• Journal of the Korean Magnetics Society
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• v.5 no.5
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• pp.491-495
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• 1995

The crystallization behaviors and magnetic properties for $Fe_{81-x}Al_{4}B_{10}Zr_{5}Cu_{x}$ (x=0, 1, 2 at%) alloys is investigated. By the addition of 1~2 Cu, the temperature range, where a single bcc phase exists, expands largely over 200 K and the grain size of bcc phase represents to less than 10 nm. For the optimally annealed Cu-added alloys, the high $\mu_{e}$ (1 kHz) above 20000 combined with the high $B_{10}$ of about 1.4 T is obtained in nanocrystalline state. The low core loss of 95.8 W/kg at 0.1 T and 100 kHz is confirmed for the nanocrystalline $Fe_{80}Al_{4}B_{10}Zr_{5}Cu_{1}$ alloy.

• 한국태양에너지학회:학술대회논문집
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• 2009.11a
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• pp.350-355
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• 2009

The crysralline silicon solar cell where the solar cell market grows rapidly is occupying of about 85% or more high efficiency and low cost endeavors many crystalline solar cells. The fabricaion process of high efficiency crystalline silicon solar cells necessitate complicated fabrication processes and Ti/Pd/AG contact, This metal contacts have only been used in limited areas in spite of their good srability and low contact resistance because of expensive materials and process. Commercial solar cells with screen-printed solar cells formed by using Ag paste suffer from loe fill factor and high contact resistance and low aspect ratio. Ni and Cu metal contacts have been formed by using electroless plating and light-induced electro plating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposit the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 16.446 % on 0.2~0.6${\Omega}$ cm, $20{\times}20mm^2$, CZ(Czochralski) wafer.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.217.2-217.2
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• 2014

We prepared a flexible and transparent CuO/Cu/CuO multilayer electrodes on a polyethylene terephthalate (PET) substrate using a specially designed roll-to-roll sputtering system at room temperature for GFF-type touch screen panels (TSPs). By the continuous roll-to-roll sputtering of the CuO and Cu layer, we fabricated a flexible CuO(150nm)/Cu(150nm)/CuO(150nm) multilayer electrodes with a sheet resistance of $0.289{\Omega}/square$, resistivity of $5.991{\times}10^{-23}{\Omega}-cm$, at the optimized condition without breaking the vacuum. To investigate the feasibility of the CuO/Cu/CuO multilayer as a transparent electrode for GFF-type TSPs, we fabricated simple GFF-type TSPs using the diamond patterned CuO/Cu/CuO electrode on PET substrate as function of mesh line width. Using diamond patterned CuO/Cu/CuO electrode of mesh line $5{\mu}m$ with sheet resistance of 38 Ohm/square, optical transmittance of 90% at 550 nm and an average transmittance of 89% at wavelength range from 380 to 780 nm, we successfully demonstrated GFF-type touch panel screens (TPSs). The successful operation of GFF-type TPSs with CuO/Cu/CuO multilayer electrodes indicates that the CuO/Cu/CuO multilayer is a promising transparent electrode for large-area capacitive-type TPSs due to its low sheet resistance and high transparency.

• Transactions on Electrical and Electronic Materials
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• v.15 no.1
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• pp.41-44
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• 2014

Emission properties of the organic light-emitting diodes were investigated with the use of a hole-injection layer of copper(II)-phthalocyanine (CuPc). The manufactured device structure is indium-tin-oxide (ITO) (180 nm)/CuPc (0~50 nm)/N,N'-Bis(3-methylphenyl)-N,N'-diphenylbenzidine (TPD) (40 nm)/tris-(8-hydroxyquinoline) aluminum (III) ($Alq_3$) (60 nm)/Al(100 nm). We investigated the luminescence properties of $Alq_3$ which is affected by the CuPc hole-injection layer. Also, we studied the influence of light-emission properties in the structure of an ITO/CuPc/TPD/$Alq_3$/Al device depending on the several thicknesses of CuPc (0~50 nm) layer. As a result, it was found that the hole injection occurs smoothly in the device with 20 nm thick CuPc layer, and the properties become significantly worse in the device with a CuPc layer thickness higher than 40 nm. We studied the topography and external quantum efficiency depending on the layer thickness of CuPc. Also, we analyzed the electroluminescent characteristics in the low and high-voltage range.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.292-295
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• 2001

The NdBaCuO superconducting samples were prepared by the Zone melting under low oxygen partial pressure. After the zone-melting the oxygenation process of the NdBaCuO samples in a oxygen flow furnace was studied. In order to compare the oxygenation condition the sintering NdBaCuO samples were studied also. In the study it is found that the optimum temperature for the oxygenation is $350^{\circ}C$, and the oxygen flow speed, the sample volume and the surface area of the sample would influence the oxygenation and the oxygen content.

• Proceedings of the KIEE Conference
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• 1997.07d
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• pp.1449-1451
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• 1997

Busbar made with Cu or Cu alloys and producted by Plastic manufacturing process. In this study, we research the manufacturing trend of Cu clad Al busbar for low cost and light weight which used for a electric power supply of distributing board. The objectives of this study is the manufacturing of composite busbar on electric power supply, the process and application for Cu clad Al busbar and the relation between electric properties and manufacturing operating process on contact parties.

• Journal of Environmental Science International
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• v.14 no.7
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• pp.669-674
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• 2005

Catalytic combustion of toluene was investigated on $CuOx/SnO_2-ZrO_2\;CuOx/SnO_2\;CuOx/ZrO_2$ catalysts prepared by impregnation. Characteristics of catalysts loaded on binary support and single support were observed by TPR, TPO, XRD, XPS techniques. The results on catalytic combustion showed that binary supports improve the activity of copper in the combustion of toluene. The reason for high catalytic activity on toluene combustion of $CuOx/SnO_2-ZrO_2$ catalyst was ascribed to oxidation$\cdot$reduction activity at low temperatures and stability of oxidation state after reduction.

• Korean Journal of Materials Research
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• v.3 no.6
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• pp.668-677
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• 1993

The microstructural and shear tests of STS304/, STS430/ and low-C steel/Cu joints brazed using Cu-P, Cu-P-Sn(four type) and Cu-P-Sn-Ag(three type) filler metals at 1003 and 1033K for 1.2ks in Ar atomsphere were performed. Interfacial microstructures were divided into three type ; first, reaction layer contained cracks second, dispersed layer without cracks third, dispersed layer and reaction layer contained cracks. The joints composed only of dispersed layer without cracks have the high shear strength of above 40-60 MPa and result in failure in copper base metal. Low shear strength and joint failure result from the formation of reaction layer which induced cracks. The reaction layer is a Fe-P compound. This tendency of microstructure and shear strength depends on the existence and/or nonexistence of Sn in filler metals as well as Ni (and Cr) in base metals.

• Journal of Powder Materials
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• v.22 no.2
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• pp.87-92
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• 2015

Metallic porous materials have many interesting combinations of physical and geometrical properties with very low specific weight or high gas permeability. In this study, highly porous Cu foam is successfully fabricated by a slurry coating process. The Cu foam is fabricated specifically by changing the coating amount and the type of polyurethane foam used as a template. The processing parameters and pore characteristics are observed to identify the key parameters of the slurry coating process and the optimized morphological properties of the Cu foam. The pore characteristics of Cu foam are investigated by scanning electron micrographs and micro-CT analyzer, and air permeability of the Cu foam is measured by capillary flow porometer. We confirmed that the characteristics of Cu foam can be easily controlled in the slurry coating process by changing the microstructure, porosity, pore size, strut thickness, and the cell size. It can be considered that the fabricated Cu foams show tremendous promise for industrial application.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1988.10a
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• pp.98-101
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• 1988

The material system (Bi$\sub$0.7/Pb$\sub$0.3/)Sr$_1$Ca$_1$Cu$\sub$1.8/Ox forms, at 845$^{\circ}C$, two major phases having a high Tc(100K) and a low Tc(∼70K) both of which consists of platelets and a non-superconducting minor phase which has rod-like shape and isolated by the major phases. As the sintering period increases, the amount of high Tc phase increases accompanying the decrease in low Tc phase while the amount of the non-superconducting phase is sintering period independent, resulting in a superconductor with Tc of 100K. Changes in compositions of each phase also occur during sintering due to evaporation of bismuth and lead.