• Journal of Advanced Navigation Technology
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• v.28 no.4
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• pp.544-551
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• 2024

In this study, the electrochemical polarization data required for the simulation of the plating process, simulation of plating conditions, and characterization of the plating layer were discussed. The electrochemical polarization data obtained by potentiodynamic polarization tests and potentiostat analysis of Ni and Cu were used to observe changes in the overvoltage distribution with the flow conditions of the plating solution. In the simulation of plating conditions, the current density distribution and plating thickness distribution were evaluated under different variables to analyze the influence of the location and number of contacts on the rack pins on the plating quality. Simulation results under variables such as anode geometry, interpole distance, auxiliary anode placement, and variation of substrate spacing were used to explore ways to improve plating thickness deviation. Additionally, plating layer characterization analyzed the thickness, adhesion, and delamination of the plating layer with and without buffer layer formation. The simulation results can be utilized as important basic data for improving the efficiency and quality of the plating process.

• Journal of the Korean Electrochemical Society
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• v.19 no.3
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• pp.87-94
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• 2016

In order to improve performances of submicrometer-sized Si negative electrode which shows larger volumetric change than nano-sized Si, composite binders are introduced by blending between poly(phenanthrenequinone) (PPQ) conductive polymer binder and poly(acrylic acid) (PAA) having good adhesion strength due to its carboxyl functional group. Blending between PPQ and PAA shows an effect that the adhesion strength of the Si electrode with the composite conductive binder is greatly improved after blending and this makes its better stable cycle performance. Blending ratios between PPQ and PAA in this work are 2:1, 1:1, 1:2 (by weight) and the best capacity retention at 50th cycle is observed in the electrode with the blending ratio 2:1 (named QA21). This is because that PPQ plays a role of conductive carbon among the Si particles or between Si particles and Cu current collector and PAA binds effectively the particles and the current collector. According to this synergetic effect, the internal resistance of the Si electrode with the blending ratio 2:1 is the smallest value. In addition, the Si electrode with PPQ-PAA composite binder shows the better stable cycle performance than the electrode with conventional super-P conductive carbon (20 wt.%).

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.2
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• pp.81-86
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• 2003

To measure the pressure using semiconductor type pressure sensor in water or chemical solution, the sensor must be protected from the solution using proper packaging materials. stainless steel isolated type pressure sensor packaged with SUS316 can be widely used to measure the pressure in water or chemical due to its high corrosion-resistance and good performance in tensility and welding. Even if the surface of SUS316 has a plenty of nickel and chromium, the SUS316 is highly corrosive in acidic or alkaline solution. We coated parylene and adhesion promoting copper layer are 5${\mu}{\textrm}{m}$ and 200nm, respectively. The parylene coated stainless steel pressure sensor showed good anti-corosive characteristics in various strong acids. The accuracy of pressure sensor wasn't varied after parylene coating with 0.5%FSO.

• Journal of the Korean Vacuum Society
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• v.6 no.S1
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• pp.110-114
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• 1997

Development of metal ion source growth of high quality Cu metal film formation of non-stoichiometric $SnO_2$ films of Si(100), and modification fo polymer surface by low enregy ion beam have been carried out at KIST Ion Beam Lab. A new metal ion source with high ion beam flux has been developed by a hybrid ion beam (HIB) deposition and non-stoichiometric $SnO_2$ films are controlled by supplying energy. The ion assisted reaction (IAR) in which keV ion beam is irradiated in reactive gas environment has been deveolped for modifying the polymers and enhancing adhesion to other materials and advantages of the IAR have been reviewed.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.45-45
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• 2018

홍합, 따개비 등의 접착성 해양생물은 선박의 하부나 발전소 해수 공급용 튜브에 부착하여 운영 효율을 저하 시키고, 냉각기기 고장을 유발하는 파울링(Fouling) 문제를 야기시킨다. 일반적으로 이러한 문제에 대응하기 위해서 초접착성 해양생물이 주로 부착하는 부위에 $Cu_2O$, ZnO 등을 포함한 유기화합물로 표면처리를 하여 부착방지를 하고 있지만, 이 소재들을 장시간 사용 시 해양 오염 및 부식을 가속화하는 문제를 초례하기 때문에 최근에는 사용을 금지하고 있다. 이러한 유해성 소재 문제를 해결하고자 친환경적이고 부작용이 없는 초접착성 해양생물 부착방지 소재를 개발하고자 하였다. 본 연구에서는 낮은 표면장력을 갖는 PDMS(Polydimethylsiloxane) 소재를 기반으로 소수성 oil을 침투시킨 I-PDMS(Oil-Polydimethylsiloxane) 표면처리법을 고안하였고, 이 방법을 활용하여 초접착성 해양생물에 대한 부착방지 성능을 향상시키고자 하였다. 기존의 개발품들 보다 성능이 향상된 I-PDMS 제조하고자, Nano-indentation을 이용한 기계적 특성 평가, X컷 및 cross-cut을 이용한 부착력 평가, 실제 바다환경에서 해양생물의 부착력 시험, 바다 환경을 모사한 수조에서의 I-PDMS와 비교군 기판에서의 홍합 거동, 홍합과 기판의 접착강도 시험, 해양 미생물 평가를 실시하였으며, 이를 통해서 I-PDMS 성능 및 내구성을 입증하고자 하였다.

• Journal of the Korean institute of surface engineering
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• v.48 no.1
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• pp.11-22
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• 2015

Pd alloy hydrogen membranes for hydrogen purification and separation need thermal stability at high temperature for commercial applications. Intermetallic diffusion between the Pd alloy film and the porous metal support gives rise to serious problems in long-term stability of Pd alloy membranes. Ceramic barriers are widely used to prevent the intermetallic diffusion from the porous metal support. However, these layers result in poor adhesion at the interface between film and barrier because of the fundamentally poor chemical affinity and a large thermal stress. In this study, we developed Pd alloy membranes having a dense microstructure and saturated composition on modified metal supports by advanced DC magnetron sputtering and heat treatment for enhanced thermal stability. Experimental results showed that Pd-Cu and Pd-Ag alloy membranes had considerably enhanced long-term stability owing to stable, dense alloy film microstructure and saturated composition, effective diffusion barrier, and good adhesive interface layer.

• Journal of the Korean Vacuum Society
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• v.4 no.S2
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• pp.95-99
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• 1995

keV ion beam irradiatin for surface modification and thin film growth have been discussed. keV ion beam irradiation in reactive gas environment has been developed for improving wettability of polymer, and for enhancing adhesion to metal film, and adventages of the method have been reviewed. An epitaxial Cu film on Si(100) substrate has been grown by ionized cluster beam and changes of crystallinity and surface roughness have been discussed. Stoichiometric $SnO_2$ films on Si(100) and glass have been grown by a hybrid ion beam Deposition(2 metal ion sources+1 gas ion source), and nonstoichiometric $SnO_2$ films are controlled by various deposition conditions in the HIB. Surface modification for polymer by kev ion irradiation have been developed. Wetting angle of water to PC has been changed from 68 degree to 49 degree with $Ar^+$ irradiation and to 8 degree with $Ar^+$ irradiation and the oxygen environment. Change of surface phenomena in a keV ion beam and characteristics of the grown films are suggested.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.85-85
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• 2010

Graphene, the building block of graphite, is one of the most promising materials due to their fascinating electronic transport properties. The pseudo-two-dimensional sp2 bonding in graphene layers yields one of the most effective solid lubricants. In this poster, we present the correlation between electrical and nanomechanical properties of graphene layer grown on Cu/Ni substrate with CVD (Chemical Vapor Deposition) method. The electrical (current and conductance) and nanomechanical (adhesion and friction) properties have been investigated by the combined apparatus of friction force microscopy/conductive probe atomic force microscopy (AFM). The experiment was carried out in a RHK AFM operating in ultrahigh vacuum using cantilevers with a conductive TiN coating. The current was measured as a function of the applied load between the AFM tip and the graphene layer. The contact area has been obtained with the continuum mechanical models. We will discuss the influence of mechanical deformation on the electrical transport mechanism on graphene layers.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.338-338
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• 2013

Monolithic three-dimensional integrated circuits (3D-ICs) 구현 시 bonding 과정에서 발생되는 aluminum (Al) 이나 copper (Cu) 등의 interconnect metal의 확산, 열적 스트레스, 결함의 발생, 도펀트 재분포와 같은 문제들을 피하기 위해서는 저온 공정이 필수적이다. 지금까지는 polymer 기반의 bonding이나 Cu/Cu와 같은 metal 기반의 bonding 등과 같은 저온 bonding 방법이 연구되어 왔다. 그러나 이와 같은 bonding 공정들은 공정 시 void와 같은 문제가 발생하거나 공정을 위한 특수한 장비가 필수적이다. 반면, 두 물질의 합금을 이용해 녹는점을 낮추는 eutectic bonding 공정은 저온에서 공정이 가능할 뿐만 아니라 void의 발생 없이 강한 bonding 강도를 얻을 수 있다. Aluminum-germanium (Al-Ge) 및 aluminum-indium (Al-In) 등의 조합이 eutectic bonding에 이용되어 각각 $424^{\circ}C$ 및 $454^{\circ}C$의 저온 공정을 성취하였으나 여전히 $400^{\circ}C$이상의 eutectic 온도로 인해 3D-ICs의 구현 시에는 적용이 불가능하다. 이러한 metal 조합들에 비해 indium (In)과 tin (Sn)은 각각 $156^{\circ}C$ 및 $232^{\circ}C$로 굉장히 낮은 녹는점을 가지고 있기 때문에 In-Sn 조합은 약 $120^{\circ}C$ 정도의 상당히 낮은eutectic 온도를 갖는다. 따라서 본 연구팀은 In-Sn 조합을 이용하여 $200^{\circ}C$ 이하에서monolithic 3D-IC 구현 시 사용될 eutectic bonding 공정을 개발하였다. 100 nm SiO2가 증착된 Si wafer 위에 50 nm Ti 및 410 nm In을 증착하고, 다른Si wafer 위에 50 nm Ti 및 500 nm Sn을 증착하였다. Ti는 adhesion 향상 및 diffusion barrier 역할을 위해 증착되었다. In과 Sn의 두께는 binary phase diagram을 통해 In-Sn의 eutectic 온도인 $120^{\circ}C$ 지점의 조성 비율인 48 at% Sn과 52 at% In에 해당되는 410 nm (In) 그리고 500 nm (Sn)로 결정되었다. Bonding은 Tbon-100 장비를 이용하여 $140^{\circ}C$, $170^{\circ}C$ 그리고 $200^{\circ}C$에서 2,000 N의 압력으로 진행되었으며 각각의 샘플들은 scanning electron microscope (SEM)을 통해 확인된 후, 접합 강도 테스트를 진행하였다. 추가로 bonding 층의 In 및 Sn 분포를 확인하기 위하여 Si wafer 위에 Ti/In/Sn/Ti를 차례로 증착시킨 뒤 bonding 조건과 같은 온도에서 열처리하고secondary ion mass spectrometry (SIMS) profile 분석을 시행하였다. 결론적으로 본 연구를 통하여 충분히 높은 접합 강도를 갖는 In-Sn eutectic bonding 공정을 $140^{\circ}C$의 낮은 공정온도에서 성공적으로 개발하였다.

• Korean Journal of Heritage: History & Science
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• v.54 no.1
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• pp.4-17
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• 2021

This study analyzed 19 samples of harness fittings and pendants, which were excavated in Tomb No. 15 in Songhyeon-dong, Changnyeong. Harness fittings and pendants are used for ostentation, rather than practicality, and were excavated from ancient tombs in Gaya culture. So, they are considered artifacts that compare the production techniques and raw materials. This study aimed to examine the production techniques and provenience studies of Bihwa Gaya, which is estimated to be from the 5th to 6th centuries. According to the research, harness fittings were made of pure copper and were gilded with Au·Ag alloys on their surfaces. Hg was detected together and plated with a mercury amalgam method. As a result of the pendant (fish scales-pattern, oval and fish-tail shape), analysis showed that Fe in the background metal, Cu in the middle layer, and Au and Ag on the surface were the main components. The method of adhesion between Cu and Au·Ag gilded layers are plated by a mercury amalgamation method. So, it was identified by the gilt-iron·gold·bronze technique. Since the pendant (heart shaped) is found to be the main component of Fe in the background metal and Ag in the surface layer, the metal was made gilt-iron·silver technique. The background metal and gilding were additionally fixed using a rivet. The raw materials of 3 harnesses excavated from Changnyeong are plotted in zone 2 in the southern Korean Peninsula. And 16 harnesses were plotted in Chinese copper ore by Mabuchi Hishao in the Chinese Peninsula.