• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.23 no.7 s.166
• /
• pp.1120-1128
• /
• 1999

An elastic-viscoplastic finite element analysis is performed to investigate detailed growth behavior of creep cracks and the numerical results are compared with experimental results. In Cr-Mo steel stress fields obtained from the crack growth method by mesh translation were compared with both cases that the secondary creep rate is only used as creep material property and the primary creep rate is included. Analytical stress fields, Riedel-Rice(RR) field, Hart-Hui-Riedel(HR) field and Prime(named in here) field, and the results obtained by numerical method were evaluated in details. Time vs. stress at crack tip was showed and crack tip stress fields were plotted. These results were compared with analytical stress fields. There is no difference of stress distribution at remote region between the case of 1st creep rate+2nd creep rate and the case of 2nd creep rate only. In case of slow velocity of crack growth, the effect of 1st creep rate is larger than the one of fast crack growth rate. Stress fields at crack tip region we, in order, Prime field, HR field and RR field from crack tip.

• Journal of the Korean Society for Precision Engineering
• /
• v.18 no.5
• /
• pp.105-111
• /
• 2001

The creep crack growth properties in 3.3NiCrMoV steel were investigated at 55$0^{\circ}C$ by using CT specimen under constant load and constant Ct condition that was held during crack growth of Imm distance. Ct lelied on load line displacement rate, C＊usually increased with crack length though load is reduced in order to maintain constant Ct value as crack growth and appeared scatter band. At constant load and Ct region, crack growth slope was 0.900 and 0.844 each, on the other hand C＊ slope was 0.480. Fully coalesced area(FCA) ahead of crack tip increased as Ct increase to the critical value, and after that value FCA decreased. For the tertiary creep stage of crack growth test, the most of displacement was due to the steady state creep, except only small part due to the primary creep and other effects. Therefore, tests were mainly interrupted in the tertiary stage to obtain high value of Ct.

• Proceedings of the KSME Conference
• /
• 2001.06a
• /
• pp.501-506
• /
• 2001

The creep crack growth properties in 3.5NiCrMoV steel were investigated at $550^{\circ}C$ by using CT specimen under constant $C_t$ condition that was held during crack growth of 1mm distance. $C_t$ lely on load line displacement rate and $C^*$ usually increase with crack length though load is reduced in order to maintain constant $C_t$ value as crack growth. Fully coalesced area(FCA) ahead of crack tip tend to increase as $C_t$ increase to the critical value, and after that value FCA decrease. For the tertiary creep stage of crack growth test, the most of displacement is due to the steady state creep, except only small part due to the primary creep and other effects. Therefore, tests were mainly interrupted in the tertiary stage to obtain high value of $C_t$. At constant load and $C_t$ region, crack growth slope was 0.900 and 0.844 each, on the other hand $C^*$ slope was 0.480.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.20 no.4
• /
• pp.1177-1185
• /
• 1996

The crack growth under creep condition is one of the major damage mechanisms which determines remaining life of the component operating at high temperatures. In this paper, the creep crack growth by grain boundary cavitation is studied, which is frequently observed failure mechanism for creep brittle materials. As a result of diffusive growth of creep cavities, it is shown that the crack-tip stress field is modified from the original stress distribution by the amount of singularity attenuation parameter which is function of crack growth rate and material properties. Also, the stress relaxation at crack-tip results in the extension of cavitating area by the load dump effect to meet the macroscopic force equilibrium conditdion.

• Journal of Advanced Marine Engineering and Technology
• /
• v.22 no.4
• /
• pp.490-497
• /
• 1998

An elast-biscoplastic finite element analysis is performed to investigate detailed growth behavior of creep cracks and the numerical results are compared with experimental results. The results of mesh translation method are compared with those of node release method. Load line displancement curve obtained from the crack growth analysis by mesh translation shows the improved results than that obtained from the crack growth by node release method when the secondary creep rate is only used as creep material property. The results of accounting for primary creep rate and instantaneous plasticity shows a good agreement with the experimental result.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.30 no.10 s.253
• /
• pp.1219-1226
• /
• 2006

The ASTM test standard recommends the use of the compact tension specimen for creep crack growth rates measurement. In the creep crack growth rate test, the displacement rate due to creep is obtained by subtracting the contribution of elastic and plastic components from the total load line displacement rate based on displacement partitioning method fur determining $C^*-integral$, which involves Ramberg-Osgood (R-O) fitting procedures. This paper investigates the effect of the R-O fitting procedures on plastic displacement rate estimates in creep crack growth testing, via detailed two-dimensional and three-dimensional finite element analyses of the standard compact tension specimen. Four different R-O fitting procedures are considered; (i) fitting the entire true stress-strain data up to the ultimate tensile strength, (ii) fitting the true stress-strain data from 0.1% strain to 0.8 of the true ultimate strain, (iii) fitting the true stress-strain data only up to 5% strain, and (iv) fitting the engineering stress-strain data. It is found that the last two procedures provide reasonably accurate plastic displacement rates and thus should be recommended in creep crack growth testing. Moreover, several advantages of fitting the engineering stress-strain data over fitting the true stress-strain data only up to 5% strain are discussed.

• Proceedings of the KSME Conference
• /
• 2001.06a
• /
• pp.495-500
• /
• 2001

The significant creep in copper takes place at relatively low temperature and applied stress. Thus the study on modeling of creep behavior using the copper should provide researchers with benefits such as time for the test. In this study, a test of creep crack growth regarding copper was performed at 400 and $500^{\circ}C$, and analyzed. As result, the crack growth rate at $500^{\circ}C$ turned out to be 10 times higher than that at $400^{\circ}C$ in terms of $C^*$, while the crack growth rate at $500^{\circ}C$ was several hundreds times higher than that at $400^{\circ}C$ in terms of K. Moreover, a linear relationship between the crack growth rate and $C^*$ at the same temperature was established.

• Journal of Welding and Joining
• /
• v.19 no.3
• /
• pp.278-284
• /
• 2001

Both creep deformation and creep crack growth experiments have been conducted on 2.25Cr-1Mo steel weldment in order to provided an information on residual life prediction of structural component weldment containing a crack. The stress exponent of creep deformation equation for the base metal and weldment at 823k were found to be 10.2 and 7.3, respectively. These two values could be assumed that dislocation climb processes are controlling the creep deformation of both materials. The creep rate of the weldment was very low, compared with that of base metal under the same applied stress. Whereas the creep crack growth rate of the weldment was almost twice higher than that of base metal under the fixed value of $C^*$. This may indicate that the weldment is stronger than the base metal in view of creep deformation and is brittle during creep crack growth due to the intrinsic microstructure of banite and relatively higher and Mn contents.

• Transactions of the Korean Society of Automotive Engineers
• /
• v.10 no.4
• /
• pp.136-140
• /
• 2002

High temperature fatigue crack growth behavior of P92 and STS 316L steel were investigated under four load conditions using CT type specimens. Loading and unloading times for the low wave forms were combinations of 1 sec. and 50 sec., which were two symmetric wave forms and two unsymmetric wave forms. Their behaviors are characterized using ΔK parameter. In STS 316L, Crack growth rate generally increases as frequency decreases. However, sensitivity of the loading rate to crack growth rate was fecund to be far greater than that of the unloading time. It is because as loading time increases, creep occurs at crack tip causing the crack growth rate to increase. However creep does not occur at the crack tip even if the unloading time is increased. In P92 steel, crack growth rate showed same behavior as in STS 316L. But the increase in loading or unloading time made almost no difference in crack growth rate, suggesting that no significant creep occurs in P92 steel even though loading time increases. After conducting high temperature tensile tests and comparing high temperature fatigue crack growth rates under various wave forms, it was proved that P92 steel has not only good high temperature properties but also improved, better high temperature fatigue properties than STS 316L.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.18 no.7
• /
• pp.1722-1729
• /
• 1994

At early stage of creep-fatigue crack growth tests, initial transient behavior which implies high crack growth rate has been generally observed by some researchers. Since the influence of the initial transient crack growth behavior on the remaining life of components is significant, cause of it should be further studied. In this study, characteristics of the initial transient behavior of 1Cr-1Mo-0.25V steel is studied experimentally by performing creep-fatigue crack growth tests at $538^{\circ}C$ in air under trapezoidal waveshapes. It is verified that the cause of the initial transient behavior is not high ${(C_t)}_{avg}$ values due to the small scale creep condition at the early stage of test, but oxidation-dominated crack growth mechanism during the transient period which is different from the creep-dominated crack growth mechanism in steady crack growth period.