• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1591-1593
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• 1996

The experimental study was carried out to investigate the effects of metallic particulate filler on the mechanical properties and the thermal properties of epoxy resin system filled with Cu powder. As Cu contents increased, the tensile strength, surface hardness and $T_d$ decreased. $T_g$ increased and decreased at 300 phr. $E_d$ decreased and increased at 200 phr, because the thermal conducting path of filler was formed and dissipated thermal stress.

• Journal of Powder Materials
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• v.10 no.3
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• pp.181-185
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• 2003

Resistance sintering under ultra-high pressure if developed to fabricate W-Cu composite containing 5 to 80v/o copper. The consolidation was carried out under pressure of 6 to 8 GPa and input power of 18 to 23 kW for 50 seconds. The densification effect and microstructure of these W-Cu composites are investigated. The effect of W particle size on ,sintering density was also studied. The micro hardness was measured to evaluate the sintering effect.

• Journal of Powder Materials
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• v.16 no.4
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• pp.268-274
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• 2009

For the purpose of obtaining basic information on the development of lead-free materials, a high density composites (a) W-Cu, (b) W-Sn (c)W-Cu-Sn and (d) W-Cu-Ni were fabricated by the P/M method. The particle size of used metal powders were under 325 mesh, inner size of compaction mould was $\phi8$ mm, and compaction pressure was 400 MPa. A High density composite samples were sintered at a temperature between $140^{\circ}C$ and $1050^{\circ}C$ for 1 hour under Ar atmosphere. The microstructure, phase transformation and physical properties of the sintered samples were investigated. As the results, the highest relative density of 95.86% (10.87 g/$cm^3$) was obtained particularly in the sintered W-Cu-Sn ternary system sample sintered at 450 for 1hr. And, Rockwell hardness (HRB) of 70.0 was obtained in this system.

• Journal of Powder Materials
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• v.6 no.4
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• pp.301-306
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• 1999

Mechanical properties of oxide based materials could be improved by nanocomposite processing. To investigate optimum route for fabrication of nanocomposite enabling mass production, high energy ball milling and Pulse Electric Current Sintering (PECS) were adopted. By high energy ball milling, the $Al_2O_3$-based composite powder with dispersed Cu grains below 20 nm in diameter was successfully synthesized. The PECS method as a new process for powder densification has merits of improved sinterability and short sintering time at lower temperature than conventional sintering process. The relative densities of the $Al_2O_3$-5vol%Cu composites sintered at $1250^{\circ}C$ and $1300^{\circ}C$ with holding temperature of $900^{\circ}C$ were 95.4% and 95.7% respectively. Microstructures revealed that the composite consisted of the homogeneous and very fine grains of $Al_2O_3$ and Cu with diameters less than 40 nm and 20 nm respectively The composite exhibited enhanced toughness compared with monolithic $Al_2O_3$. The influence of the Cu content upon fracture toughness was discussed in terms of microstructural characteristics.

• Korean Journal of Materials Research
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• v.11 no.10
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• pp.863-868
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• 2001

The present study was carried out to investigate the effect of MA processing variables on the microstructural properties of composite powders and the coefficient of thermal expansion of pulse electric current sintered AlN-Cu powder compacts. The AlN-Cu powders had a size of less than 15 $\mu\textrm{m}$ with 25 nm size of copper crystallite after MA 32 hours. The finely distributed AlN-Cu powder compacts were completely achieved after PECS. The residual oxygen was considerably removed after hydrogen reduction treatment. The residual carbon was completely removed to 97%. The CTE of AlN-Cu powder compacts showed a good consistency with Kingery-Tuner model when the volume fraction of copper was less than 60%. When it was more than 60%, the CTE had a good agreement with Series model.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.476-476
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• 2011

Introduction of CNTs into a metal matrix has been considered to improve the mechanical properties of the metal matrix. However, the binding energy between metals and pristine CNTs wall is known to be so small that the interfacial slip between CNTs and the matrix occurs at a relatively low external stress. The interfacial strength between CNT and metal matrix is thus one of the key factors for successful development of the CNT/metal composites. Defective or functionalized CNT has been considered to enhance the interfacial strength of nanocomposites. In the present work, we design the various realistic hybrid structures of the single wall CNT/Cu complexes and characterize the interaction between single wall CNTs and Cu nano-particle and Cu13 cluster using first principle calculations. The characteristics of functionalized CNTs with various surface functional groups, such as -COOH, -OH, and -O interacting with Cu are investigated. We found that the binding energy can be enhanced by the surface functional group including oxygen since the oxygen atom can mediate and reinforce the interaction between carbon and Cu. These results strongly support the recent experimental work which suggested the oxygen on the interface playing an important role in the excellent mechanical properties of the CNT/Cu composite.

• Journal of Powder Materials
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• v.11 no.5
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• pp.421-426
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• 2004

The microstructure and mechanical property of hot-pressed $Al_2O_3/Cu$ composites with a different temperature for atmosphere changing from H$_{2}$ to Ar have been studied. When atmosphere-changed from H$_{2}$ to Ar gas at 145$0^{\circ}C$, the hot-pressed composite was characterized by inhomogeneous microstructure and low fracture strength. On the contrary, when atmosphere-changed at low temperature of 110$0^{\circ}C$ the composite showed more homogeneous microstructure, higher fracture strength and smaller deviation in strength. Based on the thermodynamic consideration and microstructural analysis, it was interpreted that the Cu wetting behavior relating to the formation of CuAlO$_{2}$ is probably responsible for strong dependence of microstructure on atmosphere changing temperature. The reason for a strong sensitivity of fracture strength and especially of its deviation to atmosphere changing temperature was explained by the microstructural inhomogeneity and by the role of CuAlO$_{2}$ phase on the interfacial bonding strength.

• Korean Journal of Metals and Materials
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• v.48 no.10
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• pp.884-892
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• 2010

To modify the physical properties of Cu thin films, gelatin is generally used as an additive. In this study, we assessed the effect of gelatin on the mechanical properties of electrodeposited Cu films. For this purpose, Cu/gelatin composite films were fabricated by adding 100 ppm of gelatin to an electrolyte, and tension and indentation tests were then performed. Additional tests based on pure Cu films were also performed for comparison. The Cu films containing gelatin presented a smaller grain size compared to that of pure Cu films. This increased the hardness of the Cu films, but addition of gelatin did not significantly affect the elastic modulus of the films. Cu films prepared at room temperature showed no significant change in the yield strength and tensile strength with an addition of gelatin, but we observed a dramatic decrease in the elongation. In contrast, Cu films prepared at $40^{\circ}C$ with gelatin presented a significant increase in the yield strength and tensile strength after the addition of gelatin. Elongation was not affected by adding gelatin. Presumably, the results would be closely related to the preferred orientation of the Cu thin film with the addition of gelatin and at temperatures that lead to a change in the microstructure of the Cu thin films.

• Journal of Adhesion and Interface
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• v.23 no.4
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• pp.108-115
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• 2022

In this study, we synthesized poly(itaconic acid-co-acrylamide) (IAcAAM) used as a novel polymer adhesion promoter to improve the adhesion strength of surface-treated Cu lead frames and epoxy composites. IAcAAM comprising itaconic acid, acrylamide was prepared through radical aqueous polymerization. The chemical structure and properties of IAcAAM was analyzed by FT-IR, ¹H-NMR, GPC, and DSC. The surface of the copper lead frame was treated with high temperature, alkali, and UV ozone to reduce the water contact angle and increase the surface energy. The adhesive strength of Cu lead frame and epoxy composite increased with the decrease of contact angle. The adhesive strength of Cu lead frame/epoxy composite increased with the addition of IAcAAM in epoxy composite. As silica content increased, the adhesive strength of Cu lead frame and epoxy composite tended to slightly decrease.

• Journal of Korea Foundry Society
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• v.13 no.3
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• pp.285-294
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• 1993

Aluminum alloy 2024 matrix composites reinforced with $Al_2O_3$ particles, were prepared by rheo-compocasting, a process which consists of the incoporation distribution of reinforcement by stirring within a semi-solid alloy. The microstructures and characteristics of the interfaces have been studied using optical microscope and scanning electon microscope in 2024 aluminum alloy composites reinforced with $Al_2O_3$ particles. The main results are as follows: (1) $Al_2O_3$ particles were well distributed in composites by using rheo-compocasting. (2) As the addition of $Al_2O_3$ particle increases, the average dendrite numbers and the hardness were increased. (3) Interaction between $Al_2O_3$ particles and alloy 2024 resulted in the formation of Mg and Cu element rich region around the $Al_2O_3$ particles.