• Journal of Powder Materials
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• v.16 no.4
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• pp.280-284
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• 2009

The pressureless sintering behavior of $Al_2O_3$/Cu powder mixtures, prepared from $Al_2O_3$/CuO and $Al_2O_3$/Cu-nitrate, has been investigated. Microstructural observation revealed that $Al_2O_3$ powders with nano-sized Cu particles could be synthesized by hydrogen reduction method. The specimens, pressureless-sintered at $1400^{\circ}C$ for 4 min using infrared heating furnace with the heating rate of $200^{\circ}C$/min, showed the relative density of above 90%. Maximum hardness of 16.1 GPa was obtained in $Al_2O_3$/MgO/Cu nanocomposites. The nanocomposites exhibited the enhanced fracture toughness of 4.3-5.7 $MPa{\cdot}m^{1/2}$, compared with monolithic $Al_2O_3$. The mechanical properties were discussed in terms of microstructural characteristics.

• Journal of the Korean Society of Clothing and Textiles
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• v.27 no.7
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• pp.843-850
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• 2003

Cu/PET film composites were prepared by electroless copper plating method. In order to improve adhesion between electroless plated Cu layer and polyester (PET) film, the effect of pretreatment conditions such as etching method, mixed catalyst composition were investigated. Chemical etching and plasma treatment increased surface roughness in decreasing order of Ar＞HCl＞O$_2$＞NH$_3$. However, adhesion of Cu layer on PET film increased in the following order: $O_2$＜Ar＜HCl＜NH$_3$. It indicated that appropriate surface roughness and introduction of affinitive functional group with Pd were key factors of improving adhesion of Cu layer. PET film was more finely etched by HCI tolution, resulting in an improvement in adhesion between Cu layer and PET film. Plasma treatment with NH$_3$produced nitrogen atoms on PET film, which enhances chemisorption of Pd$^{2+}$ on PET film, resulting in improved adhesion and shielding effectiveness of Cu layer deposited on the Pd catalyzed surface. Surface morphology of Cu plated PET film revealed that Pd/Sn colloidal particles became more evenly distributed in the smaller size by increasing the molar ratio of PdCl$_2$; SnCl$_2$from 1 : 4 to 1 : 16. With increasing the molar ratio of mixed catalyst, adhesion and shielding effectiveness of Cu plated PET film were increased.d.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.118-121
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• 2007

Bulk metallic glass (BMG)/crystalline composites comprising a copper based BMG alloy and crystalline nickel were produced by means of eloctroless plating of nickel on $Cu_{54}Zr_{22}Ti_{18}Ni_6$ BMG powder and subsequent consolidation using spark plasma sintering. The plastic deformation behavior of BMG/crystalline composites was examined by uniaxial compression test at various temperatures in the supercooled liquid region (SLR) of the BMG alloy. The evolution of strain states during uniaxial compression was tackled by microstructure observations. Deformation temperature played an important role in the deformation behavior of BMG/crystalline composites, which was attributed to a strong temperature dependence of the flow stress of the BMG alloy in the SLR. BMG/crystalline composites deformed homogenously in the temperature range where the flow stress of the BMG alloy was close to that of crystalline nickel. In contrast, inhomogeneous deformation was observed in the temperature range where the flow stress of the BMG alloy largely differs from that of crystalline nickel.

• Proceedings of the Materials Research Society of Korea Conference
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• 2007.11a
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• pp.124.2-124.2
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• 2007

• Nuclear Engineering and Technology
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• v.54 no.12
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• pp.4491-4498
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• 2022

The thermal stress between W plasma-facing material (PFM) and Cu heat sink in fusion reactors can be significantly reduced by using a W-Cu functionally graded material (W-Cu FGM) interlayer. However, there is still considerable stress at the joining interface between W and W-Cu FGM in the W/W-Cu FGM/Cu portions. In this work, we fabricate W skeletons with continuous gradients in porosity by a modified sedimentation method. Sintering densification behavior and pore characteristics of the sedimented W skeletons at different sintering temperatures were investigated. After Cu infiltration, the final W-Cu FGM was obtained. The results indicate that the pore size and porosity in the W skeleton decrease gradually with the increase of sintering temperature, but the increase of skeleton sintering temperature does not reduce the gradient range of composition distribution of the final prepared W-Cu FGM. And W-Cu FGM with composition distribution from pure W to W-20.5wt.% Cu layer across the section was successfully obtained. The thickness of the pure W layer is about one-fifth of the whole sample thickness. In addition, the prepared W-Cu FGM has a relative density of 94.5 % and thermal conductivity of 185 W/(m·K). The W-Cu FGM prepared in this work may provide a good solution to alleviate the thermal stress between W PFM and Cu heat sink in the fusion reactors.

• Composites Research
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• v.24 no.3
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• pp.17-24
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• 2011

The EAM simulation of nanoindentation was performed to investigate misfit dislocation slip in the Ag/Cu. The film layer, whose thickness in the range of 2-5nm, was indented by a spherical indenter with the N$\'{o}$se-Hoover thermostat condition. The simulation shows that the indentation position relative to misfit dislocation (MFD) has the effect on the dislocation, glide up or cross slip, for Ag film layer thickness less than 4 nm. Elastic energy variation during MFDs slip was revealed to be a key factor for the softening of Ag/Cu. The critical film layer thickness was evaluated for each case of Ag/Cu according to the spline extrapolation technique.

• Bulletin of the Korean Chemical Society
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• v.29 no.2
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• pp.309-312
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• 2008

Two different anode composite materials comprising of Fe, Cu and Si prepared using high energy ball milling (HEBM) were explored for their capacity and cycling behaviors. Prepared powder composites in the ratio Cu:Fe:Si = 1:1:2.5 and 1:1:3.5 were characterized through X-Ray diffraction (XRD) and scanning electron microscope (SEM). Nevertheless, the XRD shows absence of any new alloy/compound formation upon ball milling, the elements present in Cu(1)Fe(1)Si(2.5)/Graphite composite along with insito generated Li2O demonstrate a superior anodic behavior and delivers a reversible capacity of 340 mAh/g with a high coulombic efficiency (98%). The higher silicon content Cu(1)Fe(1)Si(3.5) along with graphite could not sustain capacity with cycling possibly due to ineffective buffer action of the anode constituents.

• Composites Research
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• v.22 no.3
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• pp.9-17
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• 2009

Nanoindentation behaviours on the films of softer Ag film/harder Cu substrate structure were studied by the molecular dynamics method. As a result, it was shown that the stiffness and hardness of films were strongly dependent on the thickness of films. The stiffness and hardness increased with the thickness of film within a critical range as an inverse Hall-Petch relation. The stiffness and hardness of Cu substrate with Ag film less than 5 nm were observed to be lower than those of bulk silver. In particular, the flower-like dislocation loop was created on the interface by the interaction between dislocation pile-up and misfit dislocation during the indentation of Ag film/Cu substrate with film thickness less than 4 nm, which seemed to be associated with the drop of load in the indentation load versus displacement curve.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.52 no.6
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• pp.249-256
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• 2003

Samples with the nominal composition, Ag-$Bi_{1.84}Pb_{0.34}Sr_{1.91}Ca_{2.03}Cu_{3.06}O_{10+{\delta}}$ high $T_{c}$ superconductors containing Ag as an additive were fabricated by a solid-state reaction method. Samples with Ag of 10 wt%, 30 wt%, and 50 wt% each were sintered at $860^{\circ}C$~$870^{\circ}C$ for 24 hours. The structural characteristics, the microstructures and the critical temperature with respect to the each samples were investigated by XRD, four-prove methode, SEM and EDS respectively. The $T_{c}\;^{zero}$ of the sample with the 50 wt% Ag additive at the surface showed 94 K.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1989.06a
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• pp.59-61
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• 1989

The cell parameters of the sintered CdS/CdTe solar cells in which te CuCl$_2$was added in the carbon paste after the sintering of the CdS/CdTe composites an were annealed at 35$0^{\circ}C$ for 10 min in nitrogen are investigated. Voc and FF do not change significantly as the CuCl$_2$increasing up to 500 ppm, Jsc increases with futher increase in copper. The hole concentration, determined by C-V measurement, increases to $1.5\times$10$^{16}$ ㎤ as the copper increased to 25 ppm and then stays at about the same value with further increase in copper.