Characteristics of Creep Crack Growth in Pure Copper at Elevated Temperature

순동의 고온에서의 크리프 균열성장 특성

The significant creep in copper takes place at relatively low temperature and applied stress. Thus the study on modeling of creep behavior using the copper should provide researchers with benefits such as time for the test. In this study, a test of creep crack growth regarding copper was performed at 400 and $500^{\circ}C$, and analyzed. As result, the crack growth rate at $500^{\circ}C$ turned out to be 10 times higher than that at $400^{\circ}C$ in terms of $C^*$, while the crack growth rate at $500^{\circ}C$ was several hundreds times higher than that at $400^{\circ}C$ in terms of K. Moreover, a linear relationship between the crack growth rate and $C^*$ at the same temperature was established.