• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 1997년도 특별강연 및 추계학술발표 개요집
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• pp.184-193
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• 1997

Aluminium and aluminium alloys have the high electrical and heat conductivity. It gives rise to difficulties for a choice of electrodes material for their contact electric welding. This paper describes the investigations performed to solve the above problem. The purpose of this investigation was to obtain dispersion-hardening alloys by the internal oxidation method, to optimize their contents and treatment modes, to produce electrodes of these alloys and to test them. The strengthing effect of alloys with oxide particles depends on their size stability at high temperatures. Despite of the fact, that oxides are the most stable of all the non-metallic phases their coagulation takes place. Based on the early results, we chose two types of alloys, first No. 1 Cu - 0,4%Al and second No. 2 Cu - 0,2%Be for production of electrodes. These alloys had not additional alloying elements. These alloys were prepared as 1 mm plates and flake-formed 200 m thick, and also No. 1 as a powder of size 100 mkm (received from Korea). The large samples for electrodes were produced by three methods : explosive welding method, dynamic one including the explosion compression of electrode blank and the quasi-dynamic method including the high-speed compression of dense briquest and the further hot extrusion of a rod.

• 한국물환경학회지
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• 제30권6호
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• pp.647-652
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• 2014

The aim of this study was to investigate the heavy metal removal and biomass productivity in the Acid Mine Drainage (AMD) using eggshell and microalgae. The experiment was operated 6 days in the eggshell and microalgae hybrid system, and using eggshell powder and microalgae as Chlorella vulgaris. The obtained result indicated that the biomass productivity of 2.82 g/L/d from 1.12 g/L initial concentration in 6 days was reached with light transmittance of 97% at a 305 mm depth in the optical panel photobioreactor (OPPBR). The total removal efficiency of Fe, Cu, Zn, Mn and Cd was found to be 98.92%, 99.91%, 98.78%, 88.99% and 98.00% in the AMD using eggshell and Chlorella vulgaris hybrid system, respectively. Additionally, there were significant relationships between biomass and concentration of each heavy metal ($R^2$ = 0.8771, 0.8643, 0.8669, 0.9134 and 0.6277 for Fe, Cu, Zn, Mn and Cd). These results indicated that the eggshell and microalgae hybrid system was highly effective for heavy metal removal when compared to the conventional biological process in the AMD. Therefore, the eggshell and microalgae hybrid system was effective for heavy metal removal and biomass productivity and can be applied to treat AMD in treatment plant.

• 한국초전도학회:학술대회논문집
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• 한국초전도학회 2000년도 High Temperature Superconductivity Vol.X
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• pp.125-127
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• 2000

We report high pressure synthesis of Sr$_{0.9}$Sm$_{0.1}$CuO$_2$. Powder x-ray diffraction showed that the synthesized compounds have infinite layer structure as a major component. Slow heating at the first stage of heating processes after pressurization resulted in several larger grains. The largest grain was found to have the longest edge length of about 100 micrometer. Through magnetic property measurement in superconducting state, we found that pinning in this compound has substantial difference from that of La doped infinite layer, which has no unpaired spin at Sr site.

• 한국표면공학회지
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• 제49권5호
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• pp.416-422
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• 2016

We have investigated the effects of applied potential, deposition time and electrolyte types on shapes and physical properties of Cu dendrites by potentiostatic electrodeposition. Finer shape of dendrites was observed at less cathodic potential by 100mV than at the limiting current, due to 'effective overpotential'. The shape of copper dendrite is related to the deposition time, too. The dendrite depositing for 10 min showed the finest shape. The finer dendrite has the less apparent density and the larger specific surface area. Dendrite from chloride solution has the lowest density and the largest surface area among three plating solutions, sulfate, chloride and pyrophosphate.

• 소성∙가공
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• 제12권6호
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• pp.588-596
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• 2003

The relationships between evolution of microstructure and mechanical properties of porous Al-3Si-2Mg-2Cu alloy after the foaming and various heat treating were investigated. The foamed alloy having various densities were manufactured by powder compact foaming and heat treated. Then compression test was performed with deformation rate of 0.5/s. The ultimate compression strength was not changed after solution heat treatment but the flow curve after ultimate strength showed very smooth and uniform plateau region. This change of flow curve means that the deformation mechanism is altered from brittle fracture to ductile deformation and the energy absorption property of Al foam is dramatically improved. The improvement of energy absorption without any detriment of mechanical properties is due to that the very brittle precipitation like Al-Cu and Al-Mg was uniformly dissolved in Al matrix after solution heat treatment. And various mechanical properties of Al alloy porous material were improved by 40% with aging of $200^{\circ}C$ and 50min. These improvements are ascribe to the various fine precipitates like $\Omega$ and $\theta$'.

• ETRI Journal
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• 제35권4호
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• pp.625-631
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• 2013

For the formation of solder bumps with a fine pitch of 130 ${\mu}m$ on a printed circuit board substrate, low-volume solder on pad (LVSoP) technology using a maskless method is developed for SAC305 solder with a high melting temperature of $220^{\circ}C$. The solder bump maker (SBM) paste and its process are quantitatively optimized to obtain a uniform solder bump height, which is almost equal to the height of the solder resist. For an understanding of chemorheological phenomena of SBM paste, differential scanning calorimetry, viscosity measurement, and physical flowing of SBM paste are precisely characterized and observed during LVSoP processing. The average height of the solder bumps and their maximum and minimum values are 14.7 ${\mu}m$, 18.3 ${\mu}m$, and 12.0 ${\mu}m$, respectively. It is expected that maskless LVSoP technology can be effectively used for a fine-pitch interconnection of a Cu pillar in the semiconductor packaging field.

• Corrosion Science and Technology
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• 제10권5호
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• pp.180-188
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• 2011

In the present study, denting corrosion experiments were performed as a function of crevice gap size (50, 100 and 200 ${\mu}m$) in a solution containing 3,500 ppm NaCl + 0.2 M $CuCl_2$ (pH = 3 adjusted by HCl). The effects of chloride ion concentrations (3, 3,500 and 35,000 ppm as NaCl) were also outlined with two different crevice gap sizes (100, 200 ${\mu}m$). In addition, the effect of NiB on the denting corrosion was also investigated in a solution of 35,000 ppm NaCl + 0.2 M $CuCl_2$ (pH = 3 adjusted by HCl). The results showed that denting rate increased with the increasing crevice gap size at an initial stage and became nearly constant afterwards. As the concentration of chloride ion increased, the denting rate also increased. However, the addition of a NiB powder of 4 g/L in to the acid-chloride solution was observed to suppress the denting rate significantly.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.220-221
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• 2006

We investigated the electrical properties of polymer-carbon composite materials for temperature sensitive resistor applications. Cu/polymer/Cu sheets were fabricated by laminating low density polyethylene(LDPE) containing carbon powders. Weight ratio of carbon powder to LDPE was varied in a range of 0.9~2. With increasing the carbon concentration, the electrical resistance of the composite material was decreased from 0.75 to $0.08\;{\Omega}cm$. The composite layer showed a abrupt increase in the electrical resistance at $115^{\circ}C$ because of the softening of the polymer.

• 한국산업융합학회 논문집
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• 제22권6호
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• pp.767-773
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• 2019

The thermal diffusion performance of the electronic device is a factor for evaluating the stability of the electronic device. Therefore, many of research have been conducted to improve the thermal characteristics of thermal interface materials, which are materials for thermal diffusion of electronic products. In this study, nano thermal grease was prepared by blending graphene, silver and copper nano powders into a thermal grease, a type of thermal interface materials, and the heat transfer rate was measured and compared for the purpose of investigating the improved thermal properties. As a result, the thermal properties were good in the order of graphene, silver and copper, which is thought to be due to the different thermal properties of the nano powder itself.

• 대한화학회지
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• 제53권4호
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• pp.407-414
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• 2009

o-phenylenediamine, 3-acetyl-6-methyl-(2H) pyran, 2,4 (3H)-dione (dehydroacetic acid or DHA) 및 살리실 알데히드로부터 유도한 4-hydroxy-3-(1-{2-(2-hydroxy-benzylidene)-amino phenylimino}-ethyl)-6- methy-pyran-2-one (H2L) 의 Cu(II), Ni(II), Co(II), Mn(II) 및 Fe(III) 고체 착물을 합성한 후, 원소분석, 전도 도법, 수자율, 자외선-가시선, 적외선, $^1H$-NMR 스펙트라, X-선 회절, 열분석을 통해 특성을 규명하고 항균 활성을 조사하였다. IR 스펙트럼 데이터로부터 이 리간드가 중심 금속이온에 대해 ONNO 주개원자 배열을 갖는 이염기성 네자리 리간드로 행동함을 제안하였다. 원소분석 데이터로부터 이들 착물의 화학량론이 1:1 (금속:리간드)임을 알았다. 물리-화학적 데이타로부터 Cu(II) 및 Ni(II) 착물이 사각평면 기 하구조, 그리고 Co(II), Mn(II) 및 Fe(III) 착물이 팔면체 기하구조임을 제안하였다. X-선 회절 데이터로 부터 Cu(II) 착물이 사방정계(orthorhombic) 결정계, Ni(II), Co(II) 및 Fe(III) 착물이 단사계(monoclinic) 결정계 그리고 Mn(II) 착물이 정방정계(tetragonal) 결정계임을 제안하였다. 착물의 열적 행동(TG/DTA) 을 연구하였으며 Coats-Redfern 방법으로 반응속도 파라메터를 결정하였다. 리간드와 이들 금속 착물을 이용하여 Staphylococcus aureus 및 Escherichia coli에 대한 향균 활성과 Aspergillus Niger 및 Trichoderma 에 대한 살균 활성을 조사하였다.