• Korean Journal of Food Science and Technology
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• v.9 no.2
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• pp.157-164
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• 1977

In the present study, the proxidant effect of ferrous and cupric chlorides which added to soybean oil and its fried noodle in the same concentration of the city water and the physically refined underground water were determined. As the inhibitor of metal proxidation, BHA and citric acid which are used widely in oil industry as antioxidants were compared. In both cases of soybean oil and its fried noodle, the addition of cupric chloride and ferrous chloride showed prominent proxidant effect. Especially, cupric chloride marked more proxidant effect than ferrous chloride by 3 to 6 times with the elapse of time. In the inhibition activity of metal proxidation, citric acid was more effective than BHA. The 1ppm of Cu +0.01% of citric acid treated soybean oil showed less proxidant effect than the control at the later stage. The inhibition activity of citric acid on $Fe^{++}$ in soybean oil was more effective than $Cu^{++}$ in soybean oil.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.91-96
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• 2014

Through silicon via (TSV) technology is to form a via hole in a silicon chip, and to stack the chips vertically for three-dimensional (3D) electronics packaging technology. This can reduce current path, power consumption and response time. In this study, Cu-filling substrate size was changed from Si-chip to a 4" wafer to investigate the behavior of Cu filling in wafer level. The electrolyte for Cu filling consisted of $CuSO_4$ $5H_2O$, $H_2SO_4$ and small amount of additives. The anode was Pt, and cathode was changed from $0.5{\times}0.5cm^2$ to 4" wafer. As experimental results, in the case of $5{\times}5cm^2$ Si chip, suitable distance of electrodes was 4cm having 100% filling ratio. The distance of 0~0.5 cm from current supplying location showed 100% filling ratio, and distance of 4.5~5 cm showed 95%. It was confirmed good TSV filling was achieved by plating for 2.5 hrs.

• Proceedings of the Korean Society for Applied Microbiology Conference
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• 1978.04a
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• pp.98.4-98
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• 1978

방선균에서 RNA 분해효소력이 강한 균주를 토양으로부터 선별하여 이 균주의 RNA 분해산물을 검토하고 부산물로서 항생물질의 생성을 조사하였다. 먼저 동시 생성 생육조건을 검토한 결과, 유기 질소원으로서 soybean meal 1.5%, 무기 질소원으로서는 $KNO_3$ 0.05% 첨가하였을 때 효과가 있었고, 탄소원으로서는 가용성 전분 2% 첨가시가 조건이 좋았다. 무기염류를 배지에 첨가하였을 때 별 다른 영향이 없었고 오히려 $CuSO_4를$ 가하였을 때는 저해를 보였다. 최초 pH가 7.0, 배양 2일째에 균체증식, 효소생산 및 항생물질의 생산이 최대를 나타내었다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.11a
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• pp.87-88
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• 2007

무전해 구리 도금 공정에서 첨가제로 사용되는 HIQSA 화합물이 Damascene 공정을 이용한 60nm급 trench 패턴 내 무전해 구리 배선 형성 과정에 미치는 효과를 전기 화학적 기법과 광학적 기법을 이용하여 관찰하였다. HIQSA 농도별 open circuit potential의 변화를 관측한 결과, 3ppm 수준으로 첨가되었을 때, 무전해 도금 과정 중 가장 안정한 전위가 유지됨을 볼 수 있었다. 무전해 도금액 내 HIQSA 농도가 높아짐에 따라 구리 도금층의 두께는 지수적으로 감소하였으며, 표면의 결정 크기도 감소하였다. 60nm급 trench 내 무전해 구리 도금 시, 용액 내 침적 시간 60초가 무결함 superconformal copper filling을 얻기 위한 최적 시간이었다.

• Journal of Life Science
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• v.14 no.3
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• pp.478-483
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• 2004

In a model reaction using lysyl oxidase purified partilally from bovine aorta, effect of L-ascorbic acid AsA on the oxidative reaction of lysine in collagen was investigated. Addition of Ash to the reaction mixture under aerobic conditions resulted in the decrease of enzymatic activity. In order to examine the specificity of AsA in the oxidative reaction of lysine, other reductants including A derivatives instead of AsA were added to the reaction mixture. Thiol such as glutathione had no effect on the activities of lysyl oxidase. on the other hand, it was observed that erythorbic acid, which was a stereoisomer of AsA, had the same inhibitory effect on this oxidative reaction as AsA. Moreover, by the addition of 3,4-dihydroxybenzoate, which was structural analog of AsA, the activities decreased in a similar manner to that of AsA. These results indicate that the regulatory effect of AsA on lysyl oxidase is attributed to characteristics of the structure. From the determination of Ash remained in the reaction mixture, it is shown that AsA concentration remarkably decreased by lysyl oxidase of the reaction mixture. It is hypothesized that endiol groups reduces the enzyme-bound $Cu^{+2}$ required for further progress of the reaction, and suggests that AsA regulates specifically the reduction of $Cu^{+2}$ required to oxidize lysyl oxidase. This findings support that AsA has an important regulatory role on the oxidative reaction of lysine and on changes of collagen cross-links with aging.

• Korean Journal of Materials Research
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• v.3 no.4
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• pp.410-421
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• 1993

Phase equilibria and reaction paths of the superconducting phases and other compatible phases at $850^{\circ}C$ in the Bi-Sr-Ca-Cu-O system were studied. $Bi_2O_3$ was added to $Sr_2CaCu_2O_x$ by 5% up to 40 mole% Bi in the pseudo-binary $Bi_2O_3-(Sr_2CaCu_2O_x)$ system and the heat treated samples were analysed using XRD. SEM, EDS. and DT A. When Bi contents were greater than 35 mole% Bi, liquid phase was formed which was compatible with $Bi_2Sr_2CaCu_2O_8$ phase. The m.p. of $Bi_2Sr_2CaCu_2O_8$ phase decreased as the content of (Sr+Ca)decreased. $Bi_{2+x}Sr_2CaCu_2O_8$ phase first segregated out of liquid phase around $Bi_2Sr_2CaCu_2O_8$ phase during cooling of liquid phase.

• Korean Journal of Materials Research
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• v.11 no.8
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• pp.629-635
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• 2001

To improve the ductility of $A1_3Hf$ intermetallics, which are the potential high temperature structural materials, the mechanical alloying behavior. the effect of Cu addition on the $Ll_2$ phase formation and the behavior of vacuum hot-pressed consolidation were investigated. During the mechanical alloying by SPEX mill, the $Ll_2 A1_3Hf$ intermetallics with the grain size of 7~8nm was formed after 6 hours of milling in Al-25at.%Hf system. The $Ll_2$ Phase of Al_3Hf$ intermetallics with the addition of 12.5at.%Cu, similar to that of the binary Al-25at.% Hf, was formed, but the milling time necessary for the formationof the $Ll_2$ phase was delayed form 6 hours to 10 hours. The lattice parameter of ternary $Ll_2(Al+Cu)_3Hf$ intermetallics decreased with the increase of Cu content. The onset temperature of $Ll_2$ to $D0_{23}$ phase in $Al_3Hf$ intermetallics was around 38$0^{\circ}C$, the temperature upon completion varied from 48$0^{\circ}C$ to 5$50^{\circ}C$ as the annealing time. The onset temperature of $Ll_2$ to $D0_{23}$ phase transformation in $(Al+ Cu)_3Hf$ intermetallics increased with the amount of Cu and the highest onset temperature of $700^{\circ}C$ was achieved by the Cu addition of 10at.%. The relative density increased from 89% to 90% with the Cu addition of 10at.% in $Al_3Hf$ intermetallics hot-pressed in vacuum under 750MPa at 40$0^{\circ}C$ for 3 hours. The relative density of 92.5% was achieved without the phase transformation and the grain growth as the consolidation temperature increased from 40$0^{\circ}C$ to 50$0^{\circ}C$ in $(Al+Cu)_3Hf$ intermetallics hot-pressed in vacuum under 750MPa for 3 hours.

• Korean Journal of Weed Science
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• v.17 no.2
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• pp.214-219
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• 1997

The influence of manure, chemical fertilizers, heavy metals and cleaner on the rate of degradation of alachlor in soil was studied. The degradation rate of alachlor in the soil followed first-order reaction kinetics. The half-life was 6.4 days. The degradation was accelerated by the amendment of manure. Adding chemical fertilizers to the soil enhanced alachlor degradation more in the presence of nitrogen than potassium. On the other hand, adding heavy metals or cleaner to the soil decreased the degradation rate. The half-life of alachlor in soil treated with Cd, Cr, Ni, Zn and Cu was 11.0, 8.3, 7.9, 7.2 and 6.7 days, respectively, and that of the cleaner is 7.5 days. The microbial biomass and the respiration rate in the soil were promoted by the amendment of manure and chemical fertilizers, and inhibited by the addition of heavy metals and cleaner. The degradation rate correlate positively with the microbial biomass and the respiration rate.

• Polymer(Korea)
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• v.35 no.3
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• pp.244-248
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• 2011

Poly(2,6-dimethyl-1,4-phenylene ether) (PPE) was synthesized by oxidative polymerization using various Cu(I)-amine catalyst system. The effects of catalyst/monomer ratio, different amine ligand, and the content of 2,4,6-trimethylphenol (TMP) additive on the polymer yield and molecular weight were investigated by using gel permeation chromatography. The catalytic activity of various Cu-amine systems on the 2,S-dimethylphenol (DMP) polymerization was monitored and compared each other through oxygen-uptake experiment. In addition, the effect of catalyst removal using aqueous EDTA on the thermal stability of the prepared polymer was elucidated by thermogravimetric analysis.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.343-346
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• 2003

A systematic study of Cu CMP in terms of the effect of slurry chemicals(oxidizer, corrosion inhibitor, complexing agent) on the process characteristics has been performed. In acidic media, a corrosion inhibitor, benzotriazole(BTA) and tolytriazol(TTA) was used to control the removal rate and avoid isotropic etching. When complexing agent is added with $H_2O_2$ 2wt% in the slurry, a corrosion rate was presented very good. Most of in, it was appeared that BTA is possible to be replaced by TTA. The tartaric acid was distinguished for the effect among complexing agents. n we apply this results to copper CMP process, it is thought that we will be able to obtain better yield.