• Title/Summary/Keyword: Cu Oxide

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The Effects of Al-Alloying Elements on the Melt Oxidation(II, Oxide Layer Shape and Microstructure) (Al-합금의 원소가 용융산화에 미치는 영향(ll. 산화층 형상과 미세구조))

  • Jo, Chang-Hyeon;Gang, Jeong-Yun;Kim, Il-Su;Kim, Cheol-Su;Kim, Chang-Uk
    • Korean Journal of Materials Research
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    • v.7 no.8
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    • pp.660-667
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    • 1997
  • AI-Mg-합금의 용융산화에 의해 생성되는 AlO$_{2}$O$_{3}$-복합재료의 미세구조에 미치는 합금원소의 영향을 연구하였다. AI-1Mg 합금과 AI-3Mg 합금을 기본으로하여 Si, Zn, Sn, Cu, Ni, Ca, Ce를 1, 3, 5 %를 무게비로 첨가하였다. 각 합금을 1473K에서 20시간 유지하여 산화시킨 후 산화층의 거시적 형상과 미세구조를 광학현미경으로 관찰하였다. 각 미세구조의 상분율을 상분석기로 측정하였다. 산화층의 최첨단면은 SEM과 EDX로 관찰하고 분석하였다. Cu나 Ni를 첨가한 합금으로부터 성장한 산화층의 미세구조가 가장 치밀하였다. Zn이 포함된 합금으로부터 성장한 산화층 최첨단 성장면에는 ZnO가 관찰되었다. Zn이 포함되지 않은 다른 합금의 성장 전면에는 항상 MgAi$_{2}$O$_{4}$상이 관찰되었다.

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Novel Electrical Dopants for High Performance OLEDs

  • Leem, Dong-Seok;Lee, Jae-Hyun;Kim, Jang-Joo
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.1311-1314
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    • 2008
  • We have developed new electrical dopants of rhenium oxide ($ReO_3$) and cupper iodide (CuI) as p-dopants and rubidium carbonate ($Rb_2CO_3$) as an n-dopant, respectively. $ReO_3$ has advantage of low temperature evaporation (about $300^{\circ}C$) with enhanced device stability. Various kinds of high performance organic light emitting diodes have been realized, including bottom emission, tandem, and top-emission OLEDs.

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Finite Element Analysis of Combustion Reaction on Iron and Metal Oxides Interface (Fe-금속 산화물 계면에서 연소반응의 유한 요소해석)

  • Gu, Mun-Seon;Choe, Yong
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2017.05a
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    • pp.118.2-118.2
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    • 2017
  • Combustion behavior of Fe, CuO, NiO, ZnO and $Fe_2O_3$ powder mixture was carried out by finite element method (FEM) to understand a reaction at iron and metal oxide interface. The FEM was done by using ANSYS Fluent 17.0. Initial and boundary conditions are 1 atmosphere, room temperature, 0.1MPa of oxygen partial pressure, $T_{S1}=1127^{\circ}C$, $T_{S2}=327^{\circ}C$ for a cylindrical shape specimen with dia. $35{\times}80$ [mm]. The maximum combustion temperature is $1537^{\circ}C$ for the condition of conduction, convection and radiation. The combustion temperature and rate are about $847^{\circ}C$ and 3.9mm/sec, respectively. The combustion wave is enough to make ternary ferrite phase like $CuNiZnFe_2O_3$.

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Viscosity and thermal conductivity of copper oxide nanofluid dispersed in ethylene glycol

  • Kwak, Ki-Yuel;Kim, Chong-Youp
    • Korea-Australia Rheology Journal
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    • v.17 no.2
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    • pp.35-40
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    • 2005
  • Nanofluid is a novel heat transfer fluid prepared by dispersing nanometer-sized solid particles in traditional heat transfer fluid to increase thermal conductivity and heat transfer performance. In this research we have considered the rheological properties of nanofluids made of CuO particles of 10-30nm in length and ethylene glycol in conjunction with the thermal conductivity enhancement. When examined using TEM, individual CuO particles have the shape of prolate spheroid of the aspect ratio of 3 and most of the particles are under aggregated states even after sonication for a prolonged period. From the rheological property it has been found that the volume fraction at the dilute limit is 0.002, which is much smaller than the value based on the shape and size of individual particles due to aggregation of particles. At the semi-dilute regime, the zero shear viscosity follows the Doi-Edwards theory on rodlike particles. The thermal conductivity measurement shows that substantial enhancement in thermal conductivity with respect to particle concentration is attainable only when particle concentration is below the dilute limit.

Ag, Al and Cu metal mesh films prepared by photolithography for touch screen panel (Photolithography 공정으로 제작한 touch screen panel 용 Ag, Al, Cu metal mesh film)

  • Kim, Seo-Han;Yu, Mi-Yeong;Song, Pung-Geun
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2015.11a
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    • pp.287-288
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    • 2015
  • 최근 투명 산화물 전극 (TCO)은 LED, electronic display, solar cell, touch screen panel (TSP) 등 다양한 분야에 많이 사용되고 있다. TCO는 높은 광 투과도와 전도성으로 인해 여러 분야에 많이 사용되고 있으며, 특히 ITO (Sn-doped indium oxide)가 display 분야에 많이 적용되고 있다. 하지만, ITO는 투과도와 면저항의 반비례 관계를 가지므로 더 낮은 면저항이 요구되는 대면적 TSP 분야에 적용되기에는 많은 개선이 필요하다. 따라서, 본 연구에서는 metal mesh film의 연구를 통해 TSP 분야에 사용되는 ITO를 대체하고자 한다. 제작된 mesh film은 모두 면저항은 $15{\Omega}/{\square}$ 이하, 광 투과도 90% (@550nm) 이상을 나타내었다.

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A Study of the Semiconductivity of Polycrystalline Cuprous Oxide (다결정 산화구리의 반도성에 관한 연구)

  • Choi, Jae-Shi;Yo, Chul-Hyun
    • Journal of the Korean Chemical Society
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    • v.16 no.2
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    • pp.74-79
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    • 1972
  • The semiconductivity of polycrystalline $Cu_2O$ has been studied between $220^{\circ}C$ and $680^{\circ}C under partial pressures of oxygen from $4.06{\times}10^{-3}\;to\;10^{-5 }\;mmHg$. The plots of log conductivity vs 1/T at constant oxygen pressure were found to be linear, and the activation energies obtained from the slopes of these plots above the first transition point showed that the energies were greater under high oxygen pressure than under low pressure. The transition points between the stable range and the unstable range of $Cu_2O$ were found from the curves. The dependence of the semiconductivity on the $O_2$ pressure, in the above temperature range, is shown hysteresis.

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Tungsten Coating on Metal Substrates by Using Tungsten Oxide Powder (텅스텐 산화 분말을 이용한 텅스덴 코팅에 관한 연구)

  • Lee, Seong;Kim, Eun-Pyo;Hong, Mun-Hui;Roh, Jun-Ung
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2002.04b
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    • pp.53-53
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    • 2002
  • 본 연구에서는 산화텅스텐($WO_3$) 분말을 이용하여 여러 금속 기판에 텅스텐 박막을 코팅하는 방법에 관한 연구를 수행하였다. 본 연구에서 언급되는 W 코팅은 Lee 등이 보고한 W, Cu 산화물을 이용하여 W-Cu 복합분말을 제조하는 것으로부터 아이디어가 출발되었으며, 본 연구의 결과는 기존의 6불화 텅스텐 가스($WF_6$) 를 열 분해하여 증착시키는 화학증착법(CVD: chemical vapor deposition)과 순수 텅스텐 target을 sputtering하여 증착시키는 물리증착법(PVD: physical vapor deposition)과 달리, 산화텅스텐 분말, 금속 기판, 및 수소 가스만을 사용하기 때문에 경제적으로 큰 장점이 있는 새로운 코팅법의 하나로 연구되었다. 본 연구에서는 새로운 코팅법의 기구와 여러 금속에서 코팅되는 W의 코팅 현상 등에 대해 간단히 언급하고자 하였다.

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Effect of Metal Oxide on the Superconductivity of YBCO

  • Lee, Sang-Heon
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09b
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    • pp.1241-1242
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    • 2006
  • Electromagnetic properties of $CeO_2$ doped and undoped YBaCuO superconductors were evaluated to investigate the effect of pinning center on the magnetization and magnetic shielding. The variation $\DeltaM$ with doping was maximum for 3% doping and decrease with further doping. The magnetic shielding was evaluated by measuring the induced voltage in secondary coil and the voltage initially set to 0.5V, decreased to 0.17V and 0.28V respectively for the undoped and 3% $CeO_2$ doped sample. The much less change in the induced voltage for the 3% doped sample is attributed to the increased flux shielding by shielding vortex current. The $CeO_2$ was converted to fine $BaCeO_3$ particles which were trapped in YBaCuO superconductor during the reaction sintering. The trapped fine particles, $BaCeO_3$ may be acted as a flux pinning center.

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Effect of Maunfacturing Conditions of Substrate on Phosphatability (인삼염처리성에 미치는 소재 제조조건 영향)

  • 김형준
    • Journal of the Korean institute of surface engineering
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    • v.30 no.5
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    • pp.310-319
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    • 1997
  • The purpose of this study is to investigate the effect of the specific alloying elements in steel such as Cr, Ni and Cu, and surface roughness of substrate with two different FCS temperature zones in the CAL process on the phosphatability of the cold-rolled sheet used for the drum in order to improve the zinec phosphating property. Phosphatability is dependent of the surface oxide and roughness on the substrate and can be indirectly improved by increasing surface roughness of the steel sheet. Basically, in order to obtain the good phosphatability, the low concentration of the retained elements such as Cr, Ni and Cu among the steel alloy elements should be required. Phosphatability of substrate with high concentration instead of the retained elements and surface roughness, however, can be effectively improved instead of low FSC temperature.

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