• 한국재료학회지
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• 제12권12호
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• pp.941-946
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• 2002

Both Cu and Cu-oxide nanopowders have great potential as conductive paste, solid lubricant, effective catalysts and super conducting materials because of their unique properties compared with those of commercial micro-sized ones. In this study, Cu and Cu-oxide nanopowders were prepared by Pulsed Wire Evaporation (PWE) method which has been very useful for producing nanometer-sized metal, alloy and ceramic powders. In this process, the metal wire is explosively converted into ultrafine particles under high electric pulse current (between $10^4$ and $10^{ 6}$ $A/mm^2$) within a micro second time. To prevent full oxidations of Cu powder, the surface of powder has been slightly passivated with thin CuO layer. X-ray diffraction analysis has shown that pure Cu nanopowders were obtained at $N_2$ atmosphere. As the oxygen partial pressure increased in $N_2$ atmosphere, the gradual phase transformation occurred from Cu to $Cu_2$O and finally CuO nanopowders. The spherical Cu nanopowders had a uniform size distribution of about 100nm in diameter. The Cu-oxide nanopowders were less than 70nm with sphere-like shape and their mean particle size was 54nm. Smaller size of Cu-oxide nanopowders compared with that of the Cu nanopowders results from the secondary explosion of Cu nanopowders at oxygen atmosphere. Thin passivated oxygen layer on the Cu surface has been proved by XPS and HRPD.

• 한국분말재료학회지
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• 제5권4호
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• pp.299-302
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• 1998

Dimensional accuracy is one of the most important issues in the production of sintered parts. The iron-copper-carbon system is commonly used alloys in sintered structural parts production. The dimensional control of these alloys, however, is not easy because of their complex sintering behavior. This study is an effort to clarify the influence of common factors on dimensional change of Fe-Cu-C sintered structural parts. We determined the effect of such various parameters as chemical composition, particle diameter, compact density, sintering temperature and sintering time on dimensional changes. Consequently, we obtained a useful formula to predict the final dimension in function of these parameters. The effect of typical impurities in copper powder on the dimensional change of sintered parts has also been described.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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• pp.306-307
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• 2006

The sinter-bonding behavior of iron based powder mixtures was investigated. To produce the green compacts to be joined the following powders based on $H{\ddot{o}}gan{\ddot{a}}s$ AB grade NC 100.24 plain iron powder were used: NC 100.24 as delivered, PNC 30, PNC 60 and NC 100.24 + 4%Cu powder mixtures. Dimensional behaviour of all those materials during the sintering cycle was monitored by dilatometry. Simple ring shaped specimens as the outer parts and cylindrical as the inner parts were pressed. The influence of parts' composition on joining strength was established. Diffusion of alloying elements: copper and phosphorous, across the bonding surface was controlled by metallography, SEM and microanalysis.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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• pp.278-279
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• 2006

The increasing demand for automotive industries to reduce the weight of the vehicles has led to a growing usage of Al alloy powder metallurgy (P/M) parts. In order to control the sintered microstructure and mechanical properties of the aluminium alloy powder metallurgical (P/M) parts, it is essential to establish a fundamental understanding of the microstructural development during the sintering process. This paper presents a detailed study of the effect of temperature and initial starting materials on the evolution of microstructure during the sintering of Al-Cu-Mg-Si blends for PM.

• 한국분말재료학회지
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• 제16권6호
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• pp.389-395
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• 2009

A Si-CuO-graphite composite was prepared by a mechanical alloying (MA) method. The Si-CuO composite has a mixture structure, where CuO is homogeneously dispersed in Si. Also, $Cu_2O$ and $Cu_3Si$ phases were formed during MA and heat treatment. Graphite with the Si-CuO composite was mixed in the same mill for 30 minutes with weight ratio of Si-CuO composite and graphite as 1:1. The Si-CuO composite was homogeneously covered with graphite. SiC phase was not formed. Electrochemical tests of the composite have been investigated, and the first charge and discharge capacities of the material were about 870mAh/g and 660mAh/g, respectively. Those values are about 76% of the first cycle efficiency. The cycle life of the composite showed that the initial discharge capacity of 660 mAh/g could be maintained up to 92% after 20 cycles.

• 한국세라믹학회지
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• 제35권4호
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• pp.319-324
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• 1998

Sol-gel derived phosphate water-sioluble glasses containing Cu were prepared. Powder-shape of glasses were added in D.I water used polyethylene bottle. After solution contained glass powder were submerged in water bath on 25$^{\circ}C$ their dissolution behavior/characteristics bactericidal effect and cytotoxicity test were evaluated. The maximum amount of Cu(35 mol%) via sol-gel method was more 5 mol% increased than that with melting process. The stage of total dissolution was more dominant than that of selective leaching dur-ing dissolution due to dissolved amount of glasses increased linearly with time. The ratio of Cu+ to {{{{ {Cu }^{2+ } }} was 3:7 so that the structure of glasses is more predominant 2-dimension chain structure than 3-dimenshion po-lymeric structue. The stage of total dissolution was more dominant than that of selective leaching during dissolution. Bactericidal effect against all bacteria showed that solutions which contained 40 ppm and 100 ppm of Cu killed 80 percentages of bacteria within 2 hours and 100 percentages of those within 12 hours. The results of cytotoxicity test for L929 cells showed no cytotoxicity were observed within 96 hours for dis-solved solution that contains 40 ppm and 100 ppm of Cu.

• 한국분말재료학회지
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• 제20권4호
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• pp.245-252
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• 2013

This study attempted to manufacture a Cu-Ga coating layer via the cold spray process and to investigate the applicability of the layer as a sputtering target material. In addition, changes made to the microstructure and properties of the layer due to annealing heat treatment were evaluated, compared, and analyzed. The results showed that coating layers with a thickness of 520 mm could be manufactured via the cold spray process under optimal conditions. With the Cu-Ga coating layer, the ${\alpha}$-Cu and $Cu_3Ga$ were found to exist inside the layer regardless of annealing heat treatment. The microstructure that was minute and inhomogeneous prior to thermal treatment changed to homogeneous and dense with a more clear division of phases. A sputtering test was actually conducted using the sputtering target Cu-Ga coating layer (~2 mm thickness) that was additionally manufactured via the cold-spray coating process. Consequently, this test result confirmed that the cold sprayed Cu-Ga coating layer may be applied as a sputtering target material.

• Tribology and Lubricants
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• 제23권2호
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• pp.66-72
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• 2007

[ $MoS_2$ ], is a well-known metal sulfide applied as solid lubricants and an additive to prolong the life of sintered bearings under severe conditions. However, the high price of $MoS_2$ limited its wide application. This study is aimed to investigate the possibility far application to solid lubricants for $Cu_2S$ as a substitute of $MoS_2$. Bronzes added $Cu_2S$ and $MoS_2$, are produced by powder metallurgy in this study, and then evaluated their friction and wear properties., as well as sintered bronze. The sliding wear test using pin-on-disc type machine, was conducted at several sliding speeds for three type test pieces sintered bronzes added $Cu_2S$ and $MoS_2$, and sintered bronze without lubricants. Addition of $Cu_2S$ to bronze leads to relatively good friction properties, although it is not so good as addition of $MoS_2$. However, the wear properies of sintered bronze added $Cu_2S$ are better than that of sintered bronze added $MoS_2$.

• ETRI Journal
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• 제33권6호
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• pp.864-870
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• 2011

As an isotropic conductive adhesive, that is, a hybrid Cu paste composed of Cu powder, solder powder, and a fluxing resin system, has been quantitatively characterized. The mechanism of an electrical connection based on a novel concept of electrical conduction is experimentally characterized using an analysis of a differential scanning calorimeter and scanning electron microscope energy-dispersive X-ray spectroscopy. The oxide on the metal surface is sufficiently removed with an increase in temperature, and intermetallic compounds between the Cu and melted solder are simultaneously generated, leading to an electrical connection. The reliability of the hybrid Cu paste is experimentally identified and compared with existing Ag paste. As an example of a practical application, the hybrid Cu paste is used for LED packaging, and its electrical and thermal performances are compared with the commercialized Ag paste. In the present research, it is proved that, except the optical function, the electrical and thermal performances are similar to pre-existing Ag paste. The hybrid Cu paste could be used as an isotropic conductive adhesive due to its low production cost.

• 한국분말재료학회지
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• 제17권6호
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• pp.470-476
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• 2010

In this study, Cu-10Sn and Cu-10Sn-2Ni-0.2Si alloys have been manufactured by spray casting in order to achieve a fine scale microstructure and high tensile strength, and investigated in terms of microstructural evolution, aging characteristics and tensile properties. Spray cast alloys had a much lower microhardness than continuous cast billet because of an improved homogenization and an extended Sn solid solubility. Spray cast Cu-Sn-Ni-Si alloy was characterized by an equiaxed grain microstructure with a small-sized (Ni, Si)-rich precipitates. Cold rolling of Cu-Sn-Ni-Si alloy increased a tensile strength to 1220 MPa, but subsequent ageing treatment reduced a ultimate tensile strength to 780 MPa with an elongation of 18%.