• Journal of the Korean Wood Science and Technology
• /
• v.40 no.6
• /
• pp.418-423
• /
• 2012

In order to develop the end use of cylindrical laminated veneer lumber (LVL) such as wooden crafts, the water proof-bonding strength, the resistance to abrasion and the surface hardness by painting the surface of LVL were investigated. The study results were as follows; The water proof-bonding strength through 5 cyclic test by boiling in water immersion and drying were favorable without delamination of glue line. Then the formulation of glue was resorcinol resin (100) to hardener of paraformaldehyde (5) by mixed weight percentage. The resistance to abrasion was relatively higher at cross section than tangential section. When tangential section of LVL was painted by UV protection oil, the resistance to abrasion was improved. In case of an cross section of LVL, the higher surface hardness appeared at larch core than radiata pine LVL. Also, in case of an tangential section of LVL, the higher surface hardness appeared at glue line than veneer side.

• Restorative Dentistry and Endodontics
• /
• v.23 no.1
• /
• pp.413-423
• /
• 1998

Dental ceramics exhibit excellent esthetic property, compressive strength, chemical durability, biocompatibility and translucency. This study evaluated the shear bond strength of composite resin to the new heat-pressed ceramic material (IPS-Empress System) depending on the surface treatments and bonding agents. The surface treatments were etching with 4.0% hydrofluoric acid, application of silane, and the combination of the two methods. Composite resin was bonded to ceramic with four kinds of dentin bonding agents(All-Bond 2, Heliobond, Scotch bond Multi-purpose and Tenure bonding agents). The ceramic specimen bonded with composite resin was mounted in the testing jig, and the universal testing machine(Zwick 020, Germany) was used to measure the shear bond strength with the cross head speed of 0.5 mm/min. The results obtained were as follows 1. The mean shear bond strength of the specimens of which the ceramic surface was treated with the combination of hydrofluoric acid and silane before bonding composite resin was significantly higher than those of the other surface treatment groups(p<0.05). 2. In the case of All-Bond 2 and Scotchbond Multi-purpose bonding agent group, the surface treatment methods did not influenced significantly on the shear bond(p>0.05). 3. Of the four bonding agents tested, the shear bond strength of Heliobond was significantly lower than those of other bonding agents regardless of the surface treatment methods(p<0.05). 4. The highest shear bond strength($12.55{\pm}1.92$ MPa) was obtained with Scotchbond Multipurpose preceded by the ceramic surface treatment with the combination of 4% hydrofluoric acid and silane.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.06a
• /
• pp.1140-1144
• /
• 2005

A plastic-based CE (capillary electrophoresis) microchip was fabricated by hot embossing process. A Si mold was made by wet etching process and a PMMA wafer was cut off from 1mm thick PMMA sheet. A micro-channel structure on PMMA substrate was produced by hot embossing process using the Si mold and the PMMA wafer. A vacuum assisted thermal bonding procedure was employed to seal an imprinted PMMA wafer and a blank PMMA wafer. The results of microscopic cross sectional images showed dimensions of channels were well preserved during thermal bonding process. In our procedure, the deformation amount of bonding process was below 1%. The entire fabrication process may be very useful for plastic based microchip systems.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2000.10a
• /
• pp.21-24
• /
• 2000

Ultra-fine grains were produced in pure Al using an Accumulative Rolling-Bonding (ARB) process. After several cycles of the ARB process, pure Al sheets were filled with the ultra-fine grains whose diameters were several hundred nano-meters. With ARB cycles, the nature of grain boundaries of the ultra-fine grains changed from diffusive sub-boundaries to well-defined high angle boundaries. After 7 cycles, ultra-fine polycrystals with large misorientations between neighboring grains were obtained. Sliding wear tests using a pin-on-disk type wear tester were co ducted on the ultra-fine grained pure Al. Wear rates of pure Al increased with the increase of ARB cycle numbers in spite of the increase in hardness. Worn surfaces and cross-sections were examined with optical microscopy (OM) and scanning electron microscopy (SEM) In investigate the wear mechanism of the ultra-fine grained pure Al.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2003.07a
• /
• pp.1005-1008
• /
• 2003

We report a new FCOG (flip chip on glass) technique using solder bumps for display packaging applications. The In and Sn solder bumps of 40 ${\mu}m$ pitches were formed on Si and glass substrate. The In and Sn bumps were bonded at 125 at the pressure of 3 mN/bump. The metallurgical bonding was confirmed using cross-sectional SEM. The contact resistance of the solder joint was 65 $m{\Omega}$ which was much lower than that of the joint made using the conventional ACF bonding technique. We demonstrate that the new COG technique using solder bump to bump direct bonding can be applied to advanced LCDs that lead to require higher quality, better resolution, and lower power consumption.

• The Journal of Korean Academy of Prosthodontics
• /
• v.47 no.2
• /
• pp.174-181
• /
• 2009

Statement of problem: There is a reduction of dentin bonding strength when the bonding procedure is carried out immediately after bleaching with peroxides. Purpose: The aim of this study is to evaluate a proper time interval for in-office bleaching technique using 35% hydrogen peroxide. Material and methods: Fifty extracted non-caries human third molars were used in this study. Buccal enamel of each tooth was removed and polished by 600 grits silicone carbide paper. They were randomly divided into five groups and bleached 35% hydrogen peroxide except control group. All groups were bonded with Single Bond/Z 350 after each time intervals ; Group-A: control, no bleaching treatment. Group-B: resin bonding immediately after bleaching. Group-C: resin bonding 1day after bleaching. Group-D: resin bonding 2 days after bleaching. Group-E: resin bonding 7days after bleaching. Shear bond strengths were measured with a cross-head speed of 1.0 mm/min using an Instron machine. The data of results were statistically analyzed by analysis of variance(ANOVA) and Tukey multiple comparison test.(P=.05) Results: There were significant decreases in mean shear strength in immediately bonding group after bleaching. The reduction of bond strengths was 78% compared with the group of no bleaching treatment. Group C showed the recovery of 51%, and Group D showed recovery of 63%. Both of them have no statistical difference with non-bleaching group. Group E showed no statistical difference with no bleaching treatment group. Conclusion: Dentin bonding strength is significantly reduced when bonding is performed immediately after bleaching for in-office bleaching regimens using 35% hydrogen peroxide, and increases as time goes by. One week of elapsed time between bleaching and resin bonding significantly increases bonding strengths for the in-office bleaching technique.

• Journal of the Semiconductor & Display Technology
• /
• v.4 no.3 s.12
• /
• pp.5-9
• /
• 2005

The bonding structure of organic materials such as fluorinated amorphous carbon films was classified into two types due to the chemical shifts. The electrical properties of fluorinated amorphous carbon films also showed very different effect of two types notwithstanding a very little difference. Fluorinated amorphous carbon films with the cross-link break-age structure existed large leakage current resulting from effect of the electron tunneling. Increasing the cation due to the electron-deficient group increased the barrier height of the films with the cross-link amorphous structure, therefore the electric characteristic of the final materials with low dielectric constant was also improved. The lowest dielectric constant is 2.3 at the sample with the cross-link amorphous structure.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.21 no.6
• /
• pp.544-551
• /
• 2008

We have studied the dielectric characteristics of low-k interlayer dielectric materials fabricated by PECVD for various precursor's flow rates. BTMSM precursor was introduced with the flow rates from 42 sccm to 60 sccm by 2 sccm step in the constant flow rate of 60 sccm $O_2$. The absorption intensities of Si-O-$CH_x$ bonding group and Si-$CH_x$ bonding group changed synchronously for the variation of precursor flow rate, but the intensity of Si-O-Si(C) responded asynchronously with the $CH_x$ combined bonds. The heat treatment reduced the FTIR absorption intensity of Si-O-$CH_x$ bonding group and Si-$CH_x$ bonding group but increased the intensity of Si-O-Si(C). The nanopore and free space formed by the increasement of caged link mode and cross link mode of Si-O-Si(C) group implied the origin of low-k SiOCH films.

• Textile Coloration and Finishing
• /
• v.11 no.1
• /
• pp.34-41
• /
• 1999

To examine the increase of paper strength by solvent-bonding using N-methylmorpholine N-oxide (NMMO), a paper was treated with aqueous solutions of NMMO, concentrated at $90^\circ{C}$ for selected periods of time, and pressed for 5 seconds followed by washing and drying. The effect of the increasing NMMO concentration on bonding state and some important properties of samples were mainly investigated. With increasing concentration of NMMO, the degree of bonding between fibers was increased, the fiber cross-sectional shape was changed from 'thin ribbonlike' to 'round rodlike' by swelling with solvent, and the longitudinal waves (crimp) were introduced to fibers, hence the shrinkage, weight per unit area, and thickness of paper were increased. Consequently, the tensile strength and elongation, under standard and wet conditions, and the stiffness were increased, and the water absorption was decreased generally with increasing concentration of NMMO. The moisture regain of treated samples was lower than that of the untreated sample, because of the reduction of space between fibers. But the moisture regain was increased a little with increasing concentration of NMMO due to the fiber swelling with NMMO followed by structural relaxation.

• ETRI Journal
• /
• v.38 no.6
• /
• pp.1163-1171
• /
• 2016

Integration technologies involving flexible substrates are receiving significant attention owing the appearance of new products regarding wearable and Internet of Things technologies. There has been a continuous demand from the industry for a reliable bonding method applicable to a low-temperature process and flexible substrates. Up to now, however, an anisotropic conductive film (ACF) has been predominantly used in applications involving flexible substrates; we therefore suggest low-temperature lead-free soldering and bonding processes as a possible alternative for flex-on-flex applications. Test vehicles were designed on polyimide flexible substrates (FPCBs) to measure the contact resistances. Solder bumping was carried out using a solder-on-pad process with Solder Bump Maker based on Sn58Bi for low-temperature applications. In addition, thermocompression bonding of FPCBs was successfully demonstrated within the temperature of $150^{\circ}C$ using a newly developed fluxing underfill material with fluxing and curing capabilities at low temperature. The same FPCBs were bonded using commercially available ACFs in order to compare the joint properties with those of a joint formed using solder and an underfill. Both of the interconnections formed with Sn58Bi and ACF were examined through a contact resistance measurement, an $85^{\circ}C$ and 85% reliability test, and an SEM cross-sectional analysis.