• 한국전기전자재료학회논문지
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• 제35권6호
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• pp.562-567
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• 2022

Novel self-illuminated smart windows were fabricated consisting of Cu-doped ZnS (ZnS:Cu) powder and polymer-dispersed liquid crystal (PDLC). This smart window shows not only switchable transparency but also self-illumination without any attachable luminous body. Its electro-optical characteristics, transmittance, and luminance were investigated in relation to various applied voltages and composition ratios. The optical transmittance and luminous intensity increased with increasing applied voltages. However, the optical transmittance decreased with increasing ZnS:Cu powder content. One of the self-illuminated smart windows, which was fabricated with 9 wt% of ZnS:Cu, achieved the optical transmittance of 60.5% (at 550 nm) and the luminance of 11.0 cd/m² at 100 V. This smart window could be used as a normal switchable smart window in daytime and light-emitting signage at night.

• 한국분말재료학회지
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• 제25권1호
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• pp.25-29
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• 2018

Porous Cu with a dispersion of nanoscale $Al_2O_3$ particles is fabricated by freeze-drying $CuO-Al_2O_3$/camphene slurry and sintering. Camphene slurries with $CuO-Al_2O_3$ contents of 5 and 10 vol% are unidirectionally frozen at $-30^{\circ}C$, and pores are generated in the frozen specimens by camphene sublimation during air drying. The green bodies are sintered for 1 h at $700^{\circ}C$ and $800^{\circ}C$ in $H_2$ atmosphere. The sintered samples show large pores of $100{\mu}m$ in average size aligned parallel to the camphene growth direction. The internal walls of the large pores feature relatively small pores of ${\sim}10{\mu}m$ in size. The size of the large pores decreases with increasing $CuO-Al_2O_3$ content by the changing degree of powder rearrangement in the slurry. The size of the small pores decreases with increasing sintering temperature. Microstructural analysis reveals that 100-nm $Al_2O_3$ particles are homogeneously dispersed in the Cu matrix. These results suggest that a porous composite body with aligned large pores could be fabricated by a freeze-drying and $H_2$ reducing process.

• 한국분말재료학회지
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• 제20권2호
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• pp.142-147
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• 2013

$YBa_2Cu_3O_{7-y}$ (Y123) powders for the fabrication of bulk superconductors were synthesized by the powder reaction method using $Y_2O_3$ (99.9% purity), $BaCO_3$ (99.75%) and CuO (99.9%) powders. The raw powders were weighed to the cation ratio of Y:Ba:Cu=1:2:3, mixed and calcined at $880^{\circ}C-930^{\circ}C$ in air with intermediate repeated crushing steps. It was found that the formation of Y123 powder was more sensitive to reaction temperature than reaction time. The calcined Y123 powder and a mixture of (Y123 + 0.25 mole $Y_2O_3$ + 1 wt.% $CeO_2$, $Y_{1.5}Ba_2Cu_3O_x$ (Y1.5)) were used as raw powders for the fabrication of poly-grain or single grain superconductors. The superconducting transition temperature ($T_{c,onset}$) of the sintered Y123 sample was 91 K and the transition width was as large as 11 K, whereas the $T_{c,onset}$ of the melt-grown Y1.5 sample was 90.5 K and the transition width was 3.5 K. The critical current density ($J_c$) at 77 K and 0 T of the sintered Y123 was 700 $A/cm^2$, whereas the $J_c$ of the top-seeded melt growth (TSMG) processed Y1.5 sample was $3.2{\times}10^4\;A/cm^2$. The magnetic flux density (H) at 77 K of the TSMG-processed Y123 and Y1.5 sample showed the 0.53 kG and 2.45 kG, respectively, which are 15% and 71% of the applied magnetic field of 3.5 kG. The high H value of the TSMG-processed Y1.5 sample is attributed to the formation of the larger superconducting grain with fine Y211 dispersion.

• 대한금속재료학회지
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• 제48권12호
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• pp.1097-1102
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• 2010

Silver coated copper powders were prepared by a chemical reduction method with controlling the deposition process variables such as the feeding rate of the silver ionic solution and concentration of the reductants at room temperature. The characteristics of the products were evaluated by scanning electron microscope (SEM), X-ray diffractometer (XRD), atomic absorption spectrophotometer (AA) and a 4 probe resistivity measurement system. The optimum condition of the preparation of Ag coated Cu powders was at 0.05 M of potassium sodium tartrate and 2 ml/min of the feeding rate of the silver ionic solution. Our method successfully produced dense, uniform, and well-dispersed Ag coated Cu powder of $2{\sim}2.5{\mu}m$ witha silver layer of 100~200 nm. Additionally, we found that thespecific resistivity of the 30 wt.% Ag coated Cu powder was similar to that of pure silver, so that the composite powder could be used as an alternative electromagnetic shielding material for silver.

• 대한기계학회논문집A
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• 제24권3호
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• pp.735-742
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• 2000

Densification behaviors of mixed metal powder under high temperature were investigated. Experimental data of mixed copper and tool steel powder with various volume fractions of Cu powder were obtained under hot isostatic pressing and hot pressing. By mixing the creep potentials of McMeeking and co-workers and of Abouaf and co-workers originally for pure powder, the mixed creep potentials with various volume fractions of Cu powder were employed in the constitutive models. The constitutive equations were implemented into a finite element program (ABAQUS) to compare with experimental data for densification of mixed powder under hot isostatic pressing and hot pressing. Finite element calculations by using the creep potentials of Abouaf and co-workers agreed reasonably well with experimental data, however, those by McMeeking and co-workers underestimate experimental data as observed in the case of pure metal powders.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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• pp.377-378
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• 2006

Thermal management technology is a critical element in all new chip generations, caused by a power multiplication combined with a size reduction. A heat sink, mounted on a base plate, requires the use of special materials possessing both high thermal conductivity (TC) and a coefficient of thermal expansion (CTE) that matches semiconductor materials as well as certain packaging ceramics. In this study, nano tungsten coated copper powder has been developed with a wide range of compositions, 90W-10Cu to 10W-90Cu. Powder technologies were used to make samples to evaluate density, TC, and CTE. Measured TC lies among theoretical values predicted by several existing models.

• 한국분말재료학회지
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• 제9권1호
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• pp.19-24
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• 2002

This paper reports the results of an investigation into the effect of Cu additions upon the nano-crystallization behaviour of an Al-Y-Ni alloy. 1 at.% Cu was added to a base alloy of Al/sub 88/Y₄Ni/sub 8/ either by substitution for Al to form Al/sub 87/Y₄Ni/sub 8/Cu₁, or by substitution for Ni to form Al/sub 88/Y₄Ni/sub 7/Cu₁. Consistent with previous findings in the literature, the substitution of Cu for Al was found to increase the thermal stability of the amorphous phase whereas the substitution of Cu for Ni was found to decrease its thermal stability. Comparing the microstructures of these alloys after heat treatment to produce equivalent volume fractions of Al nanocrystals showed average grain sizes of 14 nm, 12 nm and 9 nm for the alloys Al/sub 88/Y₄Ni/sub 8/, Al/sub 87/Y₄Ni/sub 8/Cu₁respectively. The effect of Cu in refining the size of the nanocrystals was attributed to enhanced nucleation increasing the number density of the nanocrystals, rather than diffusion limited or interface limited growth.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.953-954
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• 2006

Ti-Cu-Ni-Sn quaternary amorphous alloys of $Ti_{50}Cu_{32}Ni_{15}Sn_3$, $Ti_{50}Cu_{25}Ni_{20}Sn_5$, and $Ti_{50}Cu_{23}Ni_{20}Sn_7$ composition were prepared by mechanical alloying in a planetary high-energy ball-mill (AGO-2). The amorphization of all three alloys was found to set in after milling at 300rpm speed for 2h. A complete amorphization was observed for $Ti_{50}Cu_{32}Ni_{15}Sn_3$ and $Ti_{50}Cu_{25}Ni_{20}Sn_5$ after 30h and 20h of milling, respectively. Differential scanning calorimetry analyses revealed that the thermal stability increased in the order of $Ti_{50}Cu_{32}Ni_{15}Sn_3$, $Ti_{50}Cu_{25}Ni_{20}Sn_5$, and $Ti_{50}Cu_{23}Ni_{20}Sn_7$.

• 한국분말재료학회지
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• 제11권2호
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• pp.158-164
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• 2004

W-Cu composite has been used for the applications requiring both high strength, good thermal and electrical conductivity. A graded combination of W and Cu will reduce thermal stress concerned with heat conduction, maintaining good thermal conductivity and high mechanical strength. In the present work, an attempt was made to fabricate continuous W-Cu FGM by preparing the graded porous structure of W skeleton using spark plasma sintering (SPS) process followed by infiltrating Cu. The graded porous structure was prepared at 150$0^{\circ}C$ for 60s under pressure of 15MPa by SPS process using a graphite mold with varying crr)ss section in the longitudinal direction. Infiltration of Cu was performed at 115$0^{\circ}C$ for 1 hour under $H_2$. W-Cu composite with graded Cu composition of 14 to 27 wt％ was finally prepared. In this process the gradient of composition could be conveniently controlled by varying the gradient of cross sectional area of graphite mold, temperature and pressure.

• 한국분말재료학회지
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• 제29권5호
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• pp.370-375
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• 2022

Cu-doped ZnSe quantum dots were successfully synthesized in an aqueous solution using an internal doping method. The effects of ligand type, CuSe synthesis temperature, and heating time on Cu-doped ZnSe synthesis were systematically investigated. Of MPA, GSH, TGA, and NAC used as ligands, MPA was the optimal ligand as determined by PL spectrum analysis. In addition, the emission wavelength was found to depend on the synthesis temperature of the internal doping core of CuSe. As the temperature increased, the doping of Cu²⁺ was enhanced, and the emission wavelength band was redshifted; accordingly, the emission peaks moved from blue to green (up to 550 nm). Thus, the synthesis of Cu:ZnSe using internal doping in aqueous solutions is a potential method for ecomanufacturing of color-tuned ZnSe quantum dots for display applications.