• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.331-338
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• 2005

The rapid advances in high power light sources and arrays as encountered in incandescent lamps have induced dramatic increases in die heat flux and power consumption at all levels of high power LED packaging. The lifetime of such devices and device arrays is determined by their temperature and thermal transients controlled by the powering and cooling, because they are usually operated under rough environmental conditions. The reliability of packaged electronics strongly depends on the die attach quality, because any void or a small delamination may cause instant temperature increase in the die, leading sooner or later to failure in the operation. Die attach materials have a key role in the thermal management of high power LED packages by providing the low thermal resistance between the heat generating LED chips and the heat dissipating heat slug. In this paper, thermal transient characteristics of die attach in high power LED package have been studied based on the thermal transient analysis using the evaluation of the structure function of the heat flow path. With high power LED packages fabricated by die attach materials such as Ag paste, solder paste and Au/Sn eutectic bonding, we have demonstrated characteristics such as cross-section analysis, shear test and visual inspection after shear test of die attach and how to detect die attach failures and to measure thermal resistance values of die attach in high power LED package. From the structure function oi the thermal transient characteristics, we could know the result that die attach quality of Au/Sn eutectic bonding presented the thermal resistance of about 3.5K/W. It was much better than those of Ag paste and solder paste presented the thermal resistance of about 11.5${\~}$14.2K/W and 4.4${\~}$4.6K/W, respectively.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.5
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• pp.483-487
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• 2014

In this study, joining methods with SiC powder as the joining adhesives were studied in order to avoid the residual stresses coming from CTE (Coefficient of Thermal Expansion) mismatch between substrate and joining layer. The shear strength and microstructure of joined material between SiC substrates are investigated. The commercial Hexoloy-SA (Saint-Gobain Ceramics, USA) used in this work as substrate material. The fine ${\beta}$-SiC nano-powder which the average particle size is below 30 nm, $Al_2O_3$, $Y_2O_3$, and $SiO_2$ were used as joining adhesives. The specimens were joined with 20MPa and $1400-1900^{\circ}C$ by hot pressing in argon atmosphere. The shear test was performed to investigate the bonding strength. The cross-section of the joint was characterized by using an optical microscope and scanning electron microscopy (SEM).

• Restorative Dentistry and Endodontics
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• v.17 no.2
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• pp.383-397
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• 1992

The purpose of this study was to evaluate the influence of artificial saliva contamination on bonding of several dentin adhesives to dentin. Sixty - three human molar teeth extracted within a month were used. Each tooth was sectioned longitudinally in a buccolingual direction to obtain 126 specimens. These specimens were randomly divided into three groups and were treated by Scotchbond 2, Gluma and All bond. Each group was subdivided into three subgroups; normal group not contaminated with artificial saliva, contaminated with artificial saliva and dried group, and contaminated with artificial saliva and washed and dried group. Enamel/dentin bonding agent(Dental Adhesive of Scotchbond 2) was applied and light cured on the treated dentin surfaces. Thereafter P - 50 were cured on them, and specimens were stored in $37^{\circ}C$ artificial saliva for 24 hours before measuring shear bond strength. Shear bond strengths were determined using an universal testing machine with cross head speed 1mm/min and SEM examinations were conducted to evaluate the resin - dentin interface and degree of penetrating resin string into the dentinal tubules. The following results were obtained. 1. Normal groups not contaminated with artificial saliva showed greater shear bond strength than any other group contaminated with artificial saliva(P<0.01). 2. The shear bond strengths showed no significant difference between washed groups with distilled water and not washed groups after contamination with artificial saliva(P>0.05). 3. In normal groups, the shear bond strength of A group was significantly greater than in any other group(P<0.01). 4. In Sand G groups, fractures after shear bond strength tests occured adhesively on resintooth interface in all specimens. But in A groups, fracture of the normal group occured cohesively in dentin and fracture of the contaminated groups occured adhesively and cohesively. 5. On SEM examination, the number of resin strings penetrated into dentinal tubules were the greatest in normal groups, followed by, in descending order, washed groups and not washed groups after contamination with artificial saliva.

• Archives of Pharmacal Research
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• v.25 no.1
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• pp.11-24
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• 2002

The antitumor antibiotic (+)-CC-1065 can alkylate N3 of guanine in certain sequences. A previous high-field $^1H$ NMR study on the$(+)-CC-1065d[GCGCAATTG*CGC]_2$ adduct ($^*$ indicates the drug alkylation site) showed that drag modification on N3 of guanine results in protonation of the cross-strand cytosine [Park, H-J.; Hurley, L. H. J. Am. Chem. Soc.1997, 119,629]. In this contribution we describe a further analysis of the NMR data sets together with restrained molecular dynamics. This study provides not only a solution structure of the (+)-CC-1065(N3- guanine) DNA duplex adduct but also new insight into the molecular basis for the sequence- specific interaction between (+)-CC-1065 and N3-guanine in the DNA duplex. On the basis of NOESY data, we propose that the narrow minor groove at the 7T8T step and conformational kinks at the junctions of 16C17A and 18A19T are both related to DNA bending in the drugDNA adduct. Analysis of the one-dimensional $^1H$ NMR (in $H_2O$) data and rMD trajectories strongly suggests that hydrogen bonding linkages between the 8-OH group of the (+)-CC-1065 A-sub-unit and the 9G10C phosphate via a water molecule are present. All the phenomena observed here in the (+)-CC-1065(N3-guanine) adduct at 5'$-AATTG^*$are reminiscent of those obtained from the studies on the (+)-CC-1065(N3-adenine) adduct at $5'-AGTTA^*$, suggesting that (+)-CC-1065 takes advantage of the conformational flexibility of the 5'-TPu step to entrap the bent structure required for the covalent bonding reaction. This study reveals a common molecular basis for (+)-CC-1065 alkylation at both $5'-TTG^*$ and $5'-TTA^*$, which involves a trapping out of sequence-dependent DNA conformational flexibility as well as sequence-dependent general acid and general base catalysis by duplex DNA.

• Restorative Dentistry and Endodontics
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• v.7 no.1
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• pp.77-83
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• 1981

The purpose of this study was to observe the bonding strength between tooth surface (enamel and dentin) and restorative filling materials which are two composite resins (Clearfil and Concise) and Glass ionomer cement, after etching with 50% phoshoric acid and 37% citric acid. To measure the bonding strength in enamel, the labial surface of upper anterior tooth was cut flatly with using carborundum disk and polished with sand paper disk, and to measure in dentin, the dentin surface was prepared by grinding upper part of posterior tooth horizontally. After washing the tooth surface with water and drying with air blast, the prepared tooth surface was etched. In glass ionomer cement, 50% phosphoric acid and 37% citric acid were used, in Clearfil 40% phosphoric acid was used and in Concise, 50% phosphoric acid and 37% citric acid were used as etchant for 1 minute. After the copper band which is 5 mm in diameter and 5 mm in height was fixed on the prepared surface and each filling material was inserted into the copper band, the hooking loop was inserted into filled material in the copper band before setting to make it easily that the load is applied on the specimen. After all specimens were immersed in water at $37^{\circ}C$ for 1 week, this specimen was placed on the load cell of tensile test apparatus, and specimen was pulled at the cross-head speed of 0.8 mm per minute. The following results were obtained 1) In glass ionomer cement, the bond strength obtained by 37% citric acid was higher than one obtained by 50% phosphoric acid in enamel and dentin surfaces. The bond strength obtained in non-etched surface was much less than one by etchants in enamel and dentin surface. 2) In Clearfil, the bond strength obtained by 40% phosphoric acid was 4 times more than one obtained by non etch ant. 3) In Concise, the bond strength obtained by 50% phosphoric acid was almost same as one obtained by 37% citric acid, and the bond strength obtained by non etch ant was much less than one obtained by etchants.

• Restorative Dentistry and Endodontics
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• v.36 no.5
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• pp.385-396
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• 2011

Objectives: This study evaluated the effects of adhesion variables such as the priming concepts of canal wall and the curing modes of adhesives on the sealing ability of a resin-based root canal filling system. Materials and Methods: Apical microleakage of the Resilon-RealSeal systems filled with 3 different combinations of adhesion variables was compared with the conventional gutta-percha filling using a dye penetration method. Experimental groups were SEDC, Resilon (Resilon Research LLC) filling with self-etch RealSeal (SybronEndo) primer and dual-cure RealSeal sealer; NELC, Resilon filling with no etching, Scotchbond Multi-Purpose (3M ESPE) primer application and light-curing adhesive; and TELC, Resilon filling with Scotchbond Multi-Purpose primer and adhesive used under total etch / wet bonding and lightcure protocols. GPCS, gutta-percha filling with conventional AH26 plus sealer, was the control group. Results: The median longitudinal dye penetration length of TELC was significantly shorter than those of GPCS and SEDC (Kruskal-Wallis test, p < 0.05). In the cross-sectional microleakage scores, TELC showed significant differences from other groups at 2 to 5 mm from the apical foramen (Kruskal-Wallis test, p < 0.05). Conclusions: When a resin-based root canal filling material was used, compared to the self-etching primer and the dual-cure sealer, the total etch/wet-bonding with primer and light-curing of adhesive showed improved apical sealing and was highly recommended.

• Korean journal of food and cookery science
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• v.18 no.4
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• pp.381-389
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• 2002

The purpose of this study was to select an ingredient acting as a natural emulsifier to retard the retrogradation of rice cake by the measurement of mechanical characteristics of the cakes. For the purpose, Backsulgi, the most basic type of rice cake, was prepared by adding various ingredients having high contents of lecithin such as raw soybean powder, parched soybean powder, soybean oil, egg yolk powder, and the measurements and observations on the chromaticity, swelling power, pore ratio and cross-section were made. In addition, changes in the textural characteristics of Backsulgi samples were determined while storing them at the temperatures of 4$^{\circ}C$ and 20$^{\circ}C$ for 0, 1, 2 and 3 days. The results of the study were as follows: 1. In terms of chromaticity, the Backsulgi samples added with egg yolk powder, raw soybean flour and parched soybean flour were higher in yellowness(b) than the controls. 2. Both swelling power and pore ratio of Backsulgies added with raw soybean flour were higher than those of controls. 3. A cross-sectional observation using an electron microscope indicated that rice flour particles of controls had uneven pores and were conglomerated in a large lump while Backsulgi samples of raw soybean flour or roasted soybean flour had large and even pores and showed loosened bonding to be transformed into a sponge shape. 4. In hardness, Backsulgi samples added with raw soybean flour had less changes in hardness than that of controls, indicating that the effect of retarding retrogradation was higher when the storage time got longer.

• Proceedings of the KSME Conference
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• 2001.11a
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• pp.204-209
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• 2001

In this research, the effects of fiber stacking sequence on damage behaviors of FML(Fiber Metal Laminates) subject to indentation loading. SOP (Singly Oriented Ply) FML and angle ply FML were fabricated to study fiber orientation effects and angle ply effects. FML were fabricated by using 1050 aluminum laminate and carbon/epoxy prepreg. To increase adhesive bonding strength, Al laminate was etched using FPL methods. The static indentation test were conducted by using UTM(5ton, Shimadzu) under the 2side clamped conditions. During the tests, load and displacement curve and crack initiation and propagation behaviors were investigated. As fiber orientation angle increases, the crack initiation load of SOP FML increases because the stiffness induced by fiber orientation is increased. The penetration load of SOP FML is influenced by the deformation tendency and boundary conditions. However, the macro-crack of angle ply FML was initiated by fiber breakage of lower ply because angle plies in Angle ply FML prevents the crack growth and consolidation. The Angle ply FML has a critical cross-angle which prevent crack growth and consolidation. Damage behavior of Angle ply FML is changed around the critical cross-angle.

• The Transactions of the Korean Institute of Electrical Engineers A
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• v.51 no.10
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• pp.510-517
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• 2002

The use of underground transmission cables has continuously increased in densely inhabited urban and suburban area. Due to a increasing demand of underground cables, two or more circuits are installed in parallel for several kilometers. It, however, has not been realized that the sheath circulating current is generated in the system where a large number of cables are laid in the same route. In this paper, sheath circulating current is analyzed by the EMTP and compared with the measured values. Unbalance arrangement of cables or cross-bonding length causes a significant effect on the magnitude of the sheath current. Sheath circulating current could be greatly reduced by the symmetrical configuration of cables and installation of the impedance reduction system. Especially, with the impedance system of 1Ω installed, the sheath circulating current is reduced by 85.7%.

• Design & Manufacturing
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• v.13 no.4
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• pp.17-22
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• 2019

Currently, studies on weight reduction and fuel efficiency increase are the most important topics in the automotive industry and many studies are under way. Among them, weight reduction is the best way to raise fuel efficiency and solve environmental pollution and resource depletion. Materials such as aluminum, magnesium and carbon curing materials can be found in lightweight materials. Among these, research on improvement of bonding technology and manufacturing method of materials and improvement of material properties through study of ultrahigh strength steel sheet is expected to be the biggest part of material weight reduction. As the strength of the ultra hight strength steel sheet increases during forming, it is difficult to obtain the dimensional accuracy as the elastic restoring force increases compared to the hardness or high strength steel sheet. It is known that the spring back phenomenon is affected by various factors depending on the raw material and processing process. We have conducted analytical evaluations and studies to analyze the springback that occurs according to the cross-sectional shape of the ultra high tensile steel sheet.