• Journal of the Korean institute of surface engineering
• /
• v.42 no.5
• /
• pp.191-196
• /
• 2009

Nanocrystalline Cu thin films were electrodeposited from sulfate baths and investigated systematically the influences of $Cu^{2+}$ concentration and additives on current efficiency, residual stress, surface morphology, and XRD patterns of electrodeposited Cu film. Current efficiency was nearly 100% at from 0.2M to 1.0 M $Cu^{2+}$ concentration. but it was linearly increased with $Cu^{2+}$ concentration at less than 0.2M. The residual stress was observed in range of 7.9 to 18.4 MPa and tensile stress mode. Dendritic and powdered form was obtained at below 0.1 M. As increased with $Cu^{2+}$ concentration in solution, the main peak in the XRD pattern shifted (111) and (220) from (200). In the other hand, all about 100% current efficiency observed in all additive concentration systems, and residual stress observed in range of 20.4 to 26.3 MPa tensile stress. The condition 5(Ultra make-up - 10 ml/l, Ulta A - 0.5ml/l, Ultr B - 0.5 ml/l) was good surface morphology, and fcc(111) peak in XRD patterns increased with increasing additive concentration.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2005.05a
• /
• pp.49-49
• /
• 2005

• Journal of Powder Materials
• /
• v.25 no.4
• /
• pp.291-295
• /
• 2018

A conductive additive is prepared by dispersing multi-walled carbon nanotubes (MWCNTs) on Cu powder by mechanical milling and is distributed in epoxy to enhance its electrical conductivity. During milling, the MWCNTs are dispersed and partially embedded on the surface of the Cu powder to provide electrically conductive pathways within the epoxy-based composite. The degree of dispersion of the MWCNTs is controlled by varying the milling medium and the milling time. The MWCNTs are found to be more homogeneously dispersed when solvents (particularly, non-polar solvent, i.e., NMP) are used. MWCNTs gradually disperse on the surface of Cu powder because of the plastic deformation of the ductile Cu powder. However, long-time milling is found to destroy the molecular structure of MWCNTs, instead of effectively dispersing the MWCNTs more uniformly. Thus, the epoxy composite film fabricated in this study exhibits a higher electrical conductivity than 1.1 S/cm.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.15 no.4
• /
• pp.308-313
• /
• 2002

Samples with the norminal composition, $Bi_{2-x}Au_xSr_2CaCu_2O_{8+\delta}$ (x = 0, 0.05. 0.1, 0.15) were prepared by the solid-state reaction method. The superconducting properties, x-ray powder diffraction patterns, critical temperature and microstructure of surface were measured the samples. x-ray patterns show the single phase(2212) nature of the samples. But, the peaks of 2201 at $2\theta=30^{\circ}$ and Au peak at $2\theta=38.31^{\circ}$ are observed in the Au additive samples. The grain sire are enlarged with the increase of x. As the result of enlargement the grain size, the onset and offset critical temperature($T_c^{on}$,$T_c^{zero}$) increased with increase of x.

• Journal of the Korean Electrochemical Society
• /
• v.18 no.1
• /
• pp.7-16
• /
• 2015

Effects of chemical composition ($Cu^{2+}$, $K_4P_2O_7$ and additive concentrations) of baths on properties of Cu thin films electrodeposited from pyrophosphate copper bath were investigated. Current efficiency was increased to be near 100% with increasing $Cu^{2+}$ concentrations from 0.02 to 0.3M. Decrease of current efficiency was observed in the range of 1.5~1.8M $K_4P_2O_7$ concentration, but current efficiency of about 100% was measured in the ranges of both 0.9~1.3M and 2.1~2.4M. The change of additive concentration did not influenced current efficiency. Residual stress of electrodeposited Cu thin films was measured to be about 20 MPa below 0.15 M $Cu^{2+}$ concentration and increased with the increase of it to 0.25 M. Maximum residual stress of 120MPa was observed at 0.25M $Cu^{2+}$ concentration. On the other hand, residual stress decreased from 80 to near 0 MPa as $K_4P_2O_7$ concentration varied from 0.9 to 2.4M and but The change of additive concentration did not affected on residual stress. $Cu^{2+}$ and $K_4P_2O_7$ concentrations significantly affect on surface morphology of electrodeposited Cu thin films, but additive concentration slightly affected. From XRD analysis, the microstructures of electrodeposited Cu thin film was affected from the changes of $Cu^{2+}$ and $K_4P_2O_7$ concentrations, but not from that of additive concentration. Strong preferred orientation of (111) peak was observed with increasing $Cu^{2+}$ and $K_4P_2O_7$ concentrations.

• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.52 no.6
• /
• pp.249-256
• /
• 2003

Samples with the nominal composition, Ag-$Bi_{1.84}Pb_{0.34}Sr_{1.91}Ca_{2.03}Cu_{3.06}O_{10+{\delta}}$ high $T_{c}$ superconductors containing Ag as an additive were fabricated by a solid-state reaction method. Samples with Ag of 10 wt%, 30 wt%, and 50 wt% each were sintered at $860^{\circ}C$~$870^{\circ}C$ for 24 hours. The structural characteristics, the microstructures and the critical temperature with respect to the each samples were investigated by XRD, four-prove methode, SEM and EDS respectively. The $T_{c}\;^{zero}$ of the sample with the 50 wt% Ag additive at the surface showed 94 K.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.15 no.5
• /
• pp.188-192
• /
• 2005

High $T_c(Y_{0.5}Nd_{0.25}Sm_{0.25})Ba_2Cu_3O_y[(YNS)-123]$ superconductors with/without $CeO_2$ additive were systematically investigated by the zone melt growth process in air. Cylindrical green rods of (YNS)-123 oxides were fabricated by cold isostatic pressing (CIP) method using rubber mould. A sample prepared by this method showed well-textured microstructure, and $(Y_{0.5}Nd_{0.25}Sm_{0.25})_2BaCuO_5[(YNS)211]$ nonsuperconducting inclusions were uniformly dispersed in large $(Y_{0.5}Nd_{0.25}Sm_{0.25})Ba_2Cu_3O_y$[(YNS)123] superconducting matrix. In this study, optimum melting temperature and growth rate were $1100^{\circ}C$ and 3 mm/hr, respectively. The directionally melt-textured (YNS)-123 sample with $CeO_2$ additive showed an onset critical temperature $(T_c)\;T_c{\geq}93K$ and sharp superconducting transition.

• Korean Chemical Engineering Research
• /
• v.54 no.6
• /
• pp.723-733
• /
• 2016

Intensive researches have been focused on the 3-dimensional packaging technology using through silicon via (TSV) to overcome the limitation in Cu interconnection scaling. Void-free filling of TSV by the Cu electrodeposition is required for the fabrication of reliable electronic devices. It is generally known that sufficient inhibition on the top and the sidewall of TSV, accompanying the selective Cu deposition on the bottom, enables the void-free bottom-up filling. Organic additives contained in the electrolyte locally determine the deposition rate of Cu inside the TSV. Investigation on the additive chemistry is essential for understanding the filling mechanisms of TSV based on the effects of additives in the Cu electrodeposition process. In this review, we introduce various filling mechanisms suggested by analyzing the additives effect, research on the three-additive system containing new levelers synthesized to increase efficiency of the filling process, and methods to improve the filling performance by modifying the functional groups of the additives or deposition mode.

• Journal of the Korean Magnetics Society
• /
• v.16 no.4
• /
• pp.201-205
• /
• 2006

The electromagnetic properties and microstructure of the basic composition of $(Ni_{0.2}Cu_{0.2}ZnO_{0.2})_{1.02}(Fe_{2}O_{3})_{0.98}$ were invested, changing the amount of the additives $Bi_2O_3$ and $ZrO_2$ and sintering temperature. The spinel structure of specimen was confirmed by the analysis of XRD patterns. Grain size and its density are increased by increasing the additive and the sintering temperature.However, the permeability increased with decreasing additive. It was also found that $Bi_2O_3$ had more effect on the increase of grain size and permeability rather than $ZrO_2$.

• Resources Recycling
• /
• v.10 no.2
• /
• pp.27-33
• /
• 2001

Reusing of electroless Ni-Cu-P waste solution was investigated in the plating time, plating rate, solution composion and deposit. Plating time of nickel-catalytic surface took longer than that of zincated-catalytic surface. Initial solution with 50f) waste solution additive at batch type was possible to reusing of waste solution. Plating time of initial solution at continuous type took longer 10 times over than that of batch type. Plating time of 50% waste solution additive at continuous type took longer 3.7 times over than that of batch type. Component change of nickel-copper for electroless deposition was greatly affected by depolited inferiority and larger decreased plating rate.