• Nuclear Engineering and Technology
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• 제46권3호
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• pp.423-430
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• 2014

An in-pile performance test of HANA claddings was conducted at up to 67 GWD/MTU in the Halden research reactor in Norway over a 6.5 year period. Four types of HANA claddings (HANA-3, HANA-4, HANA-5, and HANA-6) and a reference Zircaloy-4 cladding were used for the in-pile test. The evaluation parameters of the HANA claddings were the corrosion behavior, dimensional changes, hydrogen uptake, and tensile strength after the claddings were tested under the simulated operation conditions of a Korean commercial reactor. The oxide thickness ranged from 15 to 37 mm at a high flux region in the test rods, and all HANA claddings showed corrosion resistance superior to the Zircaloy-4 cladding. The creep-down rate of all HANA claddings was lower than that of the Zircaloy-4 cladding. In addition, the hydrogen content of the HANA claddings ranged from 54 to 96 wppm at the high heat flux region of the test rods, whereas the hydrogen content of the Zircaloy-4 cladding was 119 wppm. The tensile strength of the HANA and Zircaloy-4 claddings was similarly increased when compared to the un-irradiated claddings owing to the radiation-induced hardening.

• 대한토목학회논문집
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• 제10권2호
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• pp.49-58
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• 1990

캔틸레버 시공법에 의해 가설되는 프리스트레스트 콘크리트 교량의 시간 단계별 장기 처짐을 정확하게 해석하지 위해 프리스트레스트 콘크리트의 시간 의존적 재료 특성과 캔틸레버 공법에 있어서의 분할시공 과정을 고려할 수 있는 해석 모델을 개발하고, 이에 기초하여 콤퓨터 프로그램을 작성하였다. 본 프로그램에서는 시간의 경과에 따른 콘크리트의 크리프, 건조 수축 및 탄성 계수의 변화 그리고 PS 강재의 리락세이션을 고려한다. 그리고 시공 단계별 세그먼트의 발생, 다단계 프리스트레싱 그리고 지점조건의 변화를 고려한다. 또한 철근으로 인한 단면의 강성 증가를 고려하고 전단변형의 영향을 고려하여 보다 정확하게 해석할 수 있도록 하였다. 본 프로그램을 이용하여 다경간 PS 콘크리트 교량을 해석함으로써, 프로그램의 실제 적용성과 캔틸레버공법에 의한 교량의 거동 특성을 규명하고자 하였다.

• 대한기계학회논문집A
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• 제27권10호
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• pp.1676-1685
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• 2003

Tensile and low cycle fatigue tests on prior cold worked 3l6L stainless steel were carried out at various temperatures ftom room temperature to 650$^{\circ}C$. Fatigue resistance was decreased with increasing temperature and decreasing strain rate. Cyclic plastic deformation, creep, oxidation and interactions with each other are thought to be responsible for the reduction in fatigue resistance. Currently favored life prediction models were examined and it was found that it is important to select a proper life prediction parameter since stress-strain relation strongly depends on temperature. A phenomenological life prediction model was proposed to account for the influence of temperature on fatigue life and assessed by comparing with experimental result. LCF failure mechanism was investigated by observing fracture surfaces of LCF failed specimens with SEM.

• Composites Research
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• 제13권5호
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• pp.18-30
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• 2000

일축방향 섬유강화 복합재료 C링의 최적설계를 위하여, 이의 점 하중 하에서의 점탄성적 하중완화거동을 해석하였다. 이를 위하여 곡선보의 굽힘 이론을 이용하여 탄성학적 처짐과 굽힘 강성의 해석을 수행한 후 상당원리(correspondence theorem)를 이용하여 점탄성학적 하중완화 거동을 해석하였다. 일축방향 섬유강화 복합재료의 직교이방성 뿐만 아니라 복합재료의 인장강성과 압축강성의 차이에서 기인하는 비대칭물성도 함께 고려하였다. 그 결과 C링의 단면의 두께가 반지름에 비해 충분히 작은 보라면 보이론만으로도 정확하게 곡선보를 해석할 수 있고 하중완화 이론값 또한 실험값과 잘 일치하고 있음을 알 수 있었다.

• 한국주조공학회지
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• 제18권4호
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• pp.364-372
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• 1998

Effects of Si and Ca additions on the mechanical properties of AM60 based Mg alloys have been investigated. Hardness of the AM60 based Mg alloys reached a maximum value after aging for approximately 33 hours but the amount of hardness increase was negligible. The poor age hardening response of the alloys was due to low Al content, which implies that Al content must be >6 wt.% to observe age hardening effect. The tensile and yield strength increased with increasing Al, Si, and Ca content but elongation decreased with increasing Al and Si content. The best mechanical properties obtained in AM 40-2.5Si-0.2Ca alloy after T4 heat treatment were as follows; tensile strength 193.4 MPa, yield strength 79.2 MPa, and elongation 11.2%. High temperature property obtained from creep test was also improved by introducing $Mg_2Si$ which has high hardness, high melting temperature and low thermal expansion coefficient.

• Korea-Australia Rheology Journal
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• 제20권3호
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• pp.165-173
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• 2008

Multiple particle tracking microrheology is used to characterize the viscoelastic properties of biomaterial and synthetic polymer gels near the liquid-solid transition. Probe particles are dispersed in the gel precursors, and their dynamics are measured as a function of the extent of reaction during gel formation. We interpret the dynamics using the generalized Stokes-Einstein relationship (GSER), using a form of the GSER that emphasizes the relationship between the probe particle mean-squared displacement and the material creep compliance. We show that long-standing concepts in gel bulk rheology are applicable to microrheological data, including time-cure superposition to identify the gel point and critical scaling exponents, and the power-law behavior of incipient network's viscoelastic response. These experiments provide valuable insight into the rheology, structure, and kinetics of gelling materials, and are especially powerful for studying the weak incipient networks of dilute gelators, as well as scarce materials, due to the small sample size requirements and rapid data acquisition.

• Design & Manufacturing
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• 제12권1호
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• pp.1-6
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• 2018

In this study, we calculated the redistribution of vacancy concentration in metal specimens induced by stress-induced diffusion at a high temperature. To deduce the governing equation, we associated the unit volume change equation of strains with a differential equation of vacancy concentration as a function of stress using the stress-strain relationship. In this governing equation, we considered stress as the only chemical potential parameter to stay in the scope of this study, which provided the vacancy concentration equation as of stress gradient in metals. The equation was then mathematically delineated to derive a analytical solution for a transient, one-dimensional diffusion case. With the help of Korhonen's approximation and the boundary conditions, we successfully deduced a general solution from the governing equation. To visualize the feasibility of our solutions, we applied the solution to two different stress-induced cases - a rod with fixed concentrated stresses at both ends and a rod with varying concentrated stresses at both ends. Although it is necessary to legitimatized the model in the future for improvement, our results showed that the model can be used to interpret the location of structural defects, the formation of vacancy, and furthermore the high temperature behavior of metals.

• 한국원자력학회:학술대회논문집
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• 한국원자력학회 2002년도 춘계공동학술발표회요약집
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• pp.242-242
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• 2002

Two MIMAS MaX fuel rods base-irradiated in a commercial PWR have been reinstrumented and irradiated at a test reactor. The fabrication data for two MOX roda are characterized together with base irradiation information. Both Rods were reinstrumented to be fitted with thermocouple to measure centerline temperature of fuel. One rod was equipped with pressure transducer for rod internal pressure whereas the other with cladding elongation detector. The post irradiation examinations for various items were performed to determine fuel and cladding in-pile behavior after base irradiation. By using well characterized fabrication and re-instrumentation data and power history, the fuel performance code, COSMOS, is verified with measured in-pile and PIE information. The COMaS code shows good agreement for the cladding oxidation and creep, and fission gas release when compared with PIE dad a after base irradiaton. Based on the re-instrumention information and power history measured in-pile, the COSMOS predicts re-instrumented in-pile thermal behaviour during power up-ramp and steady operation with acceptable accuracy. The rod internal pressure is also well simulated by COSMOS code. Therfore, with all the other verification by COSMOS code up to now, it can be concluded that COSMOS fuel performance code is applicable for the design and license for MaX fuel rods up to high burnup.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.