb barrier tube and 19 sub-elements inserted Sn core were composed for strand. There was no breakage in the strand that was constituted with annealed sub-element. It was need that billet had to treat HIP because of remove of voids and goad contact between Cu and Nb filaments. Ta wound sheet was better than Ta tube thor barrier in the strand. Ic of the Nb$_3$Sn wire at 127, 4.2K was over than 120 A.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.9-12
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• 2000

Insulators for high-voltage and large-power should be endured mechanically the weight of mold bushing itself and the force of pushed from contact with circuit breaker and conductor. But dielectric breakdown could be occurred result from the external circumstances and internal factors such as chemical reaction, partial discharge, change of temperature and the relation of temperature-time in process of casting. Therefore, to get rid of external and internal factors of dielectric breakdown. Furthermore, to prevent the internal cracks, void, cavity which resulted from the contraction originated on the interface between copper and epoxy resin, formed semi-conductive layer with partially carbon painted on copper bar. The PD properties and the insulation qualities of epoxy molded insulators were improved by roles of cushions for the direction of diameter and natural sliding effects as like separated from conductor for the direction of length.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.219-219
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• 2012

The formation and thermal desorption behaviors of octanethiol (OT) SAMs on single crystalline Au (111) and polycrystalline Au, Ag, and Cu substrates were examined by X-ray photoelectron microscopy (XPS), thermal desorption spectroscopy (TDS), and contact angle (CA) measurements. XPS and CA measurements revealed that the adsorption of octanethiol (OT) molecules on these metals led to the formation of chemisorbed self-assembled monolayers (SAMs). Three main desorption fragments for dioctyl disulfide (C8SSC8+, dimer), octanethiolate (C8S+), and octanethiol (C8SH+) were monitored using TDS to understand the effects of surface morphology and the nature of metal substrates on the thermal desorption behavior of alkanethiols. TDS measurements showed that a sharp dimer peak with a very strong intensity on single crystalline Au (111) surface was dominantly observed at 370 K, whereas a broad peak on the polycrystalline Au surface was observed at 405 K. On the other hand, desorption behaviors of octanethiolates and octanethiols were quite similar. We concluded that substrate morphology strongly affects the dimerization process of alkanethiolates on Au surfaces. We also found that desorption intensity of the dimer is in the order of Au＞＞Ag＞Cu, suggesting that the dimerization process occurs efficiently when the sulfur-metal bond has a more covalent character (Au) rather than an ionic character (Ag and Cu).

• Journal of the Microelectronics and Packaging Society
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• v.7 no.2
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• pp.47-53
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• 2000

The fluxless wetting properties of TSM-coated glass substrate were evaluated by the wetting balance method. We could estimate the wettability of the TSM with new parameters obtained from the wetting balance test for one side-coated specimen. It was more effective in wetting to use Cu as a wetting layer and Au as a protection layer than to use Au itself as a wetting layer. The SnSb solder showed better wettability than SnAg, SnBi, and SnIn solders. The contact angle of the one side-coated glass substrate to the Pb-free solders could be calculated from the farce balance equation by measuring the static force and the tilt angle.

• Journal of Environmental Science International
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• v.8 no.4
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• pp.491-496
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• 1999

Removal of Cu(II), Cr(III) and Pb(II) ions from aqueous solutions using the adsorption process on the loesses has been investigated. Variations of contact time, pH, adsorption isotherms and selectivity of coexisting ions were experimental parameters. pH of KJ and YIK samples diluted to 1% solution, was rearly the same with each value of pH 5.58 and 5.49, and both samples showed weak acidic properties. From chemical analysis, both samples contain remarkably different amounts of ${SiO}_{2}$, ${Al}_{2}O_{3}$ and ${Fe}_{2}O_{3}$. From XRD measurement, quartz was mainly observed in both samples. Kaolinite was also observed, also in both samples, but Feldspar was only observed in KJ sample. Adsorption of metal ions on the loesses were reached at equilibrium by shaking for about 30min. The adsorption of Cr(III) ion was higher than that of Cu(II) oand Pb(II) ions. The order of amount adsorbed among the investigated ions was Cr(III)>Pb(II)>Cu(II). In acidic solution, the adsorptivity of loesses was increased as pH increased. The adsorption of Cr(III) ion on the loesses were fitted to the Freundlich isotherms. Freundlich constants(1/n) of KJ and YIK loesses were 0.54 and 0.55, respectively.

• Advances in environmental research
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• v.4 no.2
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• pp.119-133
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• 2015

Water pollution means that the physical, chemical and biological properties of water are changing. In this study, adsorption was chosen as the treatment method because it is an eco-friendly and low cost approach. Magnetite is a magnetic material that can synthesize chemical precipitation. Magnetite was used for the removal of copper in artificial water samples. For this purpose, metal removal from water dependent on the pH, initial concentration of metal, amount of adsorbent and effect of sorption time were investigated. Magnetite was characterized using XRD, SEM and particle size distribution. The copper ions were determined by atomic absorption spectrometry. The adsorption of copper on the magnetite was studied in a batch process, with different aqueous solutions of Cu (II) at concentrations ranging from 10 to $50mg\;l^{-1}$. Optimum conditions for using magnetite were found to be concentration of $10mg\;L^{-1}$, pH: 4.5, contact time: 40 min. Optimum adsorbent was found to be 0.3 gr. Furthermore, adsorption isotherm data were analyzed using the Langmuir and Freundlich equations. The adsorption data fitted well with the Freundlich ($r^2=0.9701$) and Langmuir isotherm ($r^2=0.9711$) equations. Kinetic and equilibrium aspects of the adsorption process were studied. The time-dependent Cu (II) adsorption data were described well by a pseudo-second-order kinetic model.

• Journal of Electrochemical Science and Technology
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• v.11 no.2
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• pp.180-186
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• 2020

In this work, a metal-ligand solution (Cu-EDTA) was prepared based on the molecular precursor method and the solution was spin-coated onto 3D printed flexible photosensitive resin sheets. After being processed by microwave, a laser with a wavelength of 355 nm was utilized to scan the spin-coated sheets and then the sheets were immersed in an electroless copper plating solution to deposit copper wires. With the help of microwave processing, the adhesion between copper wires and substrate was improved which should result from the increase of roughness, decrease of contact angle and the consistent orientation of coated film according to the results of 3D profilometer and SEM. XPS results showed that copper seeds formed after laser scanning. Using the 3D printed flexible sheets as cathode and galvanized iron as anode, electrochemical machining was conducted.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.319-319
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• 2010

칼코젠계 태양전지의 광흡수층으로 사용되는 CuInSe2은 직접천이형 반도체로 광흡수계수가 $1{\times}105cm-1$로 매우 높고, 전기광학적 안정성이 우수하여 실리콘 결정질 태양전지를 대체할 고효율 태양전지로 각광받고 있다. 광흡수층의 밴드갭 에너지가 증가하면 태양전지의 개방전압(Voc)이 증가하여 광변환 효율을 향상시킬 수 있으므로, CuInSe2에서 In의 일부를 Ga으로 치환하여 에너지 밴드갭의 변화를 주는 연구가 많이 진행되고 있다. 그러나 화합물내의 Ga 조성비가 증가하면 단락전류(Jsc), 충진률(fill factor)이 낮아져 태양전지 효율을 저하시키게 되므로 CIGS 박막의 적절한 화합물 조성비를 갖도록 최적조건을 확립하는 것이 매우 중요하다. 본 실험에서는 광흡수층 형성을 위해 Sputtering법으로 금속 전구체를 증착하고, 고온에서 셀렌화 열처리를 수행하는 Sequential process(2단계 증착법)를 이용하였다. soda-lime glass 기판에 Back contact으로 Mo를 증착하고, 1단계로 CuIn0.7Ga0.3 조성비의 타겟을 이용하여 Sputtering법으로 $0.5{\sim}2{\mu}m$ 두께의 CIG 전구체를 증착하였다. 2단계로 CIG 전구체의 셀렌화열처리를 통하여 CIGS 화합물 구조의 박막을 형성시켰다. 이때 형성된 CIGS 화합물 박막의 두께는 동일하게 함으로써, 열처리온도에 의한 박막의 구조변화를 비교하였다. 증착된 CIGS 박막은 고온 엑스선회절분석을 통해 증착 두께와 온도 변화에 따른 CIGS 층의 구조 변화를 확인하고, 동일한 증착조건으로 Buffer layer, Window layer, Grid 전극을 형성하여 태양전지셀 특성을 평가함으로써 CIGS 태양전지 광흡수층의 결정구조에 따른 광변환 효율을 비교하였다.

• Journal of Welding and Joining
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• v.17 no.5
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• pp.107-115
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• 1999

The objective of this research was to study the formation of the thick hardened layer with the addition of metal powder(Cu) and ceramics powders(TiC) on the aluminum 5083 alloys by plasma transferred arc process(PTA process) and to characterize the effect of overlaying conditions on the overlaid layer formation. This was followed by investigating the microstructures of the overlaid layers and mechanical properties such as hardness and wear resistance. The overlaid layer containing copper powder was alloyed and intermetallic compound($CuAl_2$) was formed. The overlaid layers with high melting point TiC powders, however, did not react with base metal. Wear resistance of the alloyed layer was remarkably improved by the formation of $CuAl_2$, precipitate phase, which prevented wear of base aluminum alloys and at higher wear speed, accelerated sliding of the counter part. Wear resistance of the composite layer was also remarkably improved because TiC powder act as a load barring element and Fe debris fragments detached from the counter part act as a solid lubricant on the contact surface.